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Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)最新文献

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Bending, torsional and extending active catheter assembled using electroplating 可弯曲、可扭转、可延伸的主动导管采用电镀组装
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838513
Y. Haga, M. Esashi, S. Maeda
{"title":"Bending, torsional and extending active catheter assembled using electroplating","authors":"Y. Haga, M. Esashi, S. Maeda","doi":"10.1109/MEMSYS.2000.838513","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838513","url":null,"abstract":"This paper reports a new batch fabrication method of active catheters which have bending, torsional and extending functions for medical applications. The active catheter consists of shape memory alloy (SMA) coil for actuator and a stainless steel liner coil. The SMA coil and the liner coil are connected using nickel electroplating and acrylic resin electrodeposition. This novel method makes low cost assembly and small diameter (/spl phi/1.4 mm) possible. The new fabrication method of small diameter and thin wall tubular structure which is suitable for active catheters was developed. The tubular structure consists of stainless steel spring coil, evaporated parylene membrane and dip coated biocompatible polyurethane.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131093856","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 59
The first self-priming and bi-directional valve-less diffuser micropump for both liquid and gas 第一个自吸和双向无阀扩散微泵液体和气体
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838599
Wouter van der Wijngaart, H. Andersson, P. Enoksson, K. Norén, G. Stemme
{"title":"The first self-priming and bi-directional valve-less diffuser micropump for both liquid and gas","authors":"Wouter van der Wijngaart, H. Andersson, P. Enoksson, K. Norén, G. Stemme","doi":"10.1109/MEMSYS.2000.838599","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838599","url":null,"abstract":"A new micropump design was fabricated to make a qualitative study on the reliability of micro diffuser pumps. A novel two-level pump chamber geometry enables both gas and liquid pumping. The micropumps are fully self-priming and insensitive to cavitation and gas bubbles in the liquid. Changing the driving frequency enables bi-directional pumping for both liquid and gas, i.e. both forward and reverse pumping. The pumps consist of a silicon-glass stack and are fabricated with a new process involving three sequential deep RIE steps. A new and simple melt-on method for conveniently fixing external tubes to the device was developed. Design, fabrication and first experimental results are described and discussed.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"350 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124312949","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 59
In situ characterization of CMOS post-process micromachining CMOS后处理微加工的原位表征
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838588
B. Warneke, K. Pister
{"title":"In situ characterization of CMOS post-process micromachining","authors":"B. Warneke, K. Pister","doi":"10.1109/MEMSYS.2000.838588","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838588","url":null,"abstract":"We have developed and demonstrated a new methodology for in situ monitoring and characterization of CMOS post-process micromachining utilizing integrated circuits and micromachine test-structures. In our demonstration, the circuits provide automated readout of N-well resistors surrounding each of the 140 test pit structures at up to 14,000 samples per second per device during the post-process silicon etch, and thus also provide etch progress and end point determination without extra analytical equipment. Pit sizes, surrounding layers, and topology are examined with this technique.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114607112","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
A bi-directional electrochemically driven micro liquid dosing system with integrated sensor/actuator electrodes 一种集成传感器/致动器电极的双向电化学驱动微液体加药系统
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838496
S. Bohm, W. Olthuis, P. Bergveld
{"title":"A bi-directional electrochemically driven micro liquid dosing system with integrated sensor/actuator electrodes","authors":"S. Bohm, W. Olthuis, P. Bergveld","doi":"10.1109/MEMSYS.2000.838496","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838496","url":null,"abstract":"In this contribution a micro liquid dosing system is presented, which allows bi-directional manipulation of fluids (i.e. pushing out and pulling in of liquids) by the electrochemical generation and removal of gas bubbles. Bi-directionality is obtained by reversal of the actuation current thereby causing the earlier produced gasses to react back to water. This reduction of gas volume actively pulls liquid back into the system. The electrochemical actuator electrodes have been specially designed to perform the simultaneous measurement of conductivity, via which the total amount of gas can be estimated. As this amount equals the total dosed volume of liquid, dispensed volumes can be determined on-line during experiments.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122103168","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 19
Trident-type tuning fork silicon gyroscope by the phase difference detection 三叉戟型音叉硅陀螺仪由相位差检测
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838569
M. Abe, E. Shinohara, K. Hasegawa, S. Murata, M. Esashi
{"title":"Trident-type tuning fork silicon gyroscope by the phase difference detection","authors":"M. Abe, E. Shinohara, K. Hasegawa, S. Murata, M. Esashi","doi":"10.1109/MEMSYS.2000.838569","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838569","url":null,"abstract":"The trident-type tuning fork silicon gyroscope was designed and fabricated. The trident-type tuning fork structure and vacuum packaging has a Q value higher than 15000. A new detection principle which is based on the phase difference detection is proposed and is confirmed using the fabricated gyroscope. By this detecting method, it is possible to detect the angular rate without control of the driving amplitude. The gyroscope sensitivity obtained was 180 /spl mu/V/deg/sec.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125083569","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Fluid drive chips containing multiple pumps and switching valves for Biochemical IC Family 流体驱动芯片包含多个泵和开关阀的生化IC家族
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838610
K. Ikuta, T. Hasegawa, T. Adachi, S. Maruo
