Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)最新文献

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A novel fabrication process for high-aspect-ratio and co-axial multi-layer nickel microstructures 一种新型的高纵横比同轴多层镍微结构制备工艺
Ching‐Bin Lin, Mau-Kuo Wei, Chun-Hung Liu, Chung-Hsing Yen, Zhenguo Su, Yin-Teng Tai, Zhi-Hong Chen
{"title":"A novel fabrication process for high-aspect-ratio and co-axial multi-layer nickel microstructures","authors":"Ching‐Bin Lin, Mau-Kuo Wei, Chun-Hung Liu, Chung-Hsing Yen, Zhenguo Su, Yin-Teng Tai, Zhi-Hong Chen","doi":"10.1109/MEMSYS.2000.838583","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838583","url":null,"abstract":"A novel process of high-aspect-ratio metallic microstructures is proposed. The process combines protective film coating, laser drilling, swelling of polymers, electroforming and demolding. The pattern accuracy of metallic microstructures is controlled not only by laser drilling but also by swelling of polymers, because the diameter of drilled holes decreases to a certain value after the treatment of swelling. Using this process, a micro-post-array nickel mold and a precisely co-axial multi-layer nickel microstructure with a high aspect ratio of about 100 and a thickness of 5 mm is produced. The advantages of this process include low cost, simple procedures, and easy demolding.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124909274","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Surface micromachined bridge configurations for accurate angle measurements 表面微机械桥配置精确的角度测量
J.R. Kaienburg, M. Huonker, R. Schellin
{"title":"Surface micromachined bridge configurations for accurate angle measurements","authors":"J.R. Kaienburg, M. Huonker, R. Schellin","doi":"10.1109/MEMSYS.2000.838501","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838501","url":null,"abstract":"This paper reports on new sensing elements and the corresponding read-out circuit of a novel silicon surface micromachined angle sensor. Different bridge configurations-half and full bridges-comprising up to four variable capacitors were designed and characterized. The combination of such array-like arrangements and further improved sensing elements lead to a significant increase of performance. In this paper modeling, the evaluation circuit, and experimental results of different bridge configurations are presented.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122659530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
An improved TMAH Si-etching solution without attacking exposed aluminum 一种改进的TMAH硅腐蚀溶液,不腐蚀暴露的铝
G. Yan, P. Chan, I. Hsing, R.K. Sharma, J. Sin
{"title":"An improved TMAH Si-etching solution without attacking exposed aluminum","authors":"G. Yan, P. Chan, I. Hsing, R.K. Sharma, J. Sin","doi":"10.1109/MEMSYS.2000.838579","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838579","url":null,"abstract":"In this paper, an improved Tetramethyl Ammonium Hydroxide (TMAH) etching method is reported. The process features higher silicon etching rate and results in smooth silicon surface and at the same time, no significant aluminum etching is observed. We believe that after TMAH etching the aluminum surface is protected by the coating of by-products, which prevents etching of the underlying aluminum films by the TMAH solution. The etchant used in the study consists of 5 wt.% TMAH solution, 1.4 wt.% (or above) dissolved silicon, and 0.4-0.7 wt.% (NH/sub 4/)/sub 2/S/sub 2/O/sub 8/ oxidant additive. Silicon etching rate of 0.9-1.0 /spl mu/m/min and zero aluminum etching rate is be achieved using the process. Moreover the silicon surface remains smooth after etching. The etching process demonstration in this work is readily applicable to MEMS device fabrication such as polysilicon like sacrificial layer removal after metallization is completed.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116191492","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 126
3D nano wire-frame for handling and observing a single DNA fiber 用于处理和观察单个DNA纤维的3D纳米线框
T. Ooi, K. Matsumoto, M. Nakao, M. Otsubo, S. Shirakata, S. Tanaka, Y. Hatamura
