{"title":"改进的多孔材料细观损伤下界本构模型的初步研究","authors":"Yajun Yin, Q. Fan, Bo Wang","doi":"10.1109/ITHERM.2000.866200","DOIUrl":null,"url":null,"abstract":"The paper aims at the examination of the modified lower bound rigid plastic constitutive model for porous materials by comparing it with other ones. Under uniaxial stress state, the porous copper's compressibility, ductility, strength property, deformation characteristics, stress/spl sim/strain curves and damage evolution process predicted by these models are systematically contrasted with each other. The effectiveness of the scheme for modifying the lower bound model by introducing void interaction mechanism into its theoretical framework is verified.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Preliminary examination of the modified lower-bound meso-damage constitutive model for porous materials\",\"authors\":\"Yajun Yin, Q. Fan, Bo Wang\",\"doi\":\"10.1109/ITHERM.2000.866200\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper aims at the examination of the modified lower bound rigid plastic constitutive model for porous materials by comparing it with other ones. Under uniaxial stress state, the porous copper's compressibility, ductility, strength property, deformation characteristics, stress/spl sim/strain curves and damage evolution process predicted by these models are systematically contrasted with each other. The effectiveness of the scheme for modifying the lower bound model by introducing void interaction mechanism into its theoretical framework is verified.\",\"PeriodicalId\":201262,\"journal\":{\"name\":\"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)\",\"volume\":\"51 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.2000.866200\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2000.866200","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Preliminary examination of the modified lower-bound meso-damage constitutive model for porous materials
The paper aims at the examination of the modified lower bound rigid plastic constitutive model for porous materials by comparing it with other ones. Under uniaxial stress state, the porous copper's compressibility, ductility, strength property, deformation characteristics, stress/spl sim/strain curves and damage evolution process predicted by these models are systematically contrasted with each other. The effectiveness of the scheme for modifying the lower bound model by introducing void interaction mechanism into its theoretical framework is verified.