{"title":"零厚度导电板物体在电子冷却CFD中的应用","authors":"K. Karimanal, R. Nair","doi":"10.1109/ITHERM.2000.866841","DOIUrl":null,"url":null,"abstract":"Zero thickness conducting plates are CFD objects that may be used to model 3 dimensional conduction in thin objects used in electronic cooling applications. The use of zero thickness conducting plates, when applicable can result in significant reduction in finite volume element count. The validity of using these thin conducting plates for CFD modeling of certain objects frequently used in electronic systems was studied using ICEPAK, a CFD software for electronics cooling application.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Use of zero thickness conducting plate object in electronics cooling applications of CFD\",\"authors\":\"K. Karimanal, R. Nair\",\"doi\":\"10.1109/ITHERM.2000.866841\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Zero thickness conducting plates are CFD objects that may be used to model 3 dimensional conduction in thin objects used in electronic cooling applications. The use of zero thickness conducting plates, when applicable can result in significant reduction in finite volume element count. The validity of using these thin conducting plates for CFD modeling of certain objects frequently used in electronic systems was studied using ICEPAK, a CFD software for electronics cooling application.\",\"PeriodicalId\":201262,\"journal\":{\"name\":\"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)\",\"volume\":\"4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.2000.866841\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2000.866841","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Use of zero thickness conducting plate object in electronics cooling applications of CFD
Zero thickness conducting plates are CFD objects that may be used to model 3 dimensional conduction in thin objects used in electronic cooling applications. The use of zero thickness conducting plates, when applicable can result in significant reduction in finite volume element count. The validity of using these thin conducting plates for CFD modeling of certain objects frequently used in electronic systems was studied using ICEPAK, a CFD software for electronics cooling application.