ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)最新文献_第7页

Assessment of high-heat-flux thermal management schemes 高热通量热管理方案的评估

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866802

I. Mudawar

{"title":"Assessment of high-heat-flux thermal management schemes","authors":"I. Mudawar","doi":"10.1109/ITHERM.2000.866802","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866802","url":null,"abstract":"This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, micro-channel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme. It is also shown that extensive fundamental electronic cooling knowledge has been amassed over the past two decades. Yet there is now a growing need for hardware innovations rather than perturbations to those fundamental studies. An example of these innovations is the cooling of military avionics, where research findings from the electronic cooling literature have made possible the development of a new generation of cooling hardware which promise order of magnitude increases in heat dissipation compared to today's cutting edge avionics cooling schemes.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129275176","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 877

Mechanical characterization of solder mask materials in electronic packaging applications 电子封装中阻焊材料的力学特性

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866215

H. Zhu, Y. Guo, Wen-Ying Li, A. Tseng

引用次数: 2

A comparison between moire interferometry and strain gages for effective CTE measurement in electronic packages 云纹干涉法与应变仪在电子封装中有效CTE测量的比较

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866198

T. Ratanawilai, B. Hunter, G. Subbarayan, D. Rose

{"title":"A comparison between moire interferometry and strain gages for effective CTE measurement in electronic packages","authors":"T. Ratanawilai, B. Hunter, G. Subbarayan, D. Rose","doi":"10.1109/ITHERM.2000.866198","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866198","url":null,"abstract":"High-sensitivity laser moire interferometry technique has proven to be invaluable in characterizing electronic packages. It is often contrasted to the classical strain gage technique as a more powerful, whole-field alternative for the characterization of electronic packages. In this paper, we present a systematic comparison of the accuracy of thermal strains measured using the moire technique to that obtained using strain gages. The effective thermal strains in approximately twenty printed circuit board specimens were measured using the two techniques. The results of the two techniques showed good overall correlation, but differed from each other by as much as 2.73 PPM. The possible sources of error in each technique are identified and discussed. Of practical significance, the measured effective coefficient of thermal expansion varied in wide range by as much as 5 PPM about the commonly used value of 17 PPM. This has been shown in a related study as causing a significant reliability impact for a plastic ball grid array package assembly.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115081703","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Numerical study of interfacial delamination in a system-on-package (SOP) integrated substrate under thermal loading 热载荷作用下系统-封装集成基板界面分层的数值研究

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866214

W. Xie, S. Sitaraman

引用次数: 5

A strain rate ratio approach for assessing creep-fatigue life of 63Sn-37Pb solder under shear loading 用应变率比法评估63Sn-37Pb焊料在剪切载荷下蠕变疲劳寿命

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866190

M. Sakane, H. Yamamoto

引用次数: 20

Experimental study on performance of a miniature heat pipe with woven-wired wick 编织丝芯微型热管性能的实验研究

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866181

Seok-Hwan Moon, Choon‐Gi Choi, G. Hwang, Tae Coo Choy

{"title":"Experimental study on performance of a miniature heat pipe with woven-wired wick","authors":"Seok-Hwan Moon, Choon‐Gi Choi, G. Hwang, Tae Coo Choy","doi":"10.1109/ITHERM.2000.866181","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866181","url":null,"abstract":"The thermal density of electronic parts and systems has been increased continuously as high speed and high density are required for them. The heat generation of the CPU of a notebook PC of higher than the Pentium-II grade has been recently increased to be more than 10 W, and the available packaging space has been compacted. Therefore, it has become inevitable to perform cooling by using miniature heat pipes. In the present study, new woven-wired-type wick with a large capillary limit and a high productivity has been developed, and heat pipes with the diameter of 3 mm or 4 mm to cooling of small-sized electronic parts such as CPU of a notebook PC. Have been designed and manufactured. Further, in as much as the operational characteristics of miniature heat pipes (MHPs) with the diameter of 3 mm or 4 mm are different from those of general medium-sized heat pipes, a performance test has been performed in order to review heat-transfer characteristics and affects of various factors on the performance of MHPs. The operational factors include charging ratio of working fluid, the total length of heat pipes, lengths of an evaporator and a condenser, inclination of installation, number of wick strands, thermal load, etc. The limiting powers of 3 mm MHP and 4 mm MHP are shown to be 6.8 W and 19.5 W, respectively, with angle of inclination of -5/spl deg/. These show that there is a high possibility of application if one or two MHPs are installed for cooling of CPU more than 10 W.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116816545","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Variable emissivity through MEMS technology 通过MEMS技术实现可变发射率

