Enhancement of moisture sensitivity performance of a FBGA

Abstract

One of the main package reliability limitations of fine pitch BGA (FBGA) is its moisture sensitivity performance, i.e. popcorn failure. Package reliability of different packaging materials is thus normally employed to determine the optimal material combination for good moisture performance. This paper attempts to understand the impact of solder mask design on the package moisture sensitivity. It also determines the die attach adhesion strength material and mold compound selection criteria. By correlating the shear strength to package moisture sensitivity performance, it provides an approach for selecting die attach materials that will enhance the moisture resistance of the package.