Vibration combined high Temperature Cycle Tests for capacitive MEMS accelerometers

Abstract

In this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for reliability information for MEMS designers. A high temperature test chamber and a chopper-stabilized read-out circuitry were designed and realized at BME-DED. Twenty thermal cycles of combined temperature cycle test and fatigue vibration test has been carried out on 5 samples. Statistical evaluation of the test results showed that degradation has started in 3 out of the 5 samples.