基于交错固体扩散器和合成射流的3-D堆叠芯片电子器件热管理原型解决方案的开发

D. Gerty, David W. Gerlach, Yogendra Joshi, Ari Glezer
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引用次数: 14

摘要

提出了一种利用高导热的固体散热片在芯片层之间交错散热的3D堆叠芯片电子器件的设计方案。散热器将热量传导到先进的合成射流冷却散热器的底部。先前的一项计算研究表明,对于中等功耗,每27 × 38 mm层5 W, 250 mm厚的铜散热器可以充分导热。然而,铜和硅之间的热膨胀系数不匹配需要通过铜层的大孔来进行电过孔。本研究探讨了用于实验测试的热原型的设计。每个有源层将包含一个模拟FPGA的热测试芯片和一个较小的模拟DRAM的热测试芯片。散布层将是没有通孔的硅。散热器将只接触堆栈的三个侧面,以便在第四个侧面进行线键连接。研究了外围表面的传热系数和耗散功率的影响。为了从多层烟囱的边缘去除热量并将其转移到周围空气中,采用集成合成射流矩阵实现了一种新型的主动散热器设计。在以前的合成射流散热器设计中,冷却空气被带到散热器的上游,并沿着散热片的长度被驱动。在新的设计中,合成射流从鳍的底部发出,这样诱导射流和夹带(冷却)的环境空气沿着鳍的高度流动。利用粒子图像测速技术(PIV)绘制了主动式散热器的速度场。热性能表征使用替代加热器和嵌入式热电偶传感器。比较了两种合成射流冷却方式对相同散热片的散热性能。介绍了一种改进的第三散热器解决方案,并与以前的结果进行了比较
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development of a prototype thermal management solution for 3-D stacked chip electronics by interleaved solid spreaders and synthetic jets
A design for cooling 3D stacked chip electronics is proposed using solid heat spreaders of high thermal conductivity interleaved between the chip layers. The spreaders conduct heat to the base of an advanced synthetic jet cooled heat sink. A prior computational study showed that for moderate power dissipations, 5 W in each 27times38 mm layer, a 250 mum thick copper heat spreader would conduct heat adequately. However, the mismatch in coefficient of thermal expansion between copper and silicon required large holes through the copper layer for electrical vias. The current study investigates the design of a thermal prototype for experimental testing. Each active layer will incorporate a thermal test die to simulate an FPGA and a smaller one to simulate a DRAM. The spreader layer will be silicon with no via holes. The heat sink will contact only three of the stack sides to allow wirebond connections on the fourth side. The effect of the power dissipated and the heat transfer coefficient applied to the peripheral surface are studied. In order to remove the heat from the edges of a multi-layer stack and transfer it to the ambient air, a novel active heat sink design has been implemented using a matrix of integrated synthetic jets. In previous synthetic jet heat sink designs, cooling air is entrained upstream of the heat sink and is driven along the length of the fins. In the new design, synthetic jets emanate from the base of the fins so that the induced jets and entrained (cooling) ambient air flow along the fin height. The velocity field of the active heat sink is mapped using particle image velocimetry (PIV). Thermal performance is characterized using a surrogate heater and embedded thermocouple sensors. The thermal performance of identical heat sinks cooled by the two synthetic jet approaches is compared. An improved third heat sink solution is introduced and compared to previous results
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