ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)最新文献

{"title":"Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages","authors":"M. Rencz, V. Székely, Z. Kohári, B. Courtois","doi":"10.1109/ITHERM.2000.866817","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866817","url":null,"abstract":"The SIP9 and SP10 packages are cheap plastic packages applicable for a broad range of MEMS applications. They are frequently used for packaging thermally operated MEMS, so knowing the thermal characteristics of the packages is very important. The paper presents an exhaustive thermal analysis of these packages, with various simulation tools and measurements. From the numerous experiments we draw conclusions not only about the thermal behaviour of the packages, but about the comparative features of the applied simulation and measurement tools as well. We compare the effectiveness of 2D and 3D simulation tools, discussing the advantages and drawbacks for the present applications. Both simulation based and measurement based transient thermal compact models are presented and evaluated.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115225275","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A methodology for the design of perforated tiles in raised floor data centers using computational flow analysis","authors":"S. Kang, R. Schmidt, K. Kelkar, A. Radmehr, S. Patankar","doi":"10.1109/ITHERM.2000.866828","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866828","url":null,"abstract":"Data centers are used to house multiple servers, mainframes, supercomputer systems, and storage systems used in business data processing and scientific analysis. Typically, data processing (DP) equipment is cooled using forced flow of air. Modular chillers are commonly used to cool the hot air exhausted from the DP equipment and a raised floor to recirculate the conditioned air back into the room. Therefore, data centers need well-designed ventilation systems, appropriate placement of the DP equipment, and modular chillers to ensure that the air used for cooling the processing equipment is within the desired temperature range. An important aspect of the design of data centers involves sizing of the perforated floor tiles for return of cold air, the size of the space under the raised floor, and placement of the DP equipment and modular chillers. The flow through individual perforated tiles needs to fulfil the cooling requirements of the computer equipment placed adjacent to them. The novelty of the paper lies in the treatment of the volume under the raised floor as a uniformly pressurized plenum. The accuracy of the Pressurized Plenum model is demonstrated with reference to a Computational Fluid Dynamics (CFD) analysis of the recirculating flow under the raised floor and the limits of its validity are also identified. The simple model of the volume under the raised floor enables use of the technique of Flow Network Modeling (FNM) for the prediction of the distribution of flow rates exiting from the various tiles. An inverse design method is proposed for one-step design of the perforated tiles and flow balancing plates for individual chillers. Subsequent use of the FNM technique enables assessment of the performance of the actual system. Further, modifications to an existing system design needed to accommodate the changes in the cooling requirements can also be evaluated using the FNM analysis in a simple, quick, and accurate manner. The resulting design approach is very simple and efficient, and is well suited for the design of modern data centers.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115402068","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A novel method of cooling electronic packages using a porous channel heat sink subjected to oscillating flow","authors":"H. Fu, K. Leong, X.Y. Huang, C.Y. Liu","doi":"10.1109/ITHERM.2000.866186","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866186","url":null,"abstract":"In this paper, a novel method of cooling electronic components using a porous channel heat sink has been developed. Experiments have been conducted to study the heat transfer of the porous channel heat sink subjected to oscillating flow. The surface temperature distributions for both steady and oscillating flows were measured. The local and length-averaged Nusselt numbers were measured and analyzed. The experimental results revealed that the surface temperature distribution for oscillating flow is more uniform than that for steady flow. Due to the reversing flow direction, there are two thermal entrance regions for oscillating flow. The length-averaged Nusselt number for oscillating flow is much higher than that for steady flow. The porous channel heat sink subjected to oscillating flow can be considered as an effective method for cooling high-speed electronic devices.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114658705","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Benchmarking mid-range CAD tools in a diverse product environment: recommendations and results","authors":"R. Bauernschub, D. E. King","doi":"10.1109/ITHERM.2000.866826","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866826","url":null,"abstract":"Processing power increases of recent years, coupled with decreasing costs of both hardware and software, have combined to dramatically improve product designers' access to CAD tools. Operations that were once only possible on expensive Unix-based workstations can now be performed on less expensive Windows-based personal computers. A new category of CAD tools (commonly described as \"mid-range\" tools) has emerged to exploit these trends. This paper outlines the process used to develop a custom benchmark test used to evaluate three mid-range CAD tools: Solid Edge v.6, Solid Works 98+, and Mechanical Desktop v.3. Specific objectives of the exercise were to compare the mid-range tools against the current Unix-based CAD tool in order to: (i) ascertain if significant \"ease-of-use\" could be realized, and (ii) determine what capabilities would be lost (if these tools replaced the current tool) or gained (if they were used to augment the current tool). Topics addressed include: identifying tool requirements, conducting initial screening, developing evaluation tests, specifying both objective and subjective scoring systems, performing the tests, and presenting the results to users and executive management. The effects of a diverse product line on the benchmarking activity are noted. Development of special requirements due to data transfer to and from other CAD and CAE tools is outlined.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116785228","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"High heat flux heat pipe mechanism for cooling of electronics","authors":"Z. Zuo, M. North, K. Wert","doi":"10.1109/ITHERM.2000.866180","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866180","url":null,"abstract":"This paper discusses an advanced heat pipe mechanism that has the potential of achieving heat flux capabilities over 250 W/cm/sup 2/. The mechanism utilizes thermally driven pulsating two-phase flow to achieve high heat flux capability and heat transfer coefficient. A simplified hydrodynamic model was developed to guide the proof-of-concept heat pipe design. A more detailed numerical model was also developed and is solved to predict the heat pipe's thermal performance. Test results of proof-of-concept heat pipes verified the heat flux capability of the advanced mechanism and the accuracy of the simplified model. Pulsating heat pipes are feasible approaches to removing increasing heat dissipation densities in electronic equipment.