Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages

Abstract

The SIP9 and SP10 packages are cheap plastic packages applicable for a broad range of MEMS applications. They are frequently used for packaging thermally operated MEMS, so knowing the thermal characteristics of the packages is very important. The paper presents an exhaustive thermal analysis of these packages, with various simulation tools and measurements. From the numerous experiments we draw conclusions not only about the thermal behaviour of the packages, but about the comparative features of the applied simulation and measurement tools as well. We compare the effectiveness of 2D and 3D simulation tools, discussing the advantages and drawbacks for the present applications. Both simulation based and measurement based transient thermal compact models are presented and evaluated.