ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)最新文献_第8页

A computational model for the transient analysis of flat heat pipes 平板热管瞬态分析的计算模型

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866178

C. Sobhan, S. Garimella, V. Unnikrishnan

引用次数: 19

Experimental verification of a model for the optimization of pin fin heatsinks 引脚翅片散热器优化模型的实验验证

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866809

T. Zapach, T. Newhouse, J. Taylor, P. Thomasing

引用次数: 6

A high force low area MEMS thermal actuator 一种高力低面积MEMS热致动器

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866818

Michael J. Sinclair

{"title":"A high force low area MEMS thermal actuator","authors":"Michael J. Sinclair","doi":"10.1109/ITHERM.2000.866818","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866818","url":null,"abstract":"This paper presents a new type of MEMS (micro-electromechanical systems) actuator consisting of an array of in-plane micro-fabricated thermal buckle-beam actuators. The technology used in MEMS actuators is typically magnetic, electrostatic or thermal. Magnetic actuators may require special materials in the fabrication process while electrostatic actuators typically require high voltages, large chip areas and produce very low forces. Thermal actuators have seen some use in MEMS applications, the most popular being the pseudo-bimorph that relies on differential expansion of a cold and hot arm to cause it to bend in-plane (parallel to the substrate). These thermal actuators typically generate on the order of a few micro-Newtons each but can be combined for larger forces by linking with small tendons. A disadvantage of this type of actuator is that it moves in an are where most desired movements are linear. Also, when combined in an array, the linking tendons consume much of the energy in bending them. Also, arrays of these can still occupy a fairly large chip area. The electro-thermal actuator described here resembles a chevron where an array of buckle-beams are packed close together and link two common anchored arms with a movable third arm. Arrays can be made within a single released micromachined layer and generate many mN of force. Additional actuators can be arrayed with no coupling penalty and occupy much less area that an equivalent pseudo-bimorph actuator. Preliminary tests indicate that a 450/spl times/120 /spl mu/m array consumes 240 mW of power, deflection up to 14 /spl mu/m and can produce many milli-Newtons. A chip of actuator geometry variations and different applications has been fabricated and tested.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"87 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123487470","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 165

Preliminary examination of the modified lower-bound meso-damage constitutive model for porous materials 改进的多孔材料细观损伤下界本构模型的初步研究

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866200

Yajun Yin, Q. Fan, Bo Wang

引用次数: 0

Thermofluid analysis of staggered and inline pin fin heat sinks 交错和内联针翅散热器的热流体分析

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866822

A. Dvinsky, A. Bar-Cohen, M. Strelets

{"title":"Thermofluid analysis of staggered and inline pin fin heat sinks","authors":"A. Dvinsky, A. Bar-Cohen, M. Strelets","doi":"10.1109/ITHERM.2000.866822","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866822","url":null,"abstract":"A numerical study is performed of relative thermal and hydrodynamic efficiency of staggered and inline pin fin heat sinks. Advantages of the staggered over the inline design from the standpoint of cooling efficiency (under the same flow conditions) are evident. However, the staggered design has greater airflow resistance, leading to less airflow through the heat sink and a decrease in thermal efficiency. In this study we analyzed two sample pin fin heat sinks using the commercial CFD software Coolit. The heat sinks were placed on the bottom wall of a rectangular duct with thermally insulated walls. A heat source was located at the base of the heat sink. The major parameters of the process were the inlet velocity and the extent of shrouding defined by the distance from the heat sink to the duct walls. Both were varied to account for a wide range of flow conditions. The maximum temperature rise and the pressure drop over the heat sink were monitored. The main conclusion of this study was that the inline design is thermally superior to the staggered design for all but the fully-shrouded heat sinks. Another finding is that in a given geometry the non-dimensional pressure drop over a heat sink is almost constant, which indicates small viscous drag. Finally, the three-dimensional flow patterns and temperature fields obtained in the course of computations give insight into the complex heat sink airflow and heat transfer phenomena and suggest design improvements.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115343489","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 20

Numerical and experimental thermal characterization of a liquid cooled AlSiC power electronics base plate with integral pin fins 集成引脚鳍液冷AlSiC电力电子基板的数值和实验热特性

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866219

K. Moores, Y. Joshi, G. Schiroky

{"title":"Numerical and experimental thermal characterization of a liquid cooled AlSiC power electronics base plate with integral pin fins","authors":"K. Moores, Y. Joshi, G. Schiroky","doi":"10.1109/ITHERM.2000.866219","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866219","url":null,"abstract":"In this study, we present the thermal analysis and experimental performance assessment of an aluminum silicon carbide (AlSiC) metal matrix composite (MMC) base plate with integral cooling fins. By attaching a pin-finned base plate to an open-chambered flow-through heat sink, the mechanical interface between the base plate and cooling medium is eliminated. This reduces the overall thermal resistance and improves module reliability as compared with traditional base plate cooling schemes. Computational fluid dynamics and heat transfer techniques were employed to model the thermal and hydrodynamic resistance characteristics through the pin fin structure of a prototype base plate design. A \"unit-cell\" approach was employed to avoid the computational expense of modeling the entire pin array. Performance was verified experimentally in a closed loop test facility using water as the cooling fluid. It was found that the unit-cell approach produced excellent agreement with experimental pressure drop data for the full array, while heat transfer predictions were adequate.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"13 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113957655","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

A novel heat sink design for low speed flows-a BGA example 一种用于低速流的新型散热器设计-以BGA为例

