ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)最新文献_第2页

A study of compact thermal model topologies in CFD for a flip chip plastic ball grid array package 倒装塑料球栅阵列封装的CFD紧凑热模型拓扑研究

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866843

S. Shidore, V. Adams, T. Lee

{"title":"A study of compact thermal model topologies in CFD for a flip chip plastic ball grid array package","authors":"S. Shidore, V. Adams, T. Lee","doi":"10.1109/ITHERM.2000.866843","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866843","url":null,"abstract":"A previously validated detailed model of a 119-pin Flip-Chip Plastic Ball Grid Array (FC-PBGA) package was created and validated against experimental data for natural convection and forced convection environments. Next, two compact models were derived, a two-resistor model (created using the JEDEC-standard based computational approach), and a multi-resistor model (created using the DELPHI optimization approach that was boundary condition independent within engineering accuracy). The compact models were placed in natural convection and forced convection (velocities of 1 and 2 m/s) environments with and without a heatsink. Based on the agreement obtained between the detailed model and compact model simulations, the accuracy and validity of the two compact models was assessed. Of the two compact thermal models considered, the Delphi multi-resistor model provided the same predictive estimates (within 5%) as simulations involving a detailed thermal model of the package in natural and forced convection environments both with and without attached heatsinks. Some thermal modeling issues were addressed with respect to implementation of compact thermal models with attached heatsinks.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"23 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127813309","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 39

Identification of minimum air flow design for a desktop computer using CFD modeling 利用CFD模型确定台式计算机的最小气流设计

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866844

J.Y. Chang, C. Yu, R. Webb

引用次数: 35

A comparison of using icepak and flotherm in electronic cooling 冰包与低温冷却在电子冷却中的比较

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866831

Michael Yang

{"title":"A comparison of using icepak and flotherm in electronic cooling","authors":"Michael Yang","doi":"10.1109/ITHERM.2000.866831","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866831","url":null,"abstract":"Simulation software is a good tool to reduce design cycles and prototypes. The accuracy of the results depend on the users' inputs. Software can provide very accurate results when the inputs are reliable. Software can provide very poor results if the model, boundary conditions, or solution parameters are not represented properly. The user, not the software, is responsible for the accuracy of the results. To adequately use software, the user must become familiar with the built in hnctions and their limits of applicability. You must have a complete understanding of thermal theory so you can judge when a calculated result is in error based on an error in your input. Both Flothenn and Icepak are popular thermal analysis computational fluid dynamics (CFD) software packages in electronic cooling. The scope of this comparison is not to be used by the reader as the only basis for selecting a CFD tool. The frst thermal study was conducted using Icepak and Flotherm to calculate heat transfer fiom an aluminum plate due to natural convection and forced convection (turbulent flow, 300 fpm) environment. Three different types of mesh sizes were compared to theory and experimental data. The second study was to simulate the thermal performance of a RF power amplifier in a steady state forced convection environment. Both Icepak and Flotherm can provide almost the same level of performance. The quality of the prediction depends on the users' background and experience.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124034613","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

Modeling contact between rigid sphere and elastic layer bonded to rigid substrate 模拟刚性球与粘接在刚性基板上的弹性层之间的接触

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866804

M. Stevanovic, M. Yovanovich, J. Culham

引用次数: 19

Response surface methodology for matrix PBGA warpage prediction 矩阵PBGA翘曲预测的响应面法

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866850

E. Egan, G. Kelly, T. O'Donovan, D. Murtagh, L. Herard

引用次数: 11

Inelastic behavior of microelectronics solder joints under concurrent vibration and thermal cycling 微电子焊点在同步振动和热循环下的非弹性行为