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116115980","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Conjugate mixed convection in a cooling duct","authors":"C. Andrade, E. L. Zaparoli","doi":"10.1109/ITHERM.2000.866848","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866848","url":null,"abstract":"This work reports a numerical study of the mixed convection in finned duct flow that occurs in heat sinks devices. The laminar flow is considered fully developed and the convection-conduction coupling is treated by a conjugated approach. The mathematical formulation of this problem is constituted by the mass, momentum and energy equations. This partial differential equations system is solved by the Galerkin finite element method, adopting a pressure Poisson equation to establish the pressure-velocity coupling and to obtain a mass conserving flow. It was studied the effect of duct aspect ratio on the heat transfer rate and friction coefficient. Also the influence of the fluid to wall conductivity ratio in the Nusselt number results was investigated. This analysis tool was shown appropriate for the optimization of electronic components air-cooled heat sinks.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122763860","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Vibration-induced droplet cooling of microelectronic components","authors":"S. Heffington, W. Black, A. Glezer","doi":"10.1109/ITHERM.2000.866210","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866210","url":null,"abstract":"This paper describes a unique two-phase cooling method that includes a closed heat transfer cell, similar to a thermosyphon that can be used to cool microelectronic packages. The cooling method is based upon a Vibration-Induced Droplet Atomization, or VIDA, process that can generate small liquid droplets inside a closed cell and propel them onto a heated surface. The VIDA technique involves the violent break-up of a liquid film into a shower of droplets by vibrating a piezoelectric actuator and accelerating the liquid film at resonant conditions. The droplets continually coat the surface with a thin liquid film, which evaporates on the heated surface, and the vapor is condensed on the internal surfaces of the heat transfer cell. The condensed liquid is returned via gravity to the piezoelectric actuator where it is again atomized. VIDA heat transfer cells ranging in diameter from 12 to 41 mm, which generate spherical droplets between 50 and 100 /spl mu/m, have been constructed. Test data described in this study include the operating characteristics of the VIDA cell as well as preliminary cooling capabilities for a small-scale cell that is suitable for cooling a desktop microprocessor. The VIDA process produces droplets of relatively uniform diameter, and the droplets have sufficient momentum to reach the remotely located heated source. Heat fluxes as high as 40 W/cm/sup 2/ have been measured when a chilled water jacket is used as the external heat removal device.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117297475","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Thermal management analysis of high-power electronic modules using Cu bonded AlN substrates","authors":"N. Tatoh, Y. Hirose, M. Nagai, K. Sasaki, N. Tatsumi, K. Higaki, H. Nakata, T. Tomikawa","doi":"10.1109/ITHERM.2000.866206","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866206","url":null,"abstract":"We have successfully developed a thermal management analysis technique that consists of computer simulation based on experimental data, to assume temperatures of high-power electronic modules using Cu bonded AlN substrates, which are used in electric vehicles (EVs) and hybrid electric vehicles (HEVs). An experimental system emulating a high power electronic module was assembled. With increasing electrical power, we observed a positive nonlinearity between the temperature on heaters and the input power. In order to explain this nonlinearity, we ascertained two important factors, the warpage of the substrate and the pore rate inside the Si-grease between the substrate and the Al plate. For ascertaining the warpage due to thermal stress, a movement of reflectance laser beam from a mirror put on the substrate was measured. We determined the pore rate of Si- grease by measuring the pore size inside the grease sandwiched between a clear glass plate and an Al plate on a heated plate. Inputting the pore rate into thermal-strain-interaction simulation, the calculated temperature was consistent with the experimental temperature within an error of less than 3 deg. C at a high power operation of 900 W.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123944485","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Thermal analysis of two protruding heaters mounted on a substrate plate suspended in an enclosure","authors":"E.B. Martins, C. Altemani","doi":"10.1109/ITHERM.2000.866846","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866846","url":null,"abstract":"An experimental and numerical investigation was performed to evaluate the relative contributions of thermal radiation, natural convection and conduction-to-substrate heat losses from protruding components mounted on a PCB in a sealed enclosure. The experimental apparatus consisted of an air filled enclosure of rectangular cross section where a substrate plate with two longitudinal protruding heaters mounted on one side was suspended. For a range of electric power dissipation in each heat source, several enclosure temperatures were measured under steady conditions and a global thermal resistance from each heater to the atmospheric air outside the enclosure was obtained. These results were compared with those from a two-dimensional numerical simulation combining the finite volumes and the radiosities methods, assuming gray surfaces behavior. The blockage effects of the substrate plate with both protruding heaters to thermal radiation inside the enclosure were taken into account in the numerical analysis. The resulting favorable comparison allowed confidence to the numerical evaluation of the desired relative contributions of the distinct heat loss mechanisms. Conduction-to-substrate was the major contribution, and contribution in the present experiments. The numerical radiation and natural convection had about the same simulation of an actual PCB with heat sources in a sealed enclosure should include all conjugate heat loss mechanisms.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121489274","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Packaging of a MEMS based safety and arming device","authors":"M. Deeds, Peter Sandborn, R. Swaminathan","doi":"10.1109/ITHERM.2000.866815","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866815","url":null,"abstract":"Packaging of MEMS devices introduces new challenges to the package architecture. MEMS systems introduce new interfaces, processes, and materials foreign to the IC packaging industry. To build reliable MEMS systems, failure modes must be activated and understood. In addition, the metrology techniques must be developed to interrogate critical aspects of the package. The system presented in this paper is a MEMS based safety and arming device (S&A) for underwater weapons. Critical components, packaged in various hermetic and non-hermetic configurations, are cycled through a series of metrologies and environmental conditioning.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"165 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121608654","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}