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866834

Ann Garrison Damn, R. Osiander, J. Champion, Ted Swanson, D. Douglas, Lisa M. Grob

{"title":"Variable emissivity through MEMS technology","authors":"Ann Garrison Damn, R. Osiander, J. Champion, Ted Swanson, D. Douglas, Lisa M. Grob","doi":"10.1109/ITHERM.2000.866834","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866834","url":null,"abstract":"This paper discusses a new technology for variable emissivity (vari-e) radiator surfaces, which has significant advantages over traditional radiators and promises an alternative design technique for future spacecraft thermal control systems. All spacecraft rely on radiative surfaces to dissipate waste heat. These radiators have special coatings, typically with a low solar absorptivity and a high infrared-red emissivity, that are intended to optimize performance under the expected heat load and thermal sink environment. The dynamics of the heat loads and thermal environment make it a challenge to properly size the radiator and often require some means of regulating the heat rejection rate of the radiators in order to achieve proper thermal balance. Specialized thermal control coatings, which can passively or actively adjust their emissivity offer an attractive solution to these design challenges. Such systems would allow intelligent control of the rate of heat loss from a radiator in response to heat load and thermal environmental variations. Intelligent thermal control through variable emissivity systems is well suited for nano and pico spacecraft applications where large thermal fluctuations are expected due to the small thermal mass and limited electric resources. Presently there are three different types of vari-e technologies under development: Micro Electro-Mechanical Systems (MEMS) louvers, Electrochromic devices, and Electrophoretic devices. This paper will describe several prototypes of micromachined (MEMS) louvers and experimental results for the emissivity variations measured on theses prototypes. It will further discuss possible actuation mechanisms and space reliability aspects for different designs. Finally, for comparison, parametric evaluations of the thermal performance of the new vari-e technology and standard thermal control systems are also presented in this paper.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126534835","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 28

Low-order dynamical modeling of natural convective air-cooling system in a vertical channel 垂直通道自然对流空冷系统的低阶动力学建模

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866183

R.A. Sahan

{"title":"Low-order dynamical modeling of natural convective air-cooling system in a vertical channel","authors":"R.A. Sahan","doi":"10.1109/ITHERM.2000.866183","DOIUrl":"https://doi.org/10.1109/ITHERM.2000.866183","url":null,"abstract":"Low-order dynamical models of transitional natural convective air-cooling system in a vertical channel with periodically repeated discrete heat sources are developed. Proper orthogonal decomposition (POD) methodology has been applied to supercritical oscillatory solutions, obtained by solving the flow governing partial differential equations (PDEs) with a spectral element method at Grashof number, Gr=25000. POD is used to extract the empirical eigenfunctions, to compress the data and to identify the organized spatio-temporal structures. Low-order models (LOMs), consisting of reduced number of nonlinear ordinary differential equations (ODEs), are derived using the computed empirical eigenfunctions as basis functions and applying Galerkin projection (GP). The ability of the reduced models to describe the dynamics of the flow and temperature fields at design conditions is studied. In this study, at least four modes for both velocity and temperature are required to predict self-sustained oscillations in time. The LOM predictions based on four modes are in excellent agreement with the full model results, capturing the short- and long-time nonlinear dynamical behavior of the thermo-fluid system. The developed LOMs may be used to make feasible parametric studies with less computational effort and storage requirements, to investigate stability behavior of the forced/natural convective air-cooling systems, and to explore possible flow control strategies.","PeriodicalId":201262,"journal":{"name":"ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126535609","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Thermal-mechanical models for non-conforming surface contacts 非协调表面接触的热力学模型

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866838

M. Yovanovich

引用次数: 4

Thermomechatronics of power electronic packages 电力电子封装的热电子学

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Pub Date : 2000-05-23 DOI: 10.1109/ITHERM.2000.866202

E. R. Brown, M. Shaw

引用次数: 12