Ball semiconductor technology and its application to MEMS

Abstract

This paper describes Ball semiconductor technology that realizes integrated circuits and other devices on 1-milimeter sphere. Single crystallization, no-contact processing, spherical lithography, 3D VLSI design and VLSI by clustering are five key enabling technologies of the Ball semiconductor. Three major product categories of the Ball, integrated circuits, RF applications and MEMS (Micro Electro Mechanical System), are described here. Especially electro-statically levitated 3-axis accelerometer is mentioned as an application of Ball semiconductor technology to MEMS.