ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)最新文献_第9页

Experimental investigation of a porous heat sink characterized by straight circular ducts 直圆管多孔散热器的实验研究

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866195

H.Y. Zhang, X.Y. Huang

引用次数: 0

Effects of plasticity on reliability in multilayered electronic packages 塑性对多层电子封装可靠性的影响

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866203

M. Shaw, J. He, J. Mather, R. Addison

引用次数: 11

Applications of speckle metrology to vibration and deformation measurements of electronic devices 散斑测量在电子设备振动和变形测量中的应用

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866199

G. Jin, X. Yao, N. K. Bao

引用次数: 10

Computational parameter study of chip scale package array cooling 芯片级封装阵列冷却计算参数研究

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866168

S. P. Watson, B. Murray, B. Sammakia

{"title":"Computational parameter study of chip scale package array cooling","authors":"S. P. Watson, B. Murray, B. Sammakia","doi":"10.1109/ITHERM.2000.866168","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866168","url":null,"abstract":"This paper describes the results of a computational investigation into the thermal management of chip scale package arrays. The parameters considered include power dissipation, cooling air inlet velocity, chip package spacing, and circuit board conductivity. The geometry used throughout the study was an array of five packages placed on board with forced air cooling along the axis of the array. Each chip was the same size and dissipated the same amount of power. Free convection was included with gravity aligned normal to the plane of the circuit board. The effects of thermal radiation were neglected and the flow was considered to be laminar. Three dimensional solutions were generated using the commercial computational fluid dynamics code FLOTHERM. Results are presented in the form of thermal resistances for each package in the array. A number of interesting results were found. For the case of low conductivity circuit boards, the resistance for the first package in the array was a function of inlet velocity only. However, this was not the case when power planes were present and energy was conducted more effectively along the board. For low inlet velocities, when there are strong natural convection effects, there was a temperature overshoot such that the highest temperature does not occur in the last package of the array. Finally, when the effects of natural convection were small, the thermal resistance was relatively insensitive to the power dissipation.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116442883","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Stress/strength and reliability evaluations on UBM in different solder systems 不同焊料系统中UBM的应力/强度和可靠性评估

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866191

Y. Guo, S. Kuo, L. Mercado

引用次数: 5

Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection 通过实验分析，评价了印刷电路板结构对四种封装类型在自然对流和强制对流条件下热性能的影响

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866194

J. Lohan, P. Tiilikka, P. Rodgers, Carl-Magnus Fager, J. Rantala

{"title":"Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection","authors":"J. Lohan, P. Tiilikka, P. Rodgers, Carl-Magnus Fager, J. Rantala","doi":"10.1109/ITHERM.2000.866194","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866194","url":null,"abstract":"As the functionality of electronic systems increase, so does the complexity of printed circuit board (PCB) design, with greater component packing densities requiring additional internal signal, power and ground layers to facilitate interconnection. The extra copper content introduced increases PCB thermal conductivity and heat spreading capability, which can strongly influence component operating temperature. Therefore, this experimental study sought to quantify the impact of PCB construction on component operating temperature and relate this sensitivity to the package design, PCB effective conductivity and convective environment. This was achieved by measuring the steady state thermal performance of four package types (PSO20: heat slug up, PSO20: heat slug down, LFBGA80 and SBGA352) on up to six different, single-component thermal test PCBs in the standard natural and forced convection environments. Test velocities ranged from 0.5 m/s to 5.0 m/s and all test components contained a thermal test die. Measurements of junction temperature and component-PCB surface temperature distributions are both presented for power dissipation levels within the range 0.5 to 6.0 Watts. The study includes the low and high conductivity JEDEC standard, FR4-based test PCBs and typical application boards. As each PCB had a different internal structure and effective thermal conductivity, this study highlights the sensitivity of component operating temperature to the PCB, provides benchmark data for validating numerical models, and helps one assess the applicability of standard junction-to-air thermal resistance (/spl theta//sub JA/ and /spl theta//sub JMA/), as well as both junction-to-board (/spl Psi//sub JB/) and junction-to-top (/spl Psi//sub JT/) thermal characterisation parameters for design purposes on nonstandard PCBs.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125283099","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 22

Solder reflow prediction of hybrid pad packaging system 混合焊盘封装系统焊料回流预测

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866212

K. Chiang, Chang-Ming Liu

{"title":"Solder reflow prediction of hybrid pad packaging system","authors":"K. Chiang, Chang-Ming Liu","doi":"10.1109/ITHERM.2000.866212","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866212","url":null,"abstract":"In this work, a methodology of solder reflow geometry prediction for hybrid-pad-shapes (HPS) system is developed. In the reflow process, many parameters will influence the final joint shapes and there is no accurate closed-form solution for non-axisymmetric type solder pad prediction such as elliptical and rectangular pads. However, conventional approach like energy-based simulation model for predicting geometries in multiple/hybrid joint arrays is very difficult and time consuming. This work presents an approach combining the analytical and the energy-based methods and is capable of solving any kind of HPS system, such as round, elliptical, and rectangular pads. Furthermore, a detailed geometry information of the solder joints can be transferred to any conventional pre-processor/solver such as MSC/PATRAN, MSC/NASTRAN, LS-DYNA3D, ABAQUS and ANSYS for reliability analyses. The objective of this work for predicting multiple/hybrid solder reflow geometries in ball grid array type interconnects is to achieve optimal joint geometries from the standpoint of improved yield and better reliability cycles under thermal loading. Furthermore, results presented in this study can be used as a reference for area array interconnects design.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125441090","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Two stage monolithic thin film coolers 两级整体式薄膜冷却器

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866169

C. LaBounty, A. Shakouri, P. Abraham, J. Bowers

引用次数: 2

Thermal characterization of point of used power supply 使用电源点的热特性

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866217

G. Refai-Ahmed, S. Basit

{"title":"Thermal characterization of point of used power supply","authors":"G. Refai-Ahmed, S. Basit","doi":"10.1109/ITHERM.2000.866217","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866217","url":null,"abstract":"A numerical and experimental study of convection heat transfer on a point of used power supply, PUPS, was conducted to determine its thermal performance. The present investigation performed a series of experiments in both free and forced convection modes. The numerical model was also developed to validate the experimental data. The present work also introduced a thermal compact model for the PUPS. This thermal compact model is function of the temperature of the motherboard, ambient temperature, and the thermal resistances between the surface of the PUPS to the air, R/sub sa/ and the surface of the PUPS to the motherboard, R/sub sb/. The thermal resistances of the thermal compact model were derived from the experimental results. In addition, the relationships between the thermal resistances of the PUPS and both Rayleigh and Reynolds numbers were also obtained. Finally, the thermal performance of the PUPS in convective heat transfer was determined. The present methodology of the thermal characterization of the present PUPS can be applied to any PUPS, which is commonly used in telecommunication products.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"266 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116064897","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

The development of a tool to predict package level thermal interface material performance 一种预测封装级热界面材料性能的工具的开发

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866807

G. Solbrekken, C. Chiu, B. Byers, D. Reichebbacher

引用次数: 33