引线架用铜合金若干性能的研究

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI:10.1109/EMAP.2000.904186

Huang Fuxiang, Huang Le, M. Ju-sheng, W. Qian, Wang Qinglei, Lu Chao

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引用次数: 4

摘要

引线框架是分立和集成电路器件中最重要的组成部分之一。由于其良好的导电性和成本，引线框架用铜合金广泛应用于IC封装。本文对引线框架用铜合金的腐蚀性能等进行了研究。结果表明，由于铜合金中不同的腐蚀机理和添加的合金元素不同，铜合金在低浓度氯化铁中的腐蚀速率远高于同一合金在高浓度中的腐蚀速率。比较了八种不同铜合金的尺寸对腐蚀性能的影响。这个因子的变化在坐标系中显示出来。本文还对铜的可焊性进行了研究。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The investigation of some properties of copper alloys for lead frame

Lead frames are one of the most important component parts of discrete and IC devices. Due to their good electrical conductivity and cost, copper alloys for lead frames are widely used in IC packages. In this paper, some properties of copper alloys for lead frames, such as etching properties, etc, are researched. The results showed that because of the different etching mechanisms and alloy elements added to the copper alloy, the etching rates of copper alloys in low concentration ferric chloride are much higher than those of the same alloys in higher concentrations. The influence of the dimensions of eight different copper alloys to the etching properties are compared. The variety of this factor is displayed in the coordinate system. Copper solderability is also investigated in the paper.

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International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)

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