一种利用受振荡流影响的多孔通道散热器冷却电子封装的新方法

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI:10.1109/ITHERM.2000.866186

H. Fu, K. Leong, X.Y. Huang, C.Y. Liu

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引用次数: 1

摘要

本文提出了一种利用多孔通道散热片冷却电子元件的新方法。对振荡流动作用下多孔通道散热器的传热特性进行了实验研究。测量了稳定流和振荡流的表面温度分布。测量并分析了局部努塞尔数和长度平均努塞尔数。实验结果表明，振荡流动的表面温度分布比稳定流动的表面温度分布更均匀。由于流动方向的反转，振荡流动有两个热入口区。振荡流的长度平均努塞尔数远高于稳定流的长度平均努塞尔数。振荡流作用下的多孔通道散热片是高速电子器件冷却的一种有效方法。

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A novel method of cooling electronic packages using a porous channel heat sink subjected to oscillating flow

In this paper, a novel method of cooling electronic components using a porous channel heat sink has been developed. Experiments have been conducted to study the heat transfer of the porous channel heat sink subjected to oscillating flow. The surface temperature distributions for both steady and oscillating flows were measured. The local and length-averaged Nusselt numbers were measured and analyzed. The experimental results revealed that the surface temperature distribution for oscillating flow is more uniform than that for steady flow. Due to the reversing flow direction, there are two thermal entrance regions for oscillating flow. The length-averaged Nusselt number for oscillating flow is much higher than that for steady flow. The porous channel heat sink subjected to oscillating flow can be considered as an effective method for cooling high-speed electronic devices.

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ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)

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