Modeling contact between rigid sphere and elastic layer bonded to rigid substrate

M. Stevanovic, M. Yovanovich, J. Culham
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引用次数: 19

Abstract

An approximate mechanical model is developed for predicting the radius of contact between a sphere and a layered substrate. The complex solution of Chen and Engel is reduced to the simple root finding procedure for the unknown contact radius. Numerical data from the model of Chen and Engel are obtained for several combinations of layer material. It is shown that with the proper selection of dimensionless parameters the numerical results fall on a single curve that is easily correlated. Radius predictions show good agreement with experimental measurements.
模拟刚性球与粘接在刚性基板上的弹性层之间的接触
建立了一个近似的力学模型来预测球与层状基底之间的接触半径。将Chen和Engel的复解简化为未知接触半径的简单寻根过程。从Chen和Engel的模型中得到了几种层状材料组合的数值数据。结果表明,在适当选择无量纲参数的情况下,数值结果落在一条易于关联的曲线上。半径预测结果与实验测量结果吻合良好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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