International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)最新文献

Laser-assisted bump transfer for flip chip assembly 用于倒装芯片组装的激光辅助凹凸转移

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-12-31 DOI: 10.1109/EMAP.2000.904137

C.H. Wang, A. Holmes, S. Gao

引用次数: 14

Thermal/mechanical analysis of novel C-TSOP using nonlinear FEM method 基于非线性有限元法的新型C-TSOP热/力学分析

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI: 10.1109/EMAP.2000.904182

Ji-Cheng Lin, K. Chiang

{"title":"Thermal/mechanical analysis of novel C-TSOP using nonlinear FEM method","authors":"Ji-Cheng Lin, K. Chiang","doi":"10.1109/EMAP.2000.904182","DOIUrl":"https://doi.org/10.1109/EMAP.2000.904182","url":null,"abstract":"This paper describes a novel ceramic thin-small-outline package (C-TSOP) to meet the thermal performance and long-term reliability considerations of low-pin-count and high-performance electronic devices, especially for memory devices. To improve the disadvantages of molding compounds and simplify the fabrication process, the molding compound is replaced by a ceramic-like stiffener which is adhered to the leadframe by tape or adhesive. The ceramic-like stiffener would overcome the low thermal conductivity problem of molding compound in a conventional lead-on-chip TSOP (LOC-TSOP) and increase the thermal dissipation efficiency. In this paper, 3D nonlinear finite element models of both the conventional and novel LOC-TSOPs have been established. Various heat generation scenarios are applied to the 3D nonlinear models under natural convection conditions for evaluation of heat dissipation capability and thermal resistance of the packages. Moreover, the material properties and solder joint reliability of the packages are also investigated. In order to compare solder joint reliabilities of the novel and conventional LOC-TSOPs, a nonlinear finite element method is used to analyze the physical behaviors of packages under thermal loading conditions. The thermal fatigue life of the solder joints has been estimated in terms of equivalent plastic strain. The results are compared to the experiments in the literature in order to verify the accuracy of the finite element models. From the results, it can be concluded that the novel C-TSOP package implies excellent thermal performance and solder joint reliability.","PeriodicalId":201234,"journal":{"name":"International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115212930","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Observations of solder paste reflow by means of electrical measurements 用电测量法观察锡膏回流

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI: 10.1109/EMAP.2000.904149

S. Mannan, D. Hutt, D. Whalley, P. Conway

引用次数: 1

New anisotropic conductive adhesives for low cost and reliable flip chip on organic substrates applications 新型各向异性导电胶粘剂用于低成本和可靠的有机基板倒装芯片应用

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI: 10.1109/EMAP.2000.904168

K. Paik, M. Yim

{"title":"New anisotropic conductive adhesives for low cost and reliable flip chip on organic substrates applications","authors":"K. Paik, M. Yim","doi":"10.1109/EMAP.2000.904168","DOIUrl":"https://doi.org/10.1109/EMAP.2000.904168","url":null,"abstract":"Flip chip assembly on organic substrates using ACAs (anisotropic conductive adhesives) has advantages such as easier processing, good electrical performance, lower cost, green processes, and organic substrate-compatible low temperature processing. ACAs are composed of epoxy polymer resin and conductive fillers (less than 10 wt.%). ACAs thus have almost the same CTE values as epoxy alone, which are higher than conventional underfill materials with silica fillers. It is thus necessary to lower the ACA CTE value for more reliable flip chip assembly on organic substrates. New ACA composites with conductive and nonconductive fillers were devised. In this paper, we studied the effect of fillers on the thermo-mechanical properties of modified ACA composites and the reliability of flip chip assembly on organic substrates using modified ACAs and electroless Ni and Au stud bumps. As nonconducting filler content increased, CTE values decreased and storage modulus at room temperature increased. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity/temperature, and high temperature/dry test. It was noted that lowering ACA CTEs greatly enhanced thermal cycling reliability. Results also showed that flip chip assembly using modified ACAs with lower CTEs and higher modulus exhibited slightly better contact resistance behavior than conventional ACAs without nonconducting fillers. The greater reliability of flip chip on organic substrates using the new ACAs can lead to new low cost flip chip on organic substrate applications such as smart cards, RF, memory devices, etc.","PeriodicalId":201234,"journal":{"name":"International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130351559","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

