2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)最新文献_第2页

Advancement of Multifunctional support structure technologies (AMFSST) 多功能支撑结构技术进展

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451755

R. John, G. Atxaga, H. Frerker, A. Newerla

引用次数: 4

Investigation of thermal processes in high power laser bars by thermoreflectance spectroscopy 用热反射光谱法研究大功率激光棒的热过程

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451771

K. Pierściński, D. Pierścińska, A. Kozłowska, M. Bugajski

{"title":"Investigation of thermal processes in high power laser bars by thermoreflectance spectroscopy","authors":"K. Pierściński, D. Pierścińska, A. Kozłowska, M. Bugajski","doi":"10.1109/THERMINIC.2007.4451771","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451771","url":null,"abstract":"In this paper we present results of the analysis of the thermoreflectance (TR) measurements performed on the high power laser diodes and laser bar emitting at 808 nm. Thermoreflectance is a modulation technique relying on periodic facet temperature modulation induced by pulsed current supply of the laser. The periodic temperature change of the laser induces variation of the refractive index and consequently modulates probe beam reflectivity. Spatially resolved thermoreflectance spectroscopy is applied to measure line-scans and maps of temperature distribution at the laser mirrors and emitter facets in laser bar. However, to get the absolute values of temperatures, thermoreflectance needs calibration. Different calibration methods, such us: mu-Raman spectroscopy and in situ determination of thermoreflectance coefficient (CTR) will be discussed. The knowledge of temperature distribution at laser facets gives insight into thermal processes occurring at devices' facets and consequently leads to the increased reliability and substantially longer lifetimes of such structures.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133905247","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

High-performance thermal interface technology overview 高性能热界面技术概述

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451762

R. Linderman, T. Brunschwiler, B. Smith, B. Michel

引用次数: 27

Study of water speed sensitivity in a multifunctional thick-film sensor by analytical thermal simulations and experiments 用分析热模拟和实验研究多功能厚膜传感器的水速灵敏度

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451754

F. Stefani, P. Bagnoli, S. Luschi

引用次数: 1

Evaluation of cooling solutions for outdoor electronics 户外电子产品冷却解决方案的评估

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/EPTC.2007.4469682

Mahendra Wankhede, Vivek Khaire, Avijit Goswami, S. D. Mahajan

{"title":"Evaluation of cooling solutions for outdoor electronics","authors":"Mahendra Wankhede, Vivek Khaire, Avijit Goswami, S. D. Mahajan","doi":"10.1109/EPTC.2007.4469682","DOIUrl":"https://doi.org/10.1109/EPTC.2007.4469682","url":null,"abstract":"The thermal management of an outdoor electronic enclosure can be quite challenging due to the additional thermal load from the sun and the requirement of having an air-sealed enclosure. It is essential to consider the effect of solar heating loads in the design process; otherwise, it can shorten the life expectancy of the electronic product or lead to catastrophic failure. The main objective of this work is to analyze and compare the effectiveness of different cooling techniques used for outdoor electronics. Various cooling techniques were compared like special coats and paints on the outer surface, radiation shield, double-walled enclosure, fans for internal air circulation and air-to-air heat exchangers. A highly simplified, typical outdoor system was selected for this study measuring approximately 300times300times400 mm (WxLxH). Solar radiation was incident on 3 sides of the enclosure. There were 8 equally spaced PCBs inside the enclosure dissipating 12.5 W each uniformly (100 watts total). A computational fluid dynamics (CFD) model of the system was built and analyzed. This was followed by building a mock-up of the system and conducting experiments to validate the CFD model. It was found that some of the simplest cooling techniques like white oil paint on the outer surface can significantly reduce the impact of solar loads. Adding internal circulation fans can also be very effective. Using air-to-air heat exchangers was found to be the most effective solution although it is more complex and costly.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131310924","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 20

Method of images for the fast calculation of temperature distributions in packaged VLSI chips 快速计算封装VLSI芯片温度分布的图像方法

