International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)最新文献_第8页

The investigation of some properties of copper alloys for lead frame 引线架用铜合金若干性能的研究

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI: 10.1109/EMAP.2000.904186

Huang Fuxiang, Huang Le, M. Ju-sheng, W. Qian, Wang Qinglei, Lu Chao

引用次数: 4

Investigation of lead cracking in TSSOP during burr-up forming process TSSOP中毛刺成形过程中铅裂纹的研究

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI: 10.1109/EMAP.2000.904190

E. Chung, T. Xu, Deming Liu

引用次数: 1

Advanced substrate technology for ball grid array in electronic packaging 电子封装中球栅阵列的先进衬底技术

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI: 10.1109/EMAP.2000.904176

Y. Wang, T. Her

引用次数: 3

Under bump metallisation of fine pitch flip-chip using electroless nickel deposition 微距倒装芯片的碰撞金属化化学镀镍

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-09-01 DOI: 10.1109/EMAP.2000.904134

C. Liu, D. Hutt, D. Whalley, P. Conway, S. Mannan

{"title":"Under bump metallisation of fine pitch flip-chip using electroless nickel deposition","authors":"C. Liu, D. Hutt, D. Whalley, P. Conway, S. Mannan","doi":"10.1109/EMAP.2000.904134","DOIUrl":"https://doi.org/10.1109/EMAP.2000.904134","url":null,"abstract":"For solder based flip-chip assembly, under-bump metallisation (UBM) layer deposition on the Al die bondpads is the first step in the wafer bumping process. The UBM is necessary, as the fragile Al pad has a tough oxide layer that cannot be soldered without the use of strong flux and a barrier layer is required to prevent dissolution of the bondpad into the solder during reflow. The UBM requirements are therefore to provide a solder wettable surface and to protect the underlying Al bondpad during and after assembly. In addition, the UBM deposition process itself must remove any oxide layers on the bondpads to ensure a low resistance interface between pad and UBM. This paper reports a study of the electroless nickel deposition process for the UBM of wafers that are subsequently to be bumped using solder paste printing. This work has extended the process from previous trials on 225 /spl mu/m pitch devices to wafers including die with sub-100 /spl mu/m pitch bondpads. The effect of the various pre-treatment etch processes and zincate activation on the quality of the final electroless Ni bump has been investigated. SEM examination of samples at each stage of the bumping process has been used to aid detailed understanding of the activation mechanisms and to determine their effects on the electroless Ni bump morphology. In addition, bump shear testing has been used to determine the best pre-treatment regime to ensure good adhesion of the electroless Ni to the bondpad. Finally, bumped die electrical resistance measurements have been used to confirm that the pre-treatment procedures are producing a low resistance interface between the Al and electroless Ni.","PeriodicalId":201234,"journal":{"name":"International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127515387","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

A design and manufacturing solution for high reliable non-leaded CSP's like QFN 为QFN等高可靠性无铅CSP提供设计和制造解决方案

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 1900-01-01 DOI: 10.1109/EMAP.2000.904173

G. Kuhnlein, A. Bos

{"title":"A design and manufacturing solution for high reliable non-leaded CSP's like QFN","authors":"G. Kuhnlein, A. Bos","doi":"10.1109/EMAP.2000.904173","DOIUrl":"https://doi.org/10.1109/EMAP.2000.904173","url":null,"abstract":"The ongoing miniaturization and increasing functionality of electronic equipment have forced the semiconductor industry to develop smaller and thinner devices in ever-shorter cycles. The trend for chip scale area/perimeter array packages is obvious. One of these extremely miniaturized IC packages, presented by Matsushita under the name QFN, has rapidly become popular. However, one concern is the limited device reliability (JEDEC moisture level 3) which requires improvements for main markets such as telecommunication and automotive electronics. Rapidly implemented miniaturization in the past has led to reduced device reliability, e.g. for the well-known \"popcorn phenomenon\", from which most thin devices like PBGAs, TQFPs, TSOPs, etc., suffer. In addition, increasing time to market pressure forces the industry to shorten package design time. Under this pressure, the complexity and link between package manufacturability and device reliability is sometimes neglected. The resulting dissatisfaction has initiated a design and manufacturing process research program, targeting best board assembly quality and a reliability performance level of at least JEDEC-moisture level 1. By carefully analyzing all constraints which limit device and board assembly quality of such new devices using all past experiences and by considering the capabilities of existing and established assembly and packaging technologies, it should be possible to build and economically manufacture such devices in high volume, achieving the required board assembly quality and device reliability in the requested cost frame.","PeriodicalId":201234,"journal":{"name":"International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)","volume":"217 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133967572","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Development of no-flow underfill for lead-free bumped flip-chip assemblies 无铅凸型倒装芯片组件无流底填料的开发

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 1900-01-01 DOI: 10.1109/EMAP.2000.904170

Zhuqing Zhang, C. Wong

{"title":"Development of no-flow underfill for lead-free bumped flip-chip assemblies","authors":"Zhuqing Zhang, C. Wong","doi":"10.1109/EMAP.2000.904170","DOIUrl":"https://doi.org/10.1109/EMAP.2000.904170","url":null,"abstract":"The no-flow underfill process in flip-chip assembly is promising for a smaller, faster and more cost-efficient packaging technology. Currently available no-flow underfill materials are mainly designed for eutectic Sn-Pb solders. This paper presents a new no-flow underfill for lead-free solder bumped flip-chip assemblies. Many epoxy resin/HMPA/metal acetylacetonate material systems have been screened in terms of their curing kinetics. Some potential base formulations with curing peak temperatures higher than 200/spl deg/C were selected for further study. The proper fluxing agents were developed and the effects of fluxing agents on the curing kinetics and cured material properties of the potential base formulations were studied by differential scanning calorimetry (DSC), thermo-mechanical analyzer (TMA), dynamic-mechanical analyzer (DMA), thermo-gravimetric analyzer (TGA), and rheometer. The results show that the addition of flux significantly reduced the curing temperature and limits the potential of many formulations for application in lead-free bumped flip chip assemblies. The fluxing capability of several no-flow formulations is evaluated using wetting testing of lead-free solder balls on a copper board. The feasibility of the developed no-flow underfill is demonstrated using a lead-free bumped flip-chip package, which shows 100% interconnection yield after solder reflow.","PeriodicalId":201234,"journal":{"name":"International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130010075","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2