2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)最新文献

Vibration combined high Temperature Cycle Tests for capacitive MEMS accelerometers 电容式MEMS加速度计的振动组合高温循环试验

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-12-01 DOI: 10.1109/THERMINIC.2007.4451781

Z. Szűcs, G. Nagy, S. Hodossy, M. Rencz, A. Poppe

引用次数: 10

New reliability assessment method for solder joints in BGA package by considering the interaction between design factors 考虑设计因素交互作用的BGA封装焊点可靠性评估新方法

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-12-01 DOI: 10.1109/THERMINIC.2007.4451741

S. Kondo, Qiang Yu, T. Shibutani, M. Shiratori

{"title":"New reliability assessment method for solder joints in BGA package by considering the interaction between design factors","authors":"S. Kondo, Qiang Yu, T. Shibutani, M. Shiratori","doi":"10.1109/THERMINIC.2007.4451741","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451741","url":null,"abstract":"As the integration and the miniaturization of electronics devices, design space become narrower and interactions between design factors affect their reliability. This paper presents a methodology of quantifying the interaction of each design factor in electronics devices. Thermal fatigue reliability of BGA assembly was assessed with the consideration of the interaction between design factors. Sensitivity analysis shows the influence of each design factor to inelastic strain range of a solder joint characterizing the thermal fatigue life if no interaction occurs. However, there is the interaction in BGA assembly since inelastic strain range depends on not only a mismatch in CTE but also a warpage of components. Clustering can help engineers to clarify the relation between design factors. The variation in the influence was taken to quantify the interaction of each design factor. Based on the interaction, simple evaluating approach of inelastic strain range for the BGA assembly was also developed. BGA package was simplified into a homogeneous component and equivalent CTE was calculated from the warpage of BGA and PCB. The estimated equation was derived by using the response surface method as a function of design factors. Based upon these analytical results, design engineers can rate each factor's effect on reliability and assess the reliability of their basic design plan at the concept design stage.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129156409","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Evaluation technique for the failure life scatter of lead-free solder joints in electronic device 电子器件无铅焊点失效寿命散射评价技术

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-12-01 DOI: 10.1109/THERMINIC.2007.4451742

H. Miyauchi, Qiang Yu, T. Shibutani, M. Shiratori

{"title":"Evaluation technique for the failure life scatter of lead-free solder joints in electronic device","authors":"H. Miyauchi, Qiang Yu, T. Shibutani, M. Shiratori","doi":"10.1109/THERMINIC.2007.4451742","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451742","url":null,"abstract":"Recently, the electronic device equipments using a lot of semiconductors are widespread to all industrial fields. Solder joints are used to mount the electronic chips, such as ceramic resistors and capacitors, on the printed-circuit boards in almost all electronic devices. However, since in many cases the thermal expansion coefficients of electronic parts and PCBs have mismatch, cyclic thermal stress and strain causes solder fatigue. Especially in the power electronic module and car electric module, the evaluation of thermal fatigue life for the chip components is important. It is understood that the fatigue lives of some electronic devices show big scatter in the thermal cycle test, even if their design is the same. The dispersion of main design factors of solder joints is thought as one of these reasons. Moreover, the influence of the dispersion grows when the lead-free solder materials are used in the devices. Therefore, it cannot be bypassed as the main issue for the reliability evaluation in the solder joints. In this study, how the dispersion of design factors and the interacting effect between the design factors influences the failure life in lead-free solder joint was investigated by the analytical approach. Sensitivity analyses were carried out to study the main effect of the dispersion of each factor on solder joints. And then, the interacting effect between the factors on the reliability was studied by considering the structural asymmetry due to the unbalanced solder joints. As a result, a practical evaluating technique for the failure life scatter of solder joints was proposed.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114995736","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading 热载荷和机械载荷下封装微型贴片陶瓷电容器的无损失效分析与建模

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451756

B. Wunderle, T. Braun, D. May, A. mazloum, M. Bouazza, H. Walter, O. Wittier, R. Schacht, K. Becker, M. Schneider-Ramelow, B. Michel, H. Reichl

引用次数: 8

Fully integrated one phase liquid cooling system for organic boards 有机板全集成单相液体冷却系统