{"title":"3D nano wire-frame for handling and observing a single DNA fiber","authors":"T. Ooi, K. Matsumoto, M. Nakao, M. Otsubo, S. Shirakata, S. Tanaka, Y. Hatamura","doi":"10.1109/MEMSYS.2000.838582","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838582","url":null,"abstract":"We developed a new process, \"3D-EBD (Electron Beam Deposition)\" to form 3D wire-frame and nanometer-sized structures. Using this process we formed a 20 nm diameter nano-probe on the tip of a glass needle, and extracted a single DNA fiber from a human chromosome using it. We are also applying it to a single DNA observation using SNOM (Scanning Near-field Optical Microscope).","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121283543","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
A 1 mG lateral CMOS-MEMS accelerometer 一个1mg横向CMOS-MEMS加速度计
H. Luo, G. Fedder, L. R. Carley
{"title":"A 1 mG lateral CMOS-MEMS accelerometer","authors":"H. Luo, G. Fedder, L. R. Carley","doi":"10.1109/MEMSYS.2000.838568","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838568","url":null,"abstract":"This paper reports a lateral CMOS-MEMS accelerometer with a measured noise floor of 1 mG//spl radic/(Hz) and a dynamic range larger than 13 G. The accelerometer is fully compatible with conventional CMOS processes enabling the integration of most of the conditioning circuits. It is fabricated in a three metal layer 0.5 /spl mu/m CMOS process followed by a two-step dry etch release. An improved curl matching technique is utilized to solve the out-of-plane curl problem. A new differential amplifier is used for the capacitive sensing interface. The CMOS micromachining process used in this project is described. The design of accelerometer, system schematic applying force-balance feedback and experimental test results are presented.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116450875","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 58
N-well based CMOS calorimetric chemical sensors 基于n阱的CMOS量热化学传感器
N. Kerness, A. Koll, A. Schaufelbuhl, C. Hagleitner, A. Hierlemann, O. Brand, H. Baltes
{"title":"N-well based CMOS calorimetric chemical sensors","authors":"N. Kerness, A. Koll, A. Schaufelbuhl, C. Hagleitner, A. Hierlemann, O. Brand, H. Baltes","doi":"10.1109/MEMSYS.2000.838497","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838497","url":null,"abstract":"New micromachined calorimetric chemical sensors based on an n-well island structure have been designed, fabricated in industrial CMOS technology, and tested. The suspended island structure is covered with a polymer and changes its temperature upon absorption or desorption of analyte. The temperature change is recorded by integrated polysilicon/aluminum thermopiles. A polysilicon or metal heating resistor covers the n-well structure which allows a more accurate calibration compared to our previous design . The system provides a physical sensitivity of 34 and 26.5 mV//spl mu/W for the square and rectangular shaped membrane devices, respectively. Sensitivity and performance of the calorimetric chemical microsystem are shown by measurements for different volatile organic compounds. The system has a sensitivity of 0.045 and 0.049 mV/ppm to ethanol and 0.209 and 0.229 mV/ppm to toluene for the square and rectangular membrane devices, respectively.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125708390","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
Thin flexible end-effector using pneumatic balloon actuator 薄型柔性末端执行器采用气动球囊执行器
F. Kawai, P. Cusin, S. Konishi
{"title":"Thin flexible end-effector using pneumatic balloon actuator","authors":"F. Kawai, P. Cusin, S. Konishi","doi":"10.1109/MEMSYS.2000.838549","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838549","url":null,"abstract":"A pneumatic balloon is applied to actuate a thin flexible end-effector. The pneumatic balloon actuator is fabricated on a cantilever for the flexible end-effector. The end-effector bends when the pneumatic balloon swells. Pneumatic balloon actuators provide large displacements, high forces, and flexible structures. The following trials aiming to implement microdevices have been estimated through prototyping. Diced silicon ribs are employed so as to keep a desired shape and patterned heaters are estimated for a pressure supply based on a phase transformation. A conveyance system is composed of distributed end effectors for our demonstration. A manipulation of a glass plate by the developed system is successfully operated.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"105 8","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120814727","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 135
