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Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)最新文献

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An improved TMAH Si-etching solution without attacking exposed aluminum 一种改进的TMAH硅腐蚀溶液，不腐蚀暴露的铝
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838579
G. Yan, P. Chan, I. Hsing, R.K. Sharma, J. Sin
{"title":"An improved TMAH Si-etching solution without attacking exposed aluminum","authors":"G. Yan, P. Chan, I. Hsing, R.K. Sharma, J. Sin","doi":"10.1109/MEMSYS.2000.838579","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838579","url":null,"abstract":"In this paper, an improved Tetramethyl Ammonium Hydroxide (TMAH) etching method is reported. The process features higher silicon etching rate and results in smooth silicon surface and at the same time, no significant aluminum etching is observed. We believe that after TMAH etching the aluminum surface is protected by the coating of by-products, which prevents etching of the underlying aluminum films by the TMAH solution. The etchant used in the study consists of 5 wt.% TMAH solution, 1.4 wt.% (or above) dissolved silicon, and 0.4-0.7 wt.% (NH/sub 4/)/sub 2/S/sub 2/O/sub 8/ oxidant additive. Silicon etching rate of 0.9-1.0 /spl mu/m/min and zero aluminum etching rate is be achieved using the process. Moreover the silicon surface remains smooth after etching. The etching process demonstration in this work is readily applicable to MEMS device fabrication such as polysilicon like sacrificial layer removal after metallization is completed.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116191492","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 126
A 1 mG lateral CMOS-MEMS accelerometer 一个1mg横向CMOS-MEMS加速度计
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838568
H. Luo, G. Fedder, L. R. Carley
{"title":"A 1 mG lateral CMOS-MEMS accelerometer","authors":"H. Luo, G. Fedder, L. R. Carley","doi":"10.1109/MEMSYS.2000.838568","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838568","url":null,"abstract":"This paper reports a lateral CMOS-MEMS accelerometer with a measured noise floor of 1 mG//spl radic/(Hz) and a dynamic range larger than 13 G. The accelerometer is fully compatible with conventional CMOS processes enabling the integration of most of the conditioning circuits. It is fabricated in a three metal layer 0.5 /spl mu/m CMOS process followed by a two-step dry etch release. An improved curl matching technique is utilized to solve the out-of-plane curl problem. A new differential amplifier is used for the capacitive sensing interface. The CMOS micromachining process used in this project is described. The design of accelerometer, system schematic applying force-balance feedback and experimental test results are presented.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116450875","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 58
Microfabrication technology for polycaprolactone, a biodegradable polymer 生物可降解聚合物聚己内酯的微加工技术
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838532
D. Armani, Chang Liu
{"title":"Microfabrication technology for polycaprolactone, a biodegradable polymer","authors":"D. Armani, Chang Liu","doi":"10.1109/MEMSYS.2000.838532","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838532","url":null,"abstract":"In this paper, we report the development of micromachining techniques for a biodegradable polymer for the first time. By virtue of their ability to naturally degrade in tissues, biodegradable polymers hold immense promise as new materials for implantable biomedical microdevices. This work focuses on establishment of microfabrication processes for biodegradable microstructures and microdevices. Three unique fabrication processes have been established: (1) micro-molding process to form 3D microstructures in polycaprolactone (PCL) via a silicon micromachined mold; (2) a method of transferring metal patterns to surfaces of PCL substrates; (3) techniques for sealing both dry and liquid-filled PCL micro-cavities with a metal thin film (e.g. gold). Chemical compatibility of PCL with common micromachining chemicals have been investigated.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114801938","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 128
Micromachined rubber O-ring micro-fluidic couplers 微加工橡胶o型圈微流体耦合器
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838590
T. Yao, Sangwook Lee, W. Fang, Y. Tai
{"title":"Micromachined rubber O-ring micro-fluidic couplers","authors":"T. Yao, Sangwook Lee, W. Fang, Y. Tai","doi":"10.1109/MEMSYS.2000.838590","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838590","url":null,"abstract":"In this paper, we present a novel type of a \"quick-connect\" for micro-fluidic devices realized by a simple silicone-rubber O-ring MEMS coupler. As shown in this work, the proposed O-ring couplers are easy to fabricate and utilize, reusable, can withstand high pressure (>60 psi), and provide good seals. In the paper, results from both the leak rate test and pull-out test are presented, demonstrating the functionality of the O-ring couplers.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114672317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 61
Static friction in elastic adhesive MEMS contacts, models and experiment 弹性黏着MEMS接触的静摩擦，模型和实验
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838515
N. Tas, C. Gui, M. Elwenspoek
{"title":"Static friction in elastic adhesive MEMS contacts, models and experiment","authors":"N. Tas, C. Gui, M. Elwenspoek","doi":"10.1109/MEMSYS.2000.838515","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838515","url":null,"abstract":"Static friction in shearing mode can be expressed as the product of the shear strength of the interface and the real contact area. The influence of roughness on friction in elastic adhesive contact is analyzed. Special attention is paid to low loading conditions, in which the number of contact points is small. The models are used to analyze a friction experiment in a MEMS friction meter.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123352156","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
3D nano wire-frame for handling and observing a single DNA fiber 用于处理和观察单个DNA纤维的3D纳米线框
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838582
T. Ooi, K. Matsumoto, M. Nakao, M. Otsubo, S. Shirakata, S. Tanaka, Y. Hatamura