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451768

D. May, Bernhard Wunderle, Florian Schindler-Saefkow, B. Nguyen, R. Schacht, Bruno Michel, Herbert Reichl

引用次数: 0

Investigation of micro porosity sintered wick in vapor chamber for fan less design 无风机设计中蒸汽室微孔烧结芯的研究

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451753

C. Yu, W. Wei, S.W. Kang

{"title":"Investigation of micro porosity sintered wick in vapor chamber for fan less design","authors":"C. Yu, W. Wei, S.W. Kang","doi":"10.1109/THERMINIC.2007.4451753","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451753","url":null,"abstract":"Micro Porosity Sintered wick is made from metal injection molding processes, which provides a wick density with micro scale. It can keep more than 53% working fluid inside the wick structure, and presents good pumping ability on working fluid transmission by fine infiltrated effect. Capillary pumping ability is the important factor in heat pipe design, and those general applications on wick structure are manufactured with groove type or screen type. Gravity affects capillary of these two types more than a sintered wick structure does, and mass heat transfer through vaporized working fluid determines the thermal performance of a vapor chamber. First of all, high density of porous wick supports high transmission ability of working fluid. The wick porosity is sintered in micro scale, which limits the bubble size while working fluid vaporizing on vapor section. Maximum heat transfer capacity increases dramatically as thermal resistance of wick decreases. This study on permeability design of wick structure is 0.5-0.7, especially permeability (R)=0.5 can have the best performance, and its heat conductivity is 20 times to a heat pipe with diameter (Phi)=10 mm. Test data of this vapor chamber shows thermal performance increases over 33 %.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125559738","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

A new methodology for extraction of dynamic compact thermal models 一种新的动态致密热模型提取方法

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451766

W. Habra, P. Tounsi, F. Madrid, P. Dupuy, C. Barbot, J. Dorkel

引用次数: 4

A novel VLSI technology to manufacture high-density thermoelectric cooling devices 一种制造高密度热电冷却装置的VLSI新技术

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451749

H. Chen, L. Hsu, Xiaojin Wei

引用次数: 4

Development of a prototype thermal management solution for 3-D stacked chip electronics by interleaved solid spreaders and synthetic jets 基于交错固体扩散器和合成射流的3-D堆叠芯片电子器件热管理原型解决方案的开发

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451769

D. Gerty, David W. Gerlach, Yogendra Joshi, Ari Glezer

{"title":"Development of a prototype thermal management solution for 3-D stacked chip electronics by interleaved solid spreaders and synthetic jets","authors":"D. Gerty, David W. Gerlach, Yogendra Joshi, Ari Glezer","doi":"10.1109/THERMINIC.2007.4451769","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451769","url":null,"abstract":"A design for cooling 3D stacked chip electronics is proposed using solid heat spreaders of high thermal conductivity interleaved between the chip layers. The spreaders conduct heat to the base of an advanced synthetic jet cooled heat sink. A prior computational study showed that for moderate power dissipations, 5 W in each 27times38 mm layer, a 250 mum thick copper heat spreader would conduct heat adequately. However, the mismatch in coefficient of thermal expansion between copper and silicon required large holes through the copper layer for electrical vias. The current study investigates the design of a thermal prototype for experimental testing. Each active layer will incorporate a thermal test die to simulate an FPGA and a smaller one to simulate a DRAM. The spreader layer will be silicon with no via holes. The heat sink will contact only three of the stack sides to allow wirebond connections on the fourth side. The effect of the power dissipated and the heat transfer coefficient applied to the peripheral surface are studied. In order to remove the heat from the edges of a multi-layer stack and transfer it to the ambient air, a novel active heat sink design has been implemented using a matrix of integrated synthetic jets. In previous synthetic jet heat sink designs, cooling air is entrained upstream of the heat sink and is driven along the length of the fins. In the new design, synthetic jets emanate from the base of the fins so that the induced jets and entrained (cooling) ambient air flow along the fin height. The velocity field of the active heat sink is mapped using particle image velocimetry (PIV). Thermal performance is characterized using a surrogate heater and embedded thermocouple sensors. The thermal performance of identical heat sinks cooled by the two synthetic jet approaches is compared. An improved third heat sink solution is introduced and compared to previous results","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114054143","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 14

Reducing average and peak temperatures of VLSI CMOS digital circuits by means of heuristic scheduling algorithm 采用启发式调度算法降低VLSI CMOS数字电路的平均温度和峰值温度

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451782

W. Szczesniak

引用次数: 0