用于电子设备冷却的高热流密度热管机构

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI:10.1109/ITHERM.2000.866180

Z. Zuo, M. North, K. Wert

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引用次数: 128

摘要

本文讨论了一种先进的热管机制，该机制有可能实现超过250 W/cm/sup / /的热流能力。该机构利用热驱动脉动两相流实现了高的热流通量和换热系数。建立了一个简化的流体动力学模型来指导热管的概念验证设计。还建立了一个更详细的数值模型，并进行了求解，以预测热管的热性能。概念验证热管的测试结果验证了先进机构的热流能力和简化模型的准确性。脉动热管是消除电子设备中日益增加的散热密度的可行方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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High heat flux heat pipe mechanism for cooling of electronics

This paper discusses an advanced heat pipe mechanism that has the potential of achieving heat flux capabilities over 250 W/cm/sup 2/. The mechanism utilizes thermally driven pulsating two-phase flow to achieve high heat flux capability and heat transfer coefficient. A simplified hydrodynamic model was developed to guide the proof-of-concept heat pipe design. A more detailed numerical model was also developed and is solved to predict the heat pipe's thermal performance. Test results of proof-of-concept heat pipes verified the heat flux capability of the advanced mechanism and the accuracy of the simplified model. Pulsating heat pipes are feasible approaches to removing increasing heat dissipation densities in electronic equipment.

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来源期刊

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)

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