{"title":"利用CFD模型确定台式计算机的最小气流设计","authors":"J.Y. Chang, C. Yu, R. Webb","doi":"10.1109/ITHERM.2000.866844","DOIUrl":null,"url":null,"abstract":"This paper reports the results of CFD analysis to cool the 30-W socketed CPU of a desktop computer with minimum air flow rate and minimum heat sink size. This was achieved using only the fan in the power supply for all air movement in the chassis. A duct was employed to direct the air flow over the CPU and then to the inlet air vents of the power supply. Use of this duct allowed more than 10/spl deg/C reduction of the CPU case temperature, relative to a unducted design. The CFD analysis results were confirmed by experiment, and the predicted CPU case temperatures agreed within /spl plusmn/2.9/spl deg/C of the experimental values for the ducted cases. This paper describes the methodology of CFD analysis for the heat sink/duct design, and describes experimental procedures to validate the predictions.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"35","resultStr":"{\"title\":\"Identification of minimum air flow design for a desktop computer using CFD modeling\",\"authors\":\"J.Y. Chang, C. Yu, R. Webb\",\"doi\":\"10.1109/ITHERM.2000.866844\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reports the results of CFD analysis to cool the 30-W socketed CPU of a desktop computer with minimum air flow rate and minimum heat sink size. This was achieved using only the fan in the power supply for all air movement in the chassis. A duct was employed to direct the air flow over the CPU and then to the inlet air vents of the power supply. Use of this duct allowed more than 10/spl deg/C reduction of the CPU case temperature, relative to a unducted design. The CFD analysis results were confirmed by experiment, and the predicted CPU case temperatures agreed within /spl plusmn/2.9/spl deg/C of the experimental values for the ducted cases. This paper describes the methodology of CFD analysis for the heat sink/duct design, and describes experimental procedures to validate the predictions.\",\"PeriodicalId\":201262,\"journal\":{\"name\":\"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"35\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.2000.866844\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2000.866844","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Identification of minimum air flow design for a desktop computer using CFD modeling
This paper reports the results of CFD analysis to cool the 30-W socketed CPU of a desktop computer with minimum air flow rate and minimum heat sink size. This was achieved using only the fan in the power supply for all air movement in the chassis. A duct was employed to direct the air flow over the CPU and then to the inlet air vents of the power supply. Use of this duct allowed more than 10/spl deg/C reduction of the CPU case temperature, relative to a unducted design. The CFD analysis results were confirmed by experiment, and the predicted CPU case temperatures agreed within /spl plusmn/2.9/spl deg/C of the experimental values for the ducted cases. This paper describes the methodology of CFD analysis for the heat sink/duct design, and describes experimental procedures to validate the predictions.