{"title":"Fluid drive chips containing multiple pumps and switching valves for Biochemical IC Family","authors":"K. Ikuta, T. Hasegawa, T. Adachi, S. Maruo","doi":"10.1109/MEMSYS.2000.838610","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838610","url":null,"abstract":"Versatile micro fluidic device \"Biochemical IC Family\" based on the concept of family IC chip-set has been proposed and developed by the authors. Several types of biochemical IC containing multiple micro fluidic devices such as reactors, concentrators and one-way valves have been developed. A luminous enzyme of firefly was synthesized by using these chips. New chips to handle chemical fluid were first fabricated successfully and basic performance was verified experimentally. Shape memory alloy (SMA) micro actuator was utilized for micro actuation. New micro stereo lithography (Hybrid IH Process) to make 3D composite structure consisting UV polymer and other micro parts was developed and was utilized for total chip fabrication. The pump chip succeeded to flow chemical liquids through the connected chips. The switching valve chip changed reaction passes quickly. By using these biochemical IC chips, new era in where various kind of reaction system can be constructed by the chemists in their own laboratory will come.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131002165","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 31
Electrical isolation process for molded, high-aspect-ratio polysilicon microstructures 用于高纵横比多晶硅微结构的电隔离工艺
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838584
L. Muller, J. Heck, R. Howe, A. Pisano
{"title":"Electrical isolation process for molded, high-aspect-ratio polysilicon microstructures","authors":"L. Muller, J. Heck, R. Howe, A. Pisano","doi":"10.1109/MEMSYS.2000.838584","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838584","url":null,"abstract":"A new process for fabricating molded, thin-film microstructures with electrical and mechanical interconnects is presented. A two step molding process is used to create a composite structure of undoped polysilicon, silicon nitride, and doped polysilicon. The doped poly is used to create regions of conductivity within a nonconducting structure. Thus it is possible to create high-aspect-ratio, monolithic electromechanical microstructures which are transferable from a reusable mold. These microstructures are more resistant to thermal changes and misalignment errors compared to microstructures transferred in segments. A suspended electrostatic microactuator was successfully fabricated using this process. High-aspect-ratio structures, 100 /spl mu/m and 75 /spl mu/m tall, were fabricated with 7 /spl mu/m wide capacitive gaps. Experimental verification of the isolation showed an acceptable 10 nA current leakage at /spl plusmn/25 V and 150 nA leakage at /spl plusmn/50 V.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126543986","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
MEMS commercialization: ingredients for success MEMS商业化:成功的要素
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838481
R. Payne
{"title":"MEMS commercialization: ingredients for success","authors":"R. Payne","doi":"10.1109/MEMSYS.2000.838481","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838481","url":null,"abstract":"The commercialization of most new technologies has traditionally taken many more years than pundits predict. MEMS are no exception to this rule. Five-year predictions of explosive growth often turn into 20-year marathons of endurance. The adoption of new technology often requires overwhelming evidence of superiority before displacing an established technology. As a rule of thumb, if one can't see a tenfold advantage in some parameter of importance, such as performance or cost, the likelihood of successful adoption is low. Several MEMS devices have emerged that have significant commercial importance. Several others appear to be on the threshold of commercial success. The characteristics of some of these MEMS devices will be examined, the ingredients for success distilled from this group, and some predictions for the future will be offered.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126020092","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Fabrication and hermeticity testing of a glass-silicon package formed using localized aluminum/silicon-to-glass bonding 采用局部铝/硅-玻璃键合形成的玻璃-硅封装的制造和密封性测试
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838613
Y. Cheng, Liwei Lin, K. Najafi
{"title":"Fabrication and hermeticity testing of a glass-silicon package formed using localized aluminum/silicon-to-glass bonding","authors":"Y. Cheng, Liwei Lin, K. Najafi","doi":"10.1109/MEMSYS.2000.838613","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838613","url":null,"abstract":"A hermetic package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. Less than 0.2 MPa contact pressure with 46 mA current input for two parallel 3.5 m wide polysilicon microheaters can achieve a strong and reliable bond in 7 minutes. Accelerated testing in an autoclave shows some packages survive more than 200 hours at 3 atm, 100%RH and 128/spl deg/C. Premature failure has been attributed to some unbonded regions on the failed samples. The bonding yield and reliability has been improved by increasing bonding time and applied pressure. Devices using this process have lasted for more than 320 hours under accelerated conditions. The packaging technology is being applied to vacuum encapsulation of resonant devices.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122390705","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
Imaging of micro-discharge in a micro-gap of electrostatic actuator 静电致动器微间隙微放电成像
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838595
T. Ono, D. Sim, M. Esashi
{"title":"Imaging of micro-discharge in a micro-gap of electrostatic actuator","authors":"T. Ono, D. Sim, M. Esashi","doi":"10.1109/MEMSYS.2000.838595","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838595","url":null,"abstract":"Weak light emission caused an ionization process of gases in the micro gag of an electrostatic actuator under a high electric field can be imaged using a high sensitive CCD camera, even if the electric field strength is below the breakdown threshold. The observation of the ionization process give an information about a space charge distribution in gases. It is found that irregular instability and the inhomogeneous distribution of electric field develop micro-discharges. The micro-discharge evaporates an electrode material, results in increasing the pressure in the gap, finally grows up to the breakdown. This effect is seemed to be remarkable, especially in narrow gaps. Furthermore, the electric breakdown threshed depends on the electrode material. Silicon-to-silicon gap configuration shows a higher breakdown threshold as well as the prebreakdown threshold in comparison with silicon-to-metal gap. It suggests that /spl gamma//sub i/ effect plays an important role in this process.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115157473","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
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