{"title":"引脚翅片散热器优化模型的实验验证","authors":"T. Zapach, T. Newhouse, J. Taylor, P. Thomasing","doi":"10.1109/ITHERM.2000.866809","DOIUrl":null,"url":null,"abstract":"An analytical model for the optimization of pin fin heatsinks was developed. The model is based on correlations of flow resistance and heat transfer from studies of tube bank heat exchangers. Experimental verification of the model shows that, with some minor modification to the heat transfer correlations, it reasonably represents heat transfer trends. Flow resistance trends are under-predicted for both inline and staggered pin arrangements. Even with these limitations this tool is useful for the optimization and pin arrangement selection of pin fin heatsinks.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Experimental verification of a model for the optimization of pin fin heatsinks\",\"authors\":\"T. Zapach, T. Newhouse, J. Taylor, P. Thomasing\",\"doi\":\"10.1109/ITHERM.2000.866809\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An analytical model for the optimization of pin fin heatsinks was developed. The model is based on correlations of flow resistance and heat transfer from studies of tube bank heat exchangers. Experimental verification of the model shows that, with some minor modification to the heat transfer correlations, it reasonably represents heat transfer trends. Flow resistance trends are under-predicted for both inline and staggered pin arrangements. Even with these limitations this tool is useful for the optimization and pin arrangement selection of pin fin heatsinks.\",\"PeriodicalId\":201262,\"journal\":{\"name\":\"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.2000.866809\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2000.866809","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Experimental verification of a model for the optimization of pin fin heatsinks
An analytical model for the optimization of pin fin heatsinks was developed. The model is based on correlations of flow resistance and heat transfer from studies of tube bank heat exchangers. Experimental verification of the model shows that, with some minor modification to the heat transfer correlations, it reasonably represents heat transfer trends. Flow resistance trends are under-predicted for both inline and staggered pin arrangements. Even with these limitations this tool is useful for the optimization and pin arrangement selection of pin fin heatsinks.