{"title":"3D nano wire-frame for handling and observing a single DNA fiber","authors":"T. Ooi, K. Matsumoto, M. Nakao, M. Otsubo, S. Shirakata, S. Tanaka, Y. Hatamura","doi":"10.1109/MEMSYS.2000.838582","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838582","url":null,"abstract":"We developed a new process, \"3D-EBD (Electron Beam Deposition)\" to form 3D wire-frame and nanometer-sized structures. Using this process we formed a 20 nm diameter nano-probe on the tip of a glass needle, and extracted a single DNA fiber from a human chromosome using it. We are also applying it to a single DNA observation using SNOM (Scanning Near-field Optical Microscope).","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121283543","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
A novel fabrication process for high-aspect-ratio and co-axial multi-layer nickel microstructures 一种新型的高纵横比同轴多层镍微结构制备工艺
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838583
Ching‐Bin Lin, Mau-Kuo Wei, Chun-Hung Liu, Chung-Hsing Yen, Zhenguo Su, Yin-Teng Tai, Zhi-Hong Chen
{"title":"A novel fabrication process for high-aspect-ratio and co-axial multi-layer nickel microstructures","authors":"Ching‐Bin Lin, Mau-Kuo Wei, Chun-Hung Liu, Chung-Hsing Yen, Zhenguo Su, Yin-Teng Tai, Zhi-Hong Chen","doi":"10.1109/MEMSYS.2000.838583","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838583","url":null,"abstract":"A novel process of high-aspect-ratio metallic microstructures is proposed. The process combines protective film coating, laser drilling, swelling of polymers, electroforming and demolding. The pattern accuracy of metallic microstructures is controlled not only by laser drilling but also by swelling of polymers, because the diameter of drilled holes decreases to a certain value after the treatment of swelling. Using this process, a micro-post-array nickel mold and a precisely co-axial multi-layer nickel microstructure with a high aspect ratio of about 100 and a thickness of 5 mm is produced. The advantages of this process include low cost, simple procedures, and easy demolding.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124909274","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Direct writing for three-dimensional microfabrication using synchrotron radiation etching 用同步辐射蚀刻直接写入三维微加工
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838578
T. Katoh, N. Nishi, M. Fukagawa, H. Ueno, S. Sugiyama
{"title":"Direct writing for three-dimensional microfabrication using synchrotron radiation etching","authors":"T. Katoh, N. Nishi, M. Fukagawa, H. Ueno, S. Sugiyama","doi":"10.1109/MEMSYS.2000.838578","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838578","url":null,"abstract":"This paper presents rapid three-dimensional microfabrication technologies for PTFE by direct writing with the TIEGA process, a LIGA-like process which replaces hard X-ray lithography with synchrotron radiation (SR) direct photo-etching. The etching rates of this process are of the order of 6-100 /spl mu/m/min, depending on the photon flux of the SR light. An X-ray lathe has been modified into an SR etching lathe to form cylindrical, helical, pyramidal, ellipsoidal, and other nonplanar objects. A metallic wire covered with a PTFE sheet is rotated and/or moved while being irradiated with SR through a mask. Moreover, direct writing without using any masks has been developed, by combining a scanning stage with a high degree of freedom under an He atmosphere, for creating any microstructure. The capabilities of these technologies and initial fabrication results are described here.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"708 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114083087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 59
Development of chain-type micromachine for inspection of outer tube surfaces (basic performance of the 1st prototype) 链式外管表面检测微机的研制(1台样机基本性能)
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838621
M. Takeda, K. Namura, K. Nakamura, N. Shibaike, T. Haga, H. Takada
{"title":"Development of chain-type micromachine for inspection of outer tube surfaces (basic performance of the 1st prototype)","authors":"M. Takeda, K. Namura, K. Nakamura, N. Shibaike, T. Haga, H. Takada","doi":"10.1109/MEMSYS.2000.838621","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838621","url":null,"abstract":"Using micromachine technology, we have developed the first prototype of a multiple distributed micromachine system, in which a micromachine can be driven in both the horizontal and vertical directions and automatically connect to and disconnect from adjacent micromachines. The developed micromachine is the world's smallest machine (width: 9 mm, length: 5 mm, height: 6.5 mm, weight: 0.42 g) that can travel in both the horizontal and vertical directions. This paper gives an overview of the prototype and its travel and connection/disconnection performance. The following conclusions were obtained: (1) The developed magnetic wheel-driven micromachine is able to travel both horizontally and vertically. (2) Automatic connection and disconnection are realized by using newly developed microconnectors.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"251 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114158430","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
Surface micromachined bridge configurations for accurate angle measurements 表面微机械桥配置精确的角度测量
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838501
J.R. Kaienburg, M. Huonker, R. Schellin
{"title":"Surface micromachined bridge configurations for accurate angle measurements","authors":"J.R. Kaienburg, M. Huonker, R. Schellin","doi":"10.1109/MEMSYS.2000.838501","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838501","url":null,"abstract":"This paper reports on new sensing elements and the corresponding read-out circuit of a novel silicon surface micromachined angle sensor. Different bridge configurations-half and full bridges-comprising up to four variable capacitors were designed and characterized. The combination of such array-like arrangements and further improved sensing elements lead to a significant increase of performance. In this paper modeling, the evaluation circuit, and experimental results of different bridge configurations are presented.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122659530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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