A modular high temperature measurement set-up for semiconductor device characterization

P. Borthen, G. Wachutka
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引用次数: 2

Abstract

We demonstrate the capabilities of a high temperature measurement set-up recently developed at our institute. It is dedicated to the characterization of semiconductor devices and test structures in the temperature range from room temperature up to 500degC and higher. A detailed description of the experimental equipment is given. Its practical use is demonstrated by measuring temperature-dependent characteristics of silicon VDMOSFET and IGBT devices as well as SiC-diodes. For the silicon devices, numerical simulations based on recently developed high temperature physical models were also performed in order to gain a deeper understanding of the measured data, together with a revalidation of the model parameters.
一种用于半导体器件表征的模块化高温测量装置
我们展示了我们研究所最近开发的高温测量装置的功能。它致力于半导体器件和测试结构的表征,温度范围从室温到500摄氏度甚至更高。对实验设备进行了详细的描述。通过测量硅VDMOSFET和IGBT器件以及sic二极管的温度依赖特性,证明了其实际用途。对于硅器件,基于最近开发的高温物理模型进行了数值模拟,以便更深入地了解测量数据,并对模型参数进行了重新验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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