电容式MEMS加速度计的振动组合高温循环试验

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-12-01 DOI:10.1109/THERMINIC.2007.4451781

Z. Szűcs, G. Nagy, S. Hodossy, M. Rencz, A. Poppe

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引用次数: 10

摘要

本文介绍了封装电容式SOI-MEMS加速度计的振动联合高温循环试验。这些测试的目的是为MEMS设计人员提供有用的可靠性设计信息。在BME-DED上设计并实现了高温试验箱和斩波稳定读出电路。对5个试样进行了20个热循环的联合温度循环试验和疲劳振动试验。对测试结果的统计评估表明，5个样品中有3个已经开始降解。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Vibration combined high Temperature Cycle Tests for capacitive MEMS accelerometers

In this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for reliability information for MEMS designers. A high temperature test chamber and a chopper-stabilized read-out circuitry were designed and realized at BME-DED. Twenty thermal cycles of combined temperature cycle test and fatigue vibration test has been carried out on 5 samples. Statistical evaluation of the test results showed that degradation has started in 3 out of the 5 samples.

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2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)

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