2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)最新文献_第4页

A modular high temperature measurement set-up for semiconductor device characterization 一种用于半导体器件表征的模块化高温测量装置

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451775

P. Borthen, G. Wachutka

引用次数: 2

Optimal sensor configuring techniques for the compensation of thermo-elastic deformations in high-precision systems 高精度系统热弹性变形补偿的传感器优化配置技术

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451779

A. Koevoets, H. Eggink, J. Van der Sanden, J. Dekkers, T. Ruijl

{"title":"Optimal sensor configuring techniques for the compensation of thermo-elastic deformations in high-precision systems","authors":"A. Koevoets, H. Eggink, J. Van der Sanden, J. Dekkers, T. Ruijl","doi":"10.1109/THERMINIC.2007.4451779","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451779","url":null,"abstract":"The time dependent thermal behaviour of precision systems and processes in relation to positioning accuracy is an important aspect and often claims a large part of the available position budged. This problem can be dealt with using real-time error-compensation method that combines measured temperatures with knowledge of thermo-elastic properties of the precision system. The thermally induced time varying deformations are calculated real-time by the error compensation model based on measured temperatures. The gained performance depends on the uncertainty of the thermo-mechanical model, the configuration of the temperature sensors and uncertainties in the temperature measurements. In the paper a method is introduced that enables optimization of the sensor configuration and accompanying compensation model based on the modal reduction technique. This method can be used in cases where only little pre-knowledge of heat-loads are available and enables a more optimal sensor placement, thus improving the performance of the error-compensation method.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115745436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 19

Dependency of heat transfer rate on the Brinkman number in microchannels 微通道中传热速率与布林克曼数的关系

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451748

H. Park

引用次数: 1

Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package 评估在最先进的功率封装中使用焊料贴片与环氧树脂贴片的影响

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451743

J. Czernohorsky, B. Maj, M. Viering, L. Wright, G. Balanon

引用次数: 0

The characteristics of electromigration and thermomigration in flip chip solder joints 倒装焊点的电迁移和热迁移特性

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451744

Dan-Liang Yang, Y. Chan

{"title":"The characteristics of electromigration and thermomigration in flip chip solder joints","authors":"Dan-Liang Yang, Y. Chan","doi":"10.1109/THERMINIC.2007.4451744","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451744","url":null,"abstract":"Electromigration and thermomigration behaviors of eutectic tin-lead solder joints were studied above 100 degC with the currents ranging from 1.6 A to 2.0 A. The local temperature of the chip was deducted according to temperature coefficient of resistance. Also, this temperature was inspected by a thermal infrared mapping technique. It is suggested that the heat accumulation within first-level solder interconnections was highly related to the current density. During the electromigration process, Pb migration was apparently visible because of its faster diffusivity. Meanwhile, voids were initiated at the entry location of the electron flow due to the current crowding effect. Numerical simulation also predicted a local current density of above 105 A/cm2 within the solder joint In the thermomigration process, the transport of Pb was detected owing to the thermal gradient across the solder joint. Voids also occurred at the contact window due to accelerated atomic diffusion. In addition, the effect of electromigration and thermomigration on the mechanical behavior of the solder joint was examined through shearing tests.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131095390","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Improvements of the variable thermal resistance 变热电阻的改进

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451773

V. Székely, S. Torok, E. Kollár

引用次数: 8

Application of structure functions for the investigation of forced air cooling 结构函数在强制风冷研究中的应用

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI: 10.1109/THERMINIC.2007.4451737

M. Janicki, J. Banaszczyk, G. Mey, Marek Kaminski, Bjorn Vermeersch, Andrzej Napieralski

引用次数: 6

Acoustically enhanced boiling heat transfer 声增强沸腾传热

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-07-10 DOI: 10.1063/1.4721669

Z. W. Douglas, M. Smith, A. Glezer

引用次数: 49