塑性对多层电子封装可靠性的影响

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI:10.1109/ITHERM.2000.866203

M. Shaw, J. He, J. Mather, R. Addison

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引用次数: 11

摘要

研究了多层电子封装内大面积焊点在反复热循环作用下的本构响应对焊点可靠性的影响。研究了具有弹性和随时间变化的塑性流动(粘塑性)的焊料。根据传统的低周疲劳模型，表现出广泛粘塑性的焊料表现出疲劳裂纹，可以按照裂纹起裂的Coffin-Manson方法进行建模。随后的裂纹扩展很明显。相比之下，表现出弹性响应的焊料表现出明显较低的疲劳裂纹形核和扩展速率。然后，这些结果与包的总体设计理念相关。

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Effects of plasticity on reliability in multilayered electronic packages

The effect of the constitutive response of the solder material on the reliability of large area solder joints within multilayered electronic packages is investigated subject to repeated thermal cycling. Solders that exhibit elastic and time-dependent plastic flow (viscoplasticity) were investigated. In accordance with traditional low-cycle fatigue models, the solder that exhibited extensive viscoplasticity exhibited fatigue cracking that can be modelled following a Coffin-Manson approach for crack initiation. Subsequent crack growth was pronounced. In contrast, the solder that exhibited an elastic response exhibited a substantially lower fatigue crack nucleation and growth rate. These results are then related to the overall design philosophy of the package.

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ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)

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