Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)最新文献_第3页

TOPSPOT-a new method for the fabrication of microarrays 一种制造微阵列的新方法

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838536

J. Ducrée, H. Gruhler, N. Hey, M. Muller, S. Békési, M. Freygang, H. Sandmaiser, R. Zengerle

{"title":"TOPSPOT-a new method for the fabrication of microarrays","authors":"J. Ducrée, H. Gruhler, N. Hey, M. Muller, S. Békési, M. Freygang, H. Sandmaiser, R. Zengerle","doi":"10.1109/MEMSYS.2000.838536","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838536","url":null,"abstract":"This article outlines the new non-contact TOPSPOT method for printing microarrays in a highly parallelized fashion. It is based on a micromachined print head incorporating a central microarray of presently up to 96 vertical nozzles on the output side. Droplets featuring volumes down to 1nl aligned in a 500 /spl mu/m grid are simultaneously ejected by applying a steep air pressure ramp to the open upper side of the liquid. Each of these nozzles is connected to a distinct fluidic reservoir constituting the interface to the macro world. To allow an automated replenishing of the chip, the alignment of the reservoirs is amenable for liquid handling via standard pipetting robots. Depending on the design of the print head, a maximum of 20 /spl mu/l can be stored thus allowing one to dispend about 20.000 droplets of equal quality in a row. Besides its suitability for a robust biochip manufacturing facility in the laboratory, the print head is also well-integrable in a high-throughput production plant. These versions are scheduled to become commercially available in 2000.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128068355","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 30

Ball semiconductor technology and its application to MEMS 球半导体技术及其在微机电系统中的应用

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838482

N. Takeda

引用次数: 26

Intelligent CMOS sensors 智能CMOS传感器

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838480

C. Hierold

引用次数: 37

Deep reactive ion etching of Pyrex glass 热玻璃的深度反应离子蚀刻

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838528

X. Li, T. Abe, M. Esashi

引用次数: 58

Phase change in microchannel heat sink under forced convection boiling 强制对流沸腾条件下微通道散热片的相变

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838550

Linan Jiang, M. Wong, Y. Zohar

{"title":"Phase change in microchannel heat sink under forced convection boiling","authors":"Linan Jiang, M. Wong, Y. Zohar","doi":"10.1109/MEMSYS.2000.838550","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838550","url":null,"abstract":"A microchannel heat sink system, consisting of parallel microchannels, distributed temperature micro-sensors and a local heater, has been fabricated and characterized. V-grooves with hydraulic diameter of either 40 /spl mu/m or 80 /spl mu/m were formed by bulk silicon etching. The heater and temperature microsensor array were fabricated using surface micromachining. Microchannels were realized by bonding a glass wafer to the silicon substrate, resulting in a transparent cover for flow visualization. Phase change during the boiling process was studied under forced convection conditions, where DI water was used as the working fluid. No boiling plateau, associated with latent heat, has been observed in the boiling curves of microchannel heat sinks. Flow visualization was carried out to understand the boiling mechanism in such a system. Three phase-change modes were observed depending on the input power level. Local nucleation boiling within the microchannels occurred at low power level. At moderate levels, large bubbles developed at the inlet/outlet regions, and the upstream bubbles were forced through the channels and out of the system. At higher input power levels, a stable annular flow mode was observed, where a thin liquid film coated each channel wall until critical heat flux conditions developed with a dryout of the system.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130331003","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 21

N-well based CMOS calorimetric chemical sensors 基于n阱的CMOS量热化学传感器

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838497

N. Kerness, A. Koll, A. Schaufelbuhl, C. Hagleitner, A. Hierlemann, O. Brand, H. Baltes

引用次数: 18

Stretched-film micromirrors for improved optical flatness 用于改善光学平整度的拉伸膜微镜

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838604

J. Nee, R. Conant, Matthew R. Hart, Richard S. Muller, Kam Y. Lau

引用次数: 38

An electrostatically-actuated MEMS switch for power applications 一种用于电源应用的静电驱动MEMS开关

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838592

Jo-ey Wong, Jeffrey H. Lang, Martin, Schmidt

引用次数: 53

An air flow sensor modeled on wind receptor hairs of insects 以昆虫毛发的风感受器为模型的气流传感器

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838573

Yoshihiro Ozaki, Tomoyuki Ohyama, T. Yasuda, I. Shimoyama

引用次数: 130

New amorphous alloys as micromaterials and the processing technologies 新型非晶合金微材料及其加工技术

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838531

Y. Saotome, A. Inoue

引用次数: 16