一种新的动态致密热模型提取方法

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI:10.1109/THERMINIC.2007.4451766

W. Habra, P. Tounsi, F. Madrid, P. Dupuy, C. Barbot, J. Dorkel

{"title":"一种新的动态致密热模型提取方法","authors":"W. Habra, P. Tounsi, F. Madrid, P. Dupuy, C. Barbot, J. Dorkel","doi":"10.1109/THERMINIC.2007.4451766","DOIUrl":null,"url":null,"abstract":"An innovative and accurate dynamic compact thermal model extraction method is proposed for multi-chip power electronics systems. It accounts for thermal coupling between multiple heat sources. Transient electro-thermal coupling can easily be taken into account by system designers. The method is based on a definition of the optimal thermal coupling point, which is proven to be valid even for transient modelling. Compared to the existing methods, the number of needed 3D thermal simulations or measurements is significantly reduced.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"A new methodology for extraction of dynamic compact thermal models\",\"authors\":\"W. Habra, P. Tounsi, F. Madrid, P. Dupuy, C. Barbot, J. Dorkel\",\"doi\":\"10.1109/THERMINIC.2007.4451766\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An innovative and accurate dynamic compact thermal model extraction method is proposed for multi-chip power electronics systems. It accounts for thermal coupling between multiple heat sources. Transient electro-thermal coupling can easily be taken into account by system designers. The method is based on a definition of the optimal thermal coupling point, which is proven to be valid even for transient modelling. Compared to the existing methods, the number of needed 3D thermal simulations or measurements is significantly reduced.\",\"PeriodicalId\":264943,\"journal\":{\"name\":\"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/THERMINIC.2007.4451766\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/THERMINIC.2007.4451766","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

针对多芯片电力电子系统，提出了一种新颖、精确的动态紧凑热模型提取方法。它考虑了多个热源之间的热耦合。系统设计者很容易考虑到瞬态电热耦合。该方法基于最优热耦合点的定义，即使在瞬态建模中也被证明是有效的。与现有的方法相比，所需的三维热模拟或测量的数量大大减少。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

A new methodology for extraction of dynamic compact thermal models

An innovative and accurate dynamic compact thermal model extraction method is proposed for multi-chip power electronics systems. It accounts for thermal coupling between multiple heat sources. Transient electro-thermal coupling can easily be taken into account by system designers. The method is based on a definition of the optimal thermal coupling point, which is proven to be valid even for transient modelling. Compared to the existing methods, the number of needed 3D thermal simulations or measurements is significantly reduced.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)

自引率

0.00%

发文量