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Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)最新文献

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An air flow sensor modeled on wind receptor hairs of insects 以昆虫毛发的风感受器为模型的气流传感器
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838573
Yoshihiro Ozaki, Tomoyuki Ohyama, T. Yasuda, I. Shimoyama
{"title":"An air flow sensor modeled on wind receptor hairs of insects","authors":"Yoshihiro Ozaki, Tomoyuki Ohyama, T. Yasuda, I. Shimoyama","doi":"10.1109/MEMSYS.2000.838573","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838573","url":null,"abstract":"A new conceptual air flow sensor modeled on wind-receptor hairs of insects which can detect low velocity air flow is demonstrated. Since the viscous force is dominant at micro size, the velocity of air flow can be determined by measuring the force on a sensory hair. Two mechanical structures modeled on insect sensory hairs have been fabricated. An array of a 1-DOF (Degree Of Freedom) sensory hairs has selectivity of frequencies. A 2-DOF sensory hair array can detect the direction angle of air flow. Both sensors have cantilevers and strain gauges fabricated at the bottom of the sensory hairs. The output voltage was proportional to the velocity of air flow in good agreement with the theory. Both the 1-DOF sensory hair and the 2-DOF sensory hair arrays detected the velocity of air flow from several tens of cm/s to 2 m/s. Also, the 2-DOF sensory hair array detected the direction angle of 360 degrees as a function of a sinusoidal curve.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131518505","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 130
An electrostatically-actuated MEMS switch for power applications 一种用于电源应用的静电驱动MEMS开关
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838592
Jo-ey Wong, Jeffrey H. Lang, Martin, Schmidt
{"title":"An electrostatically-actuated MEMS switch for power applications","authors":"Jo-ey Wong, Jeffrey H. Lang, Martin, Schmidt","doi":"10.1109/MEMSYS.2000.838592","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838592","url":null,"abstract":"This paper presents the design, analysis, fabrication, and testing of an electrostatically-actuated MEMS power switch. The device can be switched electrostatically (20 V), pneumatically (1200 Pa), or through combined actuation. Prototype switches carry currents in excess of 400 mA in either current direction with a contact resistance as low as 14 m/spl Omega/. Their off-state resistance is higher than the 30 M/spl Omega/ limit of the test equipment. Breakdown voltages of 300 V have been achieved across their small air gaps. Their nominal switching time is 20 ms. Extended lifetime testing has not been carried out but our tests to date show that the prototype switches operate more than 4000 cycles without significant degradation in their contact resistance. Finally, a protective switching scheme is proposed to minimize contact wear due to arcing during switch opening and closing.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134623067","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 53
New amorphous alloys as micromaterials and the processing technologies 新型非晶合金微材料及其加工技术
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838531
Y. Saotome, A. Inoue
{"title":"New amorphous alloys as micromaterials and the processing technologies","authors":"Y. Saotome, A. Inoue","doi":"10.1109/MEMSYS.2000.838531","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838531","url":null,"abstract":"Microformability of new amorphous alloys in the supercooled liquid state and microforming techniques for the materials are shown. In the supercooled liquid state, the materials reveal perfect Newtonian viscous flow characteristics and furthermore exhibit an excellent property of microformability on a submicron scale. Microforming techniques are shown as follows; microextrusion with micro-dies made of photochemically machinable glass and made of laser-micromachined polyimide, submicron imprinting with silicon die fabricated by EB lithography and etching, microforging of microgear of 10 /spl mu/m in module with microdie fabricated by UV-LIGA process. As a result, the materials are expected to become some of the most useful materials for fabricating MEMS.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133337444","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
Microfabricated tunable bending stiffness device 微加工可调弯曲刚度装置
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838484
O. Tabata, S. Konishi, P. Cusin, Y. Ito, F. Kawai, S. Hirai, S. Kawamura
{"title":"Microfabricated tunable bending stiffness device","authors":"O. Tabata, S. Konishi, P. Cusin, Y. Ito, F. Kawai, S. Hirai, S. Kawamura","doi":"10.1109/MEMSYS.2000.838484","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838484","url":null,"abstract":"This paper reports a device with tunable bending stiffness realized by microfabrication technology. Based on the newly proposed principles, two types of devices whose bending stiffness were controlled by electrostatic force and pneumatic force were fabricated. From the analysis and experiments, the feasibility of the proposed principles were confirmed and the performances of the prototyped devices were demonstrated.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"318 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115834340","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 24
Microscale tribology (friction) measurement and influence of crystal orientation and fabrication process 微尺度摩擦学(摩擦)测量及其对晶体取向和制造工艺的影响
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838596
Quanfang Chen, G. Carman
{"title":"Microscale tribology (friction) measurement and influence of crystal orientation and fabrication process","authors":"Quanfang Chen, G. Carman","doi":"10.1109/MEMSYS.2000.838596","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838596","url":null,"abstract":"A microscale tribology test system has been developed at UCLA to measure friction and wear in MEMS components. Test results indicate that microscale friction may not follow Amontons' law that states the friction force is only related to the normal force with a coefficient of friction. In this study, test data indicate that the friction coefficient is not constant and it's influenced by crystal orientation, apparent contact area, MEMS material, and fabrication process, as well as the normal force applied. Explanation for the discrepancy may be related to adhesion, which is a critical issue at microscale.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"98 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115794524","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
