B. Wunderle, T. Braun, D. May, A. mazloum, M. Bouazza, H. Walter, O. Wittier, R. Schacht, K. Becker, M. Schneider-Ramelow, B. Michel, H. Reichl
{"title":"热载荷和机械载荷下封装微型贴片陶瓷电容器的无损失效分析与建模","authors":"B. Wunderle, T. Braun, D. May, A. mazloum, M. Bouazza, H. Walter, O. Wittier, R. Schacht, K. Becker, M. Schneider-Ramelow, B. Michel, H. Reichl","doi":"10.1109/THERMINIC.2007.4451756","DOIUrl":null,"url":null,"abstract":"The use of multi-layer ceramic chip capacitors as integrated passive in e. g. system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive failure analytical technique is described to detect cracks in the ceramic and the metallic layers within encapsulated 0402 SMD capacitors. After choosing from techniques to reproducibly generate cracks, it is shown that an in-situ capacitance measurement is a convenient method to detect these failures unambiguously. Finite Element simulations support the experimental results. A reliability estimate for capacitor integrity under given loading conditions is given.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading\",\"authors\":\"B. Wunderle, T. Braun, D. May, A. mazloum, M. Bouazza, H. Walter, O. Wittier, R. Schacht, K. Becker, M. Schneider-Ramelow, B. Michel, H. Reichl\",\"doi\":\"10.1109/THERMINIC.2007.4451756\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The use of multi-layer ceramic chip capacitors as integrated passive in e. g. system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive failure analytical technique is described to detect cracks in the ceramic and the metallic layers within encapsulated 0402 SMD capacitors. After choosing from techniques to reproducibly generate cracks, it is shown that an in-situ capacitance measurement is a convenient method to detect these failures unambiguously. Finite Element simulations support the experimental results. A reliability estimate for capacitor integrity under given loading conditions is given.\",\"PeriodicalId\":264943,\"journal\":{\"name\":\"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/THERMINIC.2007.4451756\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/THERMINIC.2007.4451756","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading
The use of multi-layer ceramic chip capacitors as integrated passive in e. g. system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive failure analytical technique is described to detect cracks in the ceramic and the metallic layers within encapsulated 0402 SMD capacitors. After choosing from techniques to reproducibly generate cracks, it is shown that an in-situ capacitance measurement is a convenient method to detect these failures unambiguously. Finite Element simulations support the experimental results. A reliability estimate for capacitor integrity under given loading conditions is given.