ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)最新文献_第3页

Immersion-cooled heat sinks for electronics: insight from high-speed photography 浸没冷却散热器的电子产品:从高速摄影的见解

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866208

S. Bhavnani, Gilbert Fournelle, R. Jaeger

{"title":"Immersion-cooled heat sinks for electronics: insight from high-speed photography","authors":"S. Bhavnani, Gilbert Fournelle, R. Jaeger","doi":"10.1109/ITHERM.2000.866208","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866208","url":null,"abstract":"The development of effective heat sinks for the primary heat-dissipating component of a typical portable electronics device is an ongoing challenge. Thermal management using air-cooling is limited by the inherently poor thermal properties of the coolant. Other alternatives, including liquid immersion cooling, phase-change materials, and heat pipes, may merit consideration if the basic mechanisms can be reliably predicted. This study sheds light on the nucleation characteristics of an etched cavity-enhanced surface for use in an immersion-cooled heat sink. The target application is a high-density multi-chip module with several heat dissipating sources. High-speed photography was used to record parameters such as bubble interactions, bubble size, departure frequency and active site density while varying the cavity spacing and heat flux. The cavities, which are approximately 40 /spl mu/m, are arranged in a square cluster 12.7 mm on each side. It was determined that the contribution of latent heat as a heat dissipation mechanism is only minor (less than 16%). In addition, it is proposed that the latent heat dissipation percentage may be used as a thermal performance indicator. Interactions between neighboring heat sources were also studied. These interactions decreased the bubble departure frequency and thereby affected the latent heat contribution.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123466277","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 24

Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies 三层电子组件中的界面剪切应力、剥离应力和模具开裂应力

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866171

K. Wang, Y. Huang, A. Chandra, K. Hu

引用次数: 78

An engineering-of-failure approach to designing and executing an accelerated product qualification test 设计和执行加速产品确认试验的失效工程方法

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866835

M. Gibbel, T. Larson

{"title":"An engineering-of-failure approach to designing and executing an accelerated product qualification test","authors":"M. Gibbel, T. Larson","doi":"10.1109/ITHERM.2000.866835","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866835","url":null,"abstract":"An Engineering-of-Failure approach to designing and executing an accelerated product qualification test was performed to support a risk assessment of a \"work-around\" necessitated by an on-orbit failure of another piece of hardware on the Mars Global Surveyor spacecraft. The proposed work-around involved exceeding the previous qualification experience both in terms of extreme cold exposure level and in terms of demonstrated low cycle fatigue life for the power shunt assemblies. An analysis was performed to identify potential failure sites, modes and associated failure mechanisms consistent with the new use conditions. A test was then designed and executed which accelerated the failure mechanisms identified by analysis. Verification of the resulting failure mechanism concluded the effort. MIL STD. 883C calls out several tests that are intended to assess the qualify of wire bonds used in packaged semiconductor devices. Unfortunately, these same tests do not necessarily assure the reliability of these same wirebonds under field use conditions. This is particularly true for missions that involve a significant number of thermal cycles either as a result of power cycles or environmentally induced thermal cycles. This paper concludes with a brief discussion of this and its implications.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123775009","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Design for manufacturability of SISE parallel plate forced convection heat sinks SISE平行板强制对流散热器的可制造性设计

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866820

M. Iyengar, A. Bar-Cohen

引用次数: 59

Use of zero thickness conducting plate object in electronics cooling applications of CFD 零厚度导电板物体在电子冷却CFD中的应用

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866841

K. Karimanal, R. Nair

引用次数: 10

A practical die stress model and its applications in flip-chip packages 一个实用的模具应力模型及其在倒装封装中的应用

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866852

Y. Guo, Jie-Hua Zhao

引用次数: 17

IGBT package design for high power aircraft electronic systems 大功率飞机电子系统IGBT封装设计

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866220

F. Sarvar, D. Whalley

引用次数: 10

A method to predict failure of solder joints caused by thermal shock using finite element analysis for RF power amplifier applications 基于有限元分析的射频功率放大器焊点热冲击失效预测方法

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866187

M.C. Yang, Matt Cienkus, Michael Hajovsky, Tom Basey

{"title":"A method to predict failure of solder joints caused by thermal shock using finite element analysis for RF power amplifier applications","authors":"M.C. Yang, Matt Cienkus, Michael Hajovsky, Tom Basey","doi":"10.1109/ITHERM.2000.866187","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866187","url":null,"abstract":"Due to price competition, low-cost design plays an important role in the power amplifier (PA) market. The cost of new single board design saves about 50% of direct material cost. Other advantages include decreasing direct labor cost, increasing maximum power output, increasing PA efficiency, and decreasing piece part count. For quality and reliability of solder joints, liquid-to-liquid thermal shock test would be considered during the design cycle. It was postulated that the failure is related to the coefficient of thermal expansion (CTE) mismatch between different materials, in the PCB, heat spreader, lead, cast heat sink, and device. The high power RF devices used in power amplifiers for base station applications have pushed the requirements of advanced materials and processes to provide new low-cost packaging solutions. A methodology is presented for design option evaluation and failure possibility prediction for solder joints on single board power amplifier. This method integrates the finite element analysis models and experimental data. The finite element model identifies the displacement at the solder joint locations. Several sets of experimental tests have been conducted and analyzed to evaluate the design improvements. Good correlation has been achieved between finite element analysis (FEA) predictions and experimental tests on design options.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"198 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124426216","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Advanced thermal tester for accurate measurement of internal thermal resistance of high power electronic modules 先进的热测试仪，用于精确测量大功率电子模块的内部热阻

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866193

K. Sikka

引用次数: 14

Percolation theory applied to the analysis of thermal interface materials in flip-chip technology 渗透理论应用于倒装技术中热界面材料的分析

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866803

A. Devpura, P. Phelan, R. Prasher

{"title":"Percolation theory applied to the analysis of thermal interface materials in flip-chip technology","authors":"A. Devpura, P. Phelan, R. Prasher","doi":"10.1109/ITHERM.2000.866803","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866803","url":null,"abstract":"A very important aspect in chip design in flip chip technology is the heat dissipation. As the surfaces of the heat sink, the heat spreader and the chip are rough there are imperfect contacts leading to higher thermal resistance due to the contact resistance. A method to decrease this contact resistance is by the use of thermal interface material. These thermal interface materials can be of various types, but most of them are polymers. Percolation theory holds a key to understanding the behavior of these polymers. Percolation, used widely in electrical engineering, is a phenomenon in which the highly conducting particles distributed randomly in the matrix form at least one continuous chain connecting the opposite faces of the matrix. This phenomenon was simulated and analytical results drawn from the program, to study the effect of considering 2-D and 3-D cases, matrix thickness, volume percentage of particles, and base material and particles of different conductivity. The simulation program was based on the matrix method, which not only simplifies the method of calculation but also increases the accuracy of the result thus obtained as compared to the calculations based on Kirchoffs Law or systematic node elimination, to obtain resultant thermal conductivity of the mixture. The analysis showed a sudden increase in thermal conductivity as soon as the percentage of particles reached the percolation threshold, which varied with all the parameters listed above. Comparison with the existing experimental results and the other existing models showed that the results from the percolation model were more accurate than other models, especially at high filler concentration.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115458378","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 78