A new deep reactive ion etching process by dual sidewall protection layer 一种新的双侧壁保护层深度反应离子刻蚀工艺
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838529
J. Ohara, K. Kano, Y. Takeuchi, N. Ohya, Y. Otsuka, S. Akita
{"title":"A new deep reactive ion etching process by dual sidewall protection layer","authors":"J. Ohara, K. Kano, Y. Takeuchi, N. Ohya, Y. Otsuka, S. Akita","doi":"10.1109/MEMSYS.2000.838529","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838529","url":null,"abstract":"This paper describes a new deep reactive ion etching (D-RIE) process which drastically improves the aspect ratio of the etched trench. The conventional D-RIE process obtains the high aspect ratio trench etching with the protection layer, such as a polymeric layer. The etching anisotropy is limited in this process because this protection layer prevents not only lateral etching, but also vertical etching. In contrast, the new process we developed intensively prevents lateral etching with a dual protection layer consists of a polymeric layer and a SiO/sub 2/ layer on the trench sidewall. Therefore the etching anisotropy and the aspect ratio can be improved. Furthermore, this process can only be performed by switching the introducing gas into the etching chamber.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114686177","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 19
Wafer level vacuum packaged de-coupled vertical gyroscope by a new fabrication process 晶圆级真空封装解耦垂直陀螺仪的新工艺
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838571
H. Song, Y. Oh, I. Song, S. Kang, S. Choi, H. Kim, B. Ha, S. Baek, C. Song
{"title":"Wafer level vacuum packaged de-coupled vertical gyroscope by a new fabrication process","authors":"H. Song, Y. Oh, I. Song, S. Kang, S. Choi, H. Kim, B. Ha, S. Baek, C. Song","doi":"10.1109/MEMSYS.2000.838571","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838571","url":null,"abstract":"A highly reliable, wafer level vacuum packaged and de-coupled vertical microgyroscope was developed. The de-coupled gyroscope which had four driving springs and two sensing springs was designed and fabricated. A new fabrication process which could realize a high aspect ratio and use a thick single crystalline silicon as a structure layer, was proposed. The vacuum environment for operating a vibratory gyroscope was accomplished with vacuum packaging at wafer level. The vacuum level of ambient pressure was about 150 mtorr. The resolution of the gyroscope was 0.013/spl deg//sec/Hz/sup 1/2/. The output nonlinearity was below 2% in /spl plusmn/100/spl deg//s full scale.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126681964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
Microfluidic oscillator using vapor bubble on thin film heater 薄膜加热器蒸汽泡微流控振荡器
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838554
K. Takahashi, K. Nagayama, T. Asano
{"title":"Microfluidic oscillator using vapor bubble on thin film heater","authors":"K. Takahashi, K. Nagayama, T. Asano","doi":"10.1109/MEMSYS.2000.838554","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838554","url":null,"abstract":"A novel microfluidic actuator of heater-bubble system is proposed, where a nucleated microbubble rolls right and left repeatedly without any periodic external signal, which means that such bubble motion is applicable as an oscillator. This actuation principle is based on the Marangoni effect and boiling heat transfer, which work as the attraction and release mechanisms respectively. Experimental results show that the frequency of this automatic oscillation is dependent on both bubble size and heater geometry. The surrounding liquid temperature is also a key factor for the feasibility of such motion. The major microfluidic phenomena realizing this actuator are analyzed and discussed qualitatively.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125068484","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Micromachined piezoelectric elastic force motor (EFM) 微机械压电弹性力马达(EFM)
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838489
L. Dellmann, G. Racine, N. D. de Rooij
{"title":"Micromachined piezoelectric elastic force motor (EFM)","authors":"L. Dellmann, G. Racine, N. D. de Rooij","doi":"10.1109/MEMSYS.2000.838489","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838489","url":null,"abstract":"This paper will focus on the fabrication and characterization of two types of piezoelectric motors based on the elastic force motor principle. The initial motivation for this work was the development of a motor for wristwatch applications, combining high torque (1 /spl mu/m) with low power consumption (10 /spl mu/W) and small dimensions. Previously reported motors were based on a hybrid assembly of a copper-beryllium rotor, obtained by laser cutting, and a stator consisting of a circular membrane, clamped along its border. The membrane was anisotropically etched in silicon and covered with either ZnO or PZT. We report on an improved and further miniaturized version with fully microfabricated rotors and a new stator design.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"187 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116487296","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Single crystal silicon (SCS) micromirror arrays using deep silicon etching and IR alignment 单晶硅(SCS)微镜阵列采用深硅蚀刻和红外对准
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838558
C.S.B. Lee, R. Webb, J. M. Chong, N. MacDonald
{"title":"Single crystal silicon (SCS) micromirror arrays using deep silicon etching and IR alignment","authors":"C.S.B. Lee, R. Webb, J. M. Chong, N. MacDonald","doi":"10.1109/MEMSYS.2000.838558","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838558","url":null,"abstract":"10/spl times/10 and 5/spl times/5, a high mirror fill factor (>70%), low voltage operation (<30 V), single crystal silicon (SCS) micromirror arrays have been designed, fabricated, and tested. Each mirror is 320 /spl mu/m by 170 /spl mu/m and is individually addressable. In comparison to thin film micro-mirror arrays, the SCS mirror surface is optically flat and smooth, free of residual stress, and highly reflective after the deposition of a thin aluminum layer. In addition to a flat mirror, high-aspect-ratio grating structures have been fabricated on the surface of the mirrors, enhancing the optical manipulation potential of devices.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134233129","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
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