高性能热界面技术概述

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI:10.1109/THERMINIC.2007.4451762

R. Linderman, T. Brunschwiler, B. Smith, B. Michel

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引用次数: 27

摘要

概述了热界面的最新发展，重点介绍了一种新的热界面技术，该技术允许在较低的装配压力下形成2-3倍薄的键合线，并大大改善了热性能。这是通过使用嵌套的分层表面通道来控制高颗粒填充材料的颗粒堆积来实现的。热循环的可靠性测试也表明，与平面界面相比，延长使用时间后，热阻降低，整体使用寿命更长。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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High-performance thermal interface technology overview

An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly pressures. This is achieved using nested hierarchical surface channels to control the particle stacking with highly particle-filled materials. Reliability testing with thermal cycling has also demonstrated a decrease in thermal resistance after extended times with longer overall lifetime compared to a flat interface.

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来源期刊

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)

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