A method to quantify the surface insulation resistance performance of conformal coatings exposed to different temperature/humidity conditions 一种量化不同温度/湿度条件下适形涂层表面绝缘电阻性能的方法

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI: 10.1109/EMAP.2000.904178

P. Tomlins

引用次数: 3

A new method using energy release elements for evaluating bonding strength [packaging] 一种利用能量释放元素评估结合强度的新方法[包装]

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI: 10.1109/EMAP.2000.904164

T. Hatsuda, R. Minamitani

引用次数: 1

Moisture sensor using reactive sputtered TiO/sub 2/ thin film with negative substrate bias 水分传感器采用负衬底偏压反应溅射TiO/sub /薄膜

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI: 10.1109/EMAP.2000.904198

L. Chow, M. Yuen, P. Chan, A. Teng

{"title":"Moisture sensor using reactive sputtered TiO/sub 2/ thin film with negative substrate bias","authors":"L. Chow, M. Yuen, P. Chan, A. Teng","doi":"10.1109/EMAP.2000.904198","DOIUrl":"https://doi.org/10.1109/EMAP.2000.904198","url":null,"abstract":"Moisture is known as a major factor in degrading the reliability of electronic packages. It is estimated that over 40% of failures in electronic devices are induced by moisture. The use of micro-moisture-sensing-chips in electronic package reliability tests can provide in-situ and real-time monitoring of device failures under controlled environmental conditions. Some previously published fabrication techniques of high performance moisture sensors include a very high temperature powder sintering method (Jain et al, 1999; Katayama et al, 1990; Slunecko et al, 1992), the sol-gel method (Montesperelli et al, 1995) and etching porous silicon (Macko, 1982) under complex and sophisticated process control. All of these methods are incompatible with conventional IC processing. In this paper, simple and low temperature fabricated moisture sensing chips using a reactive sputtering process in thin film technology are characterized. The reactive sputtering process has been widely employed in IC batch production for its high process control and uniformity. The adsorption response, which is well fitted into a Brunauer, Emmett and Teller (BET) type III model, and atomic force microscope (AFM) images illustrate that the sensing films are pore-free. A process window for improving hysteresis performance is obtained by applying a negative substrate bias during sputtering and increasing the annealing time. The sensitivity of four orders of magnitude in DC current change over 11%-97% relative humidity (RH) is achieved.","PeriodicalId":201234,"journal":{"name":"International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132979956","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Low cost flip chip bumping 低成本倒装芯片碰撞

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI: 10.1109/EMAP.2000.904135

T. Oppert, T. Teutsch, E. Zakel

引用次数: 11

Enhancement of moisture sensitivity performance of a FBGA FBGA湿敏性能的增强

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI: 10.1109/EMAP.2000.904201

Lee Teck Kheng, Lee Kian Chai, Chai Yih Ming, Ng Yew Hong

引用次数: 8

Study on failure mode of solder bump fabricated using eutectic solder electroplating process 共晶焊料电镀工艺制作凸点失效模式的研究

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI: 10.1109/EMAP.2000.904129

Guo-Wei Xiao, P. Chan, A. Teng, Jian Cai, M. Yuen

{"title":"Study on failure mode of solder bump fabricated using eutectic solder electroplating process","authors":"Guo-Wei Xiao, P. Chan, A. Teng, Jian Cai, M. Yuen","doi":"10.1109/EMAP.2000.904129","DOIUrl":"https://doi.org/10.1109/EMAP.2000.904129","url":null,"abstract":"The electroplating-based flip chip process has many advantages over other solder bumping methods, where the bump fabrication process can affect the reliability of solder joints. In this paper, the effect of the UBM and electroplating process of the solder bump on the shear strength of the solder bump is studied, as well as the relationship between the shear test failure mode and solder bump fabrication process. It is reported that the Cu surface roughness is affected by the Cu plating current density and the appropriate current density is in a range from 10/spl sim/40 mA/cm/sup 2/. The solder bump plating process temperature should be within 30-35/spl deg/C. It is observed that the growth kinetics of intermetallic compound formation are affected by the Cu stud structure. The ratio of Cu/sub 3/Sn to the total Cu-Sn IMC layer thickness was from 0.5 to 0.15 with various Cu microstructures at 150/spl deg/C during thermal aging tests. The activation energy was in the range of 0.78 eV to 1.14 eV. Five shear test failure modes are analyzed which are related to the electroplating process.","PeriodicalId":201234,"journal":{"name":"International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117145320","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2