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866164

B. Tavassoli

{"title":"A novel heat sink design for low speed flows-a BGA example","authors":"B. Tavassoli","doi":"10.1109/ITHERM.2000.866164","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866164","url":null,"abstract":"The ongoing trend in designing electronic systems is to incorporate increased functionality into ever smaller form factors. In addition, the power dissipation from most IC devices continues to increase. Additional design constraints, such as reducing system acoustic noise and weight, are also becoming more prevalent. The combined effect of all these trends is to create increasingly challenging thermal management situations that demand more efficient heat sinks and optimized designs. In this paper a new class of heat sinks are presented and their performance is compared to Airflow conventional heat sinks. MaxiFlow/sup TM/ heat sinks feature very thin, high ratio fins that radiate at various angles from the base. The result is a very low resistance to airflow and very high efficiency of heat dissipation, especially at low airspeeds. They are also very light in weight, allowing for simple attachment methods and weight savings. To aid in designing thermal solutions that utilize these heat sinks, an analytical model has been developed to predict the thermal resistance as a function of airflow velocity for unducted flow for a conventional design. The improvements of the new design compared to the conventional design will be discussed.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"257 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123122173","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Single chamber compact thermosyphons with micro-fabricated components 单室紧凑热虹吸管与微制造组件

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866209

S. Murthy, Y. Joshi, W. Nakayama

{"title":"Single chamber compact thermosyphons with micro-fabricated components","authors":"S. Murthy, Y. Joshi, W. Nakayama","doi":"10.1109/ITHERM.2000.866209","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866209","url":null,"abstract":"This study presents the thermal performance evaluation of a compact single-chamber thermosyphon. The thermosyphon set-up has a central evaporator section with integrated fins for cooling along the edges. The evaporator employs a microfabricated three-dimensional copper structure for enhancing boiling heat transfer. The thermal performance of the system was characterized at various power levels and condenser cooling conditions. The size of the boiling enhancement structure and effects of liquid fill volumes on performance were also investigated. Incorporation of the enhancement structure resulted in an improvement in the thermosyphon performance by decreasing the wall temperature at the evaporator by 8/spl deg/C, for a power dissipation of 36 W/cm/sup 2/ at an air speed of 1 m/s. The maximum heat flux obtained based on a maximum evaporator temperature of 75/spl deg/C for an air speed of 1 m/s was 42.5 W/cm/sup 2/. Variation in the liquid fill volume showed negligible effect on the maximum temperature at the evaporator, as long as the enhanced structure was fully flooded. Increasing the footprint size of the enhancement structure showed marginal improvement in boiling heat transfer performance. This increased the number of pores in the enhancement structures and did not result in a corresponding increase in the performance.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115027910","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Numerical simulation of interfacial delamination in electronic packaging 电子封装中界面分层的数值模拟

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866854

Bin Wang, X. S. Sun, Q. Fan, Y. Yin

{"title":"Numerical simulation of interfacial delamination in electronic packaging","authors":"Bin Wang, X. S. Sun, Q. Fan, Y. Yin","doi":"10.1109/ITHERM.2000.866854","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866854","url":null,"abstract":"In this paper, a numerical model for flip-chips in electronic packaging is constructed referring to existing experimental observation. The finite element (FE) simulation of interfacial crack propagation has been carried out along the interface between underfill and silicon chip without crack and with an initial crack, and the symmetric Galerkin multi-zone boundary element (BE) analysis has been also developed to calculate the same models as FE ones. In FE simulation, a critical stress criterion is adopted as the fracture criterion for the crack propagation. The normal and shear stress distributions along the interface are obtained from numerical analyses. The relation of load line deflection and crack length, and energy release rate vs. crack extension curve are also calculated from numerical results. On the other hand, the thermal stress field resulting from the difference of the coefficient of thermal expansions (CTEs) for different layer materials is investigated by increasing temperature from 20/spl square/ to 100/spl square/. FE results indicate that stress concentration occurs near the interface between underfill and silicon chip. Numerical results from FE and BE analyses show to be in good agreement with experiment ones.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115071964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Thermal modeling and experimental validation of thermal interface performance between non-flat surfaces 非平面间热界面性能的热建模与实验验证

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866808

C. Chiu, G. Solbrekken, T. M. Young

{"title":"Thermal modeling and experimental validation of thermal interface performance between non-flat surfaces","authors":"C. Chiu, G. Solbrekken, T. M. Young","doi":"10.1109/ITHERM.2000.866808","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866808","url":null,"abstract":"Thermal interface materials (TIMs) are commonly used to reduce the thermal resistance between an electronic device and its cooling solution. The thermal performance of a TIM is very sensitive to its bond line thickness, and hence, the warpage profiles of the mating surfaces. The contact surfaces are usually never perfectly flat due to the manufacturing process induced warpage in heat sinks and electronic packages. This paper focuses on a simplified numeric approach to simulate thermal performance of a TIM between the non-flat surfaces. This modeling approach uses an \"equivalent\" thermal conductivity to simulate warpage rather than building actual surface curvature in the model. In order to validate the numerical model, a test apparatus was developed and tooled up to measure the thermal resistance of an aluminum-nitride (AlN) filled thermal grease between the non-flat surfaces. It can be concluded that the simplified numerical approach can efficiently predict the TIM thermal performance between non-flat surfaces. This model can be further extended to the cases with more complicated surface profiles and multiple heat sources.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115148096","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 19