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451740

Virginia Martín Hériz, Je-Hyoung Park, Travis Kemper, S. Kang, Ali Shakouri

{"title":"Method of images for the fast calculation of temperature distributions in packaged VLSI chips","authors":"Virginia Martín Hériz, Je-Hyoung Park, Travis Kemper, S. Kang, Ali Shakouri","doi":"10.1109/THERMINIC.2007.4451740","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451740","url":null,"abstract":"Thermal aware routing and placement algorithms are important in industry. Currently, there are reasonably fast Green's function based algorithms that calculate the temperature distribution in a chip made from a stack of different materials. However, the layers are all assumed to have the same size, thus neglecting the important fact that the thermal mounts which are placed underneath the chip can be significantly larger than the chip itself. In an earlier publication, we showed that the image blurring technique can be used to calculate quickly temperature distribution in realistic packages. For this method to be effective, temperature distribution for several point heat sources at the center and at the corner and edges of the chip should be calculated using finite element analysis (FEA) or measured. In addition, more accurate results require correction by a weighting function that will need several FEA simulations. In this paper, we introduce the convolution by images that take the symmetry of the thermal boundary conditions into account. Thus with only \"two\" finite element simulations, the steady-state temperature distribution for an arbitrary complex power dissipation profile in a packaged chip can be calculated. Several simulation results are presented. It is shown that the power blurring technique together with the method of images can reproduce the temperature profile with an error less than 0.5%.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120833785","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 24

Thermal and mechanical analysis of high-power light-emitting diodes with ceramic packages 陶瓷封装大功率发光二极管的热力学分析

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451751

Jianzheng Hu, Lianqiao Yang, M. Shin

引用次数: 5

Influence of transparent surface layer on effective thermoreflectance coefficient of typical stacked electronic structures 透明表面层对典型堆叠电子结构有效热反射系数的影响

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451760

P. Komarov, M. Burzo, P. Raad

引用次数: 0

Development of the micro capillary pumped loop for electronic cooling 电子冷却用微毛细管泵浦回路的研制

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451750

Seok-Hwan Moon, G. Hwang

{"title":"Development of the micro capillary pumped loop for electronic cooling","authors":"Seok-Hwan Moon, G. Hwang","doi":"10.1109/THERMINIC.2007.4451750","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451750","url":null,"abstract":"Electronic devices have been minimized but the performance of those is becoming better and better. Therefore it is needed to develop new cooling methods suitable for a thin packaging structure with high thermal density. The thin flat plate type micro CPL(capillary pumped loop) with the thickness less than 2 mm was developed in this study. The proposed micro CPL has two staged grooves in evaporator instead of poles for preventing backflows of the vapor bubble and the simpler structure than that of a micro CPL with the poles. Also a large vapor space from the evaporator to the condenser was constructed in the middle plate therefore flow resistance of the vapor could be reduced. The micro CPL was fabricated using MEMS technology. The micro CPL was composed of lower, middle and upper substrates. The lower substrate was made of silicon and the middle and upper substrates are made of Pyrex glass for visualization. Through a preliminary test it was checked that there was no leakage at the adhesion interface between lower and middle or upper substrates and at the bonding interface between lower substrate and fill tube. Although the experimental studies for the micro CPL have been poor till now, we have obtained the reasonable experimental results in this study. The performance test result has showed 8.5 W of the heat transfer rate for the micro CPL and we could observe the operating characteristics of circulating or evaporating and condensing by visualization. Pure distilled water was used as the working fluid.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126599932","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Combination of thermal subsystems modeled by rapid circuit transformation 通过快速电路变换建模的热子系统组合

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451758

Y. Gerstenmaier, W. Kiffe, G. Wachutka

{"title":"Combination of thermal subsystems modeled by rapid circuit transformation","authors":"Y. Gerstenmaier, W. Kiffe, G. Wachutka","doi":"10.1109/THERMINIC.2007.4451758","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451758","url":null,"abstract":"This paper will deal with the modeling-problem of combining thermal subsystems (e.g. a semiconductor module or package with a cooling radiator) making use of reduced models. The subsystem models consist of a set of Foster-type thermal equivalent circuits, which are only behavioral models. A fast algorithm is presented for transforming the Foster-type circuits in Cauer-circuits which have physical behavior and therefore allow for the construction of the thermal model of the complete system. Then the set of Cauer-circuits for the complete system is transformed back into Foster-circuits to give a simple mathematical representation and applicability. The transformation algorithms are derived in concise form by use of recursive relations. The method is exemplified by modeling and measurements on a single chip IGBT package mounted on a closed water cooled radiator. The thermal impedance of the complete system is constructed from the impedances of the subsystems, IGBT-package and radiator, and also the impedance of the package can be inferred from the measured impedance of the complete system.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127283384","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 101