Thermal analysis of two protruding heaters mounted on a substrate plate suspended in an enclosure

E.B. Martins, C. Altemani
{"title":"Thermal analysis of two protruding heaters mounted on a substrate plate suspended in an enclosure","authors":"E.B. Martins, C. Altemani","doi":"10.1109/ITHERM.2000.866846","DOIUrl":null,"url":null,"abstract":"An experimental and numerical investigation was performed to evaluate the relative contributions of thermal radiation, natural convection and conduction-to-substrate heat losses from protruding components mounted on a PCB in a sealed enclosure. The experimental apparatus consisted of an air filled enclosure of rectangular cross section where a substrate plate with two longitudinal protruding heaters mounted on one side was suspended. For a range of electric power dissipation in each heat source, several enclosure temperatures were measured under steady conditions and a global thermal resistance from each heater to the atmospheric air outside the enclosure was obtained. These results were compared with those from a two-dimensional numerical simulation combining the finite volumes and the radiosities methods, assuming gray surfaces behavior. The blockage effects of the substrate plate with both protruding heaters to thermal radiation inside the enclosure were taken into account in the numerical analysis. The resulting favorable comparison allowed confidence to the numerical evaluation of the desired relative contributions of the distinct heat loss mechanisms. Conduction-to-substrate was the major contribution, and contribution in the present experiments. The numerical radiation and natural convection had about the same simulation of an actual PCB with heat sources in a sealed enclosure should include all conjugate heat loss mechanisms.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2000.866846","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

An experimental and numerical investigation was performed to evaluate the relative contributions of thermal radiation, natural convection and conduction-to-substrate heat losses from protruding components mounted on a PCB in a sealed enclosure. The experimental apparatus consisted of an air filled enclosure of rectangular cross section where a substrate plate with two longitudinal protruding heaters mounted on one side was suspended. For a range of electric power dissipation in each heat source, several enclosure temperatures were measured under steady conditions and a global thermal resistance from each heater to the atmospheric air outside the enclosure was obtained. These results were compared with those from a two-dimensional numerical simulation combining the finite volumes and the radiosities methods, assuming gray surfaces behavior. The blockage effects of the substrate plate with both protruding heaters to thermal radiation inside the enclosure were taken into account in the numerical analysis. The resulting favorable comparison allowed confidence to the numerical evaluation of the desired relative contributions of the distinct heat loss mechanisms. Conduction-to-substrate was the major contribution, and contribution in the present experiments. The numerical radiation and natural convection had about the same simulation of an actual PCB with heat sources in a sealed enclosure should include all conjugate heat loss mechanisms.
安装在悬挂在外壳中的底板上的两个突出加热器的热分析
通过实验和数值研究来评估安装在密封外壳中的PCB上的突出组件的热辐射、自然对流和传导到衬底的热损失的相对贡献。实验装置由一个矩形截面的充气外壳组成,其中悬挂有一侧安装有两个纵向突出加热器的基片。对于每个热源的电力耗散范围,在稳定条件下测量了几个外壳温度,并获得了每个加热器对外壳外大气空气的总体热阻。这些结果比较了从二维数值模拟结合有限体积和辐射率方法,假设灰色表面的行为。数值分析中考虑了带有两个突出加热器的基板对壳体内热辐射的阻塞效应。由此产生的有利比较允许对不同热损失机制的期望相对贡献的数值评估有信心。对衬底的传导是主要的贡献,在本实验中也是如此。数值辐射和自然对流对实际PCB的模拟基本相同,在密封外壳中热源应包括所有的共轭热损失机制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信