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866188

Y. Zhao, C. Basaran, A. Cartwright, T. Dishongh

{"title":"Inelastic behavior of microelectronics solder joints under concurrent vibration and thermal cycling","authors":"Y. Zhao, C. Basaran, A. Cartwright, T. Dishongh","doi":"10.1109/ITHERM.2000.866188","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866188","url":null,"abstract":"Concurrent vibration and thermal environment is commonly encountered in the service life of electronic packaging, such as automotive, airplane, military and mobile electronic devices. Solder joint reliability has been a critical issue of the overall design of microelectronic devices. However, the contribution of vibration to thermal fatigue life of solder joints has rarely been investigated. Vibration is taken as a loading case that only causes elastic material response. Literature is scarce on vibration plasticity and vibration caused fatigue. The standard practice in the industry is to use Miner's rule to calculate combined environment fatigue life. This study shows that using Miner's rule for fatigue life under combined loading is inaccurate. There are a number of models on thermomechanical behavior of solder joints, yet few models are verified by test data obtained from actual package size solder joints under realistic thermomechanical loading. The authors see the need of such tests for the purpose of better understanding of material behavior of solder joints under thermal and vibration loading and providing a solid basis for more accurate material modeling and fatigue life prediction. This paper reports observations from a series of concurrent thermal cycling and vibration tests on 63Sn/37Pb solder joints of an actual ball grid array (BGA) package. Moire interferometry (MI) is used to measure the inelastic deformation field of solder joints with submicron resolution, A large capacity Super AGREE thermal chamber and a high acceleration electrodynamic shaker is assembled together to perform the concurrent cycling. The cyclic plasticity of solder joints and microstructure evolution are discussed and related to fatigue life prediction.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130299371","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 22

High-pressure polycrystalline diamond as a cost effective heat spreader 高压聚晶金刚石作为一种性价比高的散热材料

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866839

S. Dahlgren, H. T. Hall

引用次数: 6

Estimation of the thermal-mechanical fatigue behavior of Sn/Pb solder joints 锡/铅焊点热-机械疲劳行为的估计

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866201

Xi-Shu Wang, Shou-wen Yu, N. Kawagoishi

{"title":"Estimation of the thermal-mechanical fatigue behavior of Sn/Pb solder joints","authors":"Xi-Shu Wang, Shou-wen Yu, N. Kawagoishi","doi":"10.1109/ITHERM.2000.866201","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866201","url":null,"abstract":"The thermal-mechanical fatigue tests were carried out at the different temperatures, axial push pull loading and both coupling cases. So that investigate the fatigue stress and/or strain in surface of specimens for Sn/Pb solder joints. Moreover, the relationship between the thermal-mechanical cyclic stress and strain were discussed for estimation the fatigue stress/strain as well as fatigue crack growth rate. According to the results of the thermal-mechanical strain to be analyzed, the thermal-mechanical fatigue stress or strain can be nearly estimated by the experimental results. And the fatigue crack growth rate can also be expressed by the term /spl Delta//spl epsi//sub eqp.//sup n'/ l using the measured strain range under the disproportional loading of thermal-mechanical coupling. The results were compared with both 62Sn38Pb and 62Sn36Pb2Ag in different experimental data. On the other hand, experimentally obtained the either thermal, mechanical or both coupling fatigue crack growth rate can be evaluated based on the small crack growth law, for many electronic solder joints materials. It is possible that thermal-mechanical fatigue crack growth rate the solder joints or/and fatigue life easily and practically predicted based on the small crack growth law.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"2010 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117054321","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Evaluation of die edge cracking in flip-chip PBGA packages 倒装PBGA封装中模具边缘裂纹的评估

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866173

L. Mercado, V. Sarihan

{"title":"Evaluation of die edge cracking in flip-chip PBGA packages","authors":"L. Mercado, V. Sarihan","doi":"10.1109/ITHERM.2000.866173","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866173","url":null,"abstract":"Increasing die size and large CTE (Coefficient of Thermal Expansion) mismatch in FC-PBGA (Flip-Chip Plastic Ball Grid Array) packages have made die fractures a major failure mode during reliability testing. Most die fractures observed before was die backside vertical cracking, which was caused by excessive package bending and backside defects. However, due to die edge defects induced by the singulation process and the choice of underfill material, an increasing number of die cracks were found to initiate from die edge and propagate horizontally across the die. In order to improve package reliability and performance, die edge cracking has to be eliminated. An extensive finite element analysis was completed to investigate die edge cracking and find its solutions. A fracture mechanics approach was used to evaluate the effect of various package parameters on die edge initiated fractures. Strain energy release rate was found to be an effective technique for evaluating die edge initiated fractures from singulation-induced flaws. The impact of initial flaw size and a variety of package parameters was investigated. Unlike in die backside cracking, the dominant parameters causing die edge horizontal fractures are more closely related to local effects.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115756160","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 42

Characterization of a thermal interface material for burn-in application 一种用于老化的热界面材料的表征

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866805

N. Dean, A. Gupta

引用次数: 8