A vacuum packaged differential resonant accelerometer using gap sensitive electrostatic stiffness changing effect 一种利用间隙敏感静电刚度变化效应的真空封装差分谐振加速度计
Byeungleul Lee, C. Oh, Soo Lee, Y. Oh, K. Chun
{"title":"A vacuum packaged differential resonant accelerometer using gap sensitive electrostatic stiffness changing effect","authors":"Byeungleul Lee, C. Oh, Soo Lee, Y. Oh, K. Chun","doi":"10.1109/MEMSYS.2000.838542","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838542","url":null,"abstract":"This paper proposes an INS (Inertial Navigation System) grade, surface micro-machined differential resonant accelerometer (DRXL) by using the epitaxially grown thick polysilicon process. This proposed DRXL device produces a differential digital output upon an applied acceleration, and the principle is a gap-dependent electrical stiffness variation of the electrostatic resonator with torsion beam structures. Using this new operating concept, we designed, fabricated and tested the proposed device. The final device was fabricated by using the wafer level vacuum packaging process. The hermetic sealing cap structure was made of Pyrex 7740 glass with Ti layer as gettering material, and this cap wafer was anodically bonded with the polysilicon wafer at vacuum ambience. The measured Q-factor of the vacuum packaged DRXL was about 1/spl times/10/sup 3/ and the estimated inner pressure was about 200[mTorr]. We also achieved 73[Hz] output frequency change per unit G(9.8 m/s/sup c/) input with 12,716[Hz] nominal resonant frequency.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127849758","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 48
Stretched-film micromirrors for improved optical flatness 用于改善光学平整度的拉伸膜微镜
J. Nee, R. Conant, Matthew R. Hart, Richard S. Muller, Kam Y. Lau
{"title":"Stretched-film micromirrors for improved optical flatness","authors":"J. Nee, R. Conant, Matthew R. Hart, Richard S. Muller, Kam Y. Lau","doi":"10.1109/MEMSYS.2000.838604","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838604","url":null,"abstract":"We have developed a new tensile optical-surface (TOS) process to produce optically flat micromirrors capable of scanning at high frequencies. A polysilicon membrane is stretched across a stiff, single-crystal silicon-rib structure. This structure increases the stiffness of the mirror without significantly increasing its mass. The low mass makes possible high operating frequencies without deformation that could significantly compromise the optical performance of the mirror. Electrostatic comb drives, made of thick single-crystal silicon, provide large forces that enable mirror operation at tens of kHz.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129108508","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 38
Ultrasonic micromixer for microfluidic systems 用于微流体系统的超声波微混合器
Zhen Yang, H. Goto, M. Matsumoto, R. Maeda
{"title":"Ultrasonic micromixer for microfluidic systems","authors":"Zhen Yang, H. Goto, M. Matsumoto, R. Maeda","doi":"10.1109/MEMSYS.2000.838494","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838494","url":null,"abstract":"This paper describes the design, fabrication and evaluation of an active micromixer. Mixing occurs directly from ultrasonic vibration. The intended use of the device was for integrated micro chemical synthesis systems or for micro total analysis systems. The pattern of inlets, outlet and mixing chamber were formed in glass. The whole flow path was encapsulated by anodic bonding of a Si wafer to the glass. A diaphragm (6 mm/spl times/6 mm/spl times/0.15 mm) was etched on the Si side for oscillation. The ultrasonic vibration originated from a bulk piezoelectric PZT ceramic (5 mm/spl times/4 mm/spl times/0.15 mm), which was excited by a 60 kHz square wave at 50 V (peak-to-peak). Liquids were mixed in a chamber (6 mm/spl times/6 mm/spl times/0.06 mm) with the Si oscillating diaphragm driven by the PZT. A solution of uranine and water were used to evaluate the mixing effectiveness. The entire process was recorded using a fluorescent microscope equipped with digital camera. The laminar flows of uranine solution (5 /spl mu/l/min) and water (5 /spl mu/l/min) were mixed effectively when the PZT was excited.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129140175","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 433
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