2012 14th International Conference on Electronic Materials and Packaging (EMAP)最新文献

{"title":"Effects of microstructure on thermal fatigue life prediction of solder joints","authors":"Hiue Tran, Yin Fun Chua, S. Yi, P. Geng","doi":"10.1109/EMAP.2012.6507879","DOIUrl":"https://doi.org/10.1109/EMAP.2012.6507879","url":null,"abstract":"In the present study, effects of microstructure on the fatigue life of solder joints under thermal cycling conditions are evaluated using the finite element method. A unified, viscoplastic constitutive model for solder joints of plastic ball grid array packages is employed to improve accuracy of reliability prediction. The constitutive model is then implemented into the commercial finite element analysis software, ABAQUS, to predict the thermo-mechanical behavior of solder balls in PBGA package subjected to thermal cycling. Damage parameters are obtained from the FEA results and are used to estimate the thermal fatigue life of solder balls. The Coffin-Manson equation is employed. The predicted thermal fatigue lives are discussed in detail.","PeriodicalId":182576,"journal":{"name":"2012 14th International Conference on Electronic Materials and Packaging (EMAP)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128639253","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Development of highly conductive inks for smart textiles","authors":"M. Inoue, Yasunori Tada, H. Muta, Y. Hayashi, Tomohiro Tokumaru","doi":"10.1109/EMAP.2012.6507896","DOIUrl":"https://doi.org/10.1109/EMAP.2012.6507896","url":null,"abstract":"Stretchable conductive inks composed of a polyurethane-based elastomer containing Ag flakes were developed for smart textile applications. The conductive inks exhibited very low electrical resistivities of 10–20 εΩcm when they were cured at 120 °C. An insulative ink was also prepared to be used for cover layers of wires made of the conductive inks. Stretchable circuits were formed using the electrically conductive and insulative inks on fabrics. Biosignal monitoring from human bodies was successfully performed using the circuits on fabrics as leads during normal activities of daily life.","PeriodicalId":182576,"journal":{"name":"2012 14th International Conference on Electronic Materials and Packaging (EMAP)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127961231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Study on thermal design due to downsizing of power module using coupled electrical-thermal-mechanical analysis","authors":"Yasutaka Yamada, Qiang Yu, Tomohiro Takahashi, Y. Takagi","doi":"10.1109/EMAP.2012.6507917","DOIUrl":"https://doi.org/10.1109/EMAP.2012.6507917","url":null,"abstract":"Recently, with the development of power electronics technology, the power modules have been used extensively and the demand for downsizing. At our laboratory, the power assist to support knee moving has been developing. And this product also uses power module to improve energy efficiency. The problem of the power module is thermal fatigue of the junction area between SiC chip and substrate. When downsize the power module, thermal design become more important because it gets more difficult to release heat produced in the module. In this study, assuming practical use of power assist, proposing a model of power module under power cycle test that allows further downsizing and reducing weight was conducted. And thermal design of power module was evaluated by using coupled electrical-thermal-mechanical analysis. The analysis using Finite Element Method (FEM) was operated to evaluate non-uniform temperature distribution in power module was estimated. Based on the results, the model of power module is proposed as effective solution for downsizing without reducing the reliability.","PeriodicalId":182576,"journal":{"name":"2012 14th International Conference on Electronic Materials and Packaging (EMAP)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128824026","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Hard mold UV nanoimprint lithography process","authors":"Yinsheng Zhong, M. Yuen","doi":"10.1109/EMAP.2012.6507892","DOIUrl":"https://doi.org/10.1109/EMAP.2012.6507892","url":null,"abstract":"Low temperature and low pressure nano-pattern fabrication process is presented. Hard mold UV nanoimprint lithography, processed by SUSS MicroTec MA6, was used for sub-100nm pattern fabrication. The process details including mold fabrication are provided. A comparison between patterns on soft mold and hard mold is given. The governing parameters in hard mold NIL process are identified. UV curable resin AMONIL MMS4 was used as a UV-curable photo resist (PR) in the process, while 4inch Si wafer was the imprinted substrate. Various resist coating thicknesses from 200nm to 500nm were tested. Imprint force was applied by the high pressure N2 gas, in order to get uniform force distribution over the whole imprint area. 88nm width line patterns were transferred successfully to the resin layer. Results evaluation was done by using AFM and SEM pictures. Image from optical microscope is also shown for reference.","PeriodicalId":182576,"journal":{"name":"2012 14th International Conference on Electronic Materials and Packaging (EMAP)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121255295","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"High bright white LED packaging systems using unique vacuum printing technology (VPES)","authors":"A. Okuno, Y. Miyawaki, O. Tanaka, J. Ooki, M. Okuda, Hirofumi Torigoe","doi":"10.1109/EMAP.2012.6507887","DOIUrl":"https://doi.org/10.1109/EMAP.2012.6507887","url":null,"abstract":"White color LED has been investigated for lighting application with a big expectation of growth. And in terms of packaging of them in general, clear transparent epoxy resin has been mainly used in spite of problems such as coloring of the resin due to high temperature and UV light emitted from Chip itself. In order to solve this problem, we have investigated new materials such as silicon resin and specially modified epoxy resin etc. And then we would suggest that materials should be chosen depending upon LED specifications, packaging materials and also reliability test conditions etc. In addition we would like to suggest high density packaging technology using VPES, which meets very fine pitch, high density packaging designs, and meets cost effective mass production. And we introduce COB packaging Technology by VPES. This technology is very good effect to mass production for high bright white LED lighting.","PeriodicalId":182576,"journal":{"name":"2012 14th International Conference on Electronic Materials and Packaging (EMAP)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127559925","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Feasibility of PBGA packaging for high random vibration applications","authors":"Yeong-Kook Kim, Do Soon Hwang, Jae Hyuk Lim","doi":"10.1109/EMAP.2012.6507878","DOIUrl":"https://doi.org/10.1109/EMAP.2012.6507878","url":null,"abstract":"In this study, the solder joint reliability of plastic ball grid array under harsh random vibration and thermal loadings was investigated. The chips were assembled on the daisy chained circuit boards for the test samples preparation, and part of the samples was processed for underfill to investigate the underfill effects on the solder failures. Two consequential steps of the random vibrations, named as the qualification and acceptance levels, were applied by pneumatic shaker. Overall controlled RMS of the power spectrum densities of the steps were 22.7 Grms and 32 Grms, respectively. Then the samples were undergone to thermal cycling tests. It was found that the samples survived without any solder failure during the test requirements, demonstrating the robustness of the packaging structure for potential avionics and space applications.","PeriodicalId":182576,"journal":{"name":"2012 14th International Conference on Electronic Materials and Packaging (EMAP)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117151680","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effect of additive elements on tensile, creep and low cycle fatigue strength for SnBi solders","authors":"S. Nakano, M. Sakane, H. Hokazono, M. Yamashita","doi":"10.1109/EMAP.2012.6507858","DOIUrl":"https://doi.org/10.1109/EMAP.2012.6507858","url":null,"abstract":"This paper presents tensile, creep and low cycle fatigue properties of three kinds of SnBi lead-free solders. Tensile, creep and low cycle fatigue tests were performed using miniature specimens of the three solders. The effects of additive elements on tensile, creep and fatigue properties were discussed. Three kinds of solders showed almost the same tensile strength of around 55MPa and the same tensile ductility of about 70%. The creep rupture lifetimes of Sn57.5Bi0.5AgCuNiGe were about 1.5 – 2 times longer than those of Sn58Bi and Sn57.5Bi0.5Ag solders at 313K, 353K and 373K. The three kinds of solders showed almost the same low cycle fatigue strength at 313K. These mechanical properties were discussed in relation with the microstructure.","PeriodicalId":182576,"journal":{"name":"2012 14th International Conference on Electronic Materials and Packaging (EMAP)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123324443","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigation of rework for straddle mount connectors","authors":"Jeffery Li, Fubin Song, Khoo KoK Wei, James Huang, Alex Chen, P. Pu, Sven Peng","doi":"10.1109/EMAP.2012.6507912","DOIUrl":"https://doi.org/10.1109/EMAP.2012.6507912","url":null,"abstract":"With the advancement of the motherboard multiple functions, more and more connectors are mounted on the Printed Circuit Board (PCB) to interconnect electronic components or sub-functional daughtercards. Among different types of connectors, Straddle Mount Connector (SMC), a typical surface mount connector with leads to be soldered on both top and bottom sides of the PCB and with high mechanical strength, is widely used on server motherboards and other systems to serve as power or signal interconnection. As the straddle mount connectors have leads on both top and bottom sides of the printed circuit board, it brings some challenges for the hot gas rework process without compromising the quality and reliability. The traditional hot gas rework nozzle of blowing hot air on localized one side of PCB is not suitable for the rework of straddle mount connectors, the heat can not be evenly distributed on the leads soldered on both sides of PCB, , especially for the board with thickness more than 4mm, when the solder on bottom side get melted, the top side temperature will be too high and causing damage to PCB. It is also very difficult to remove the straddle mount connectors from PCB by using the traditional rework method, nozzle and fixture. This paper presents a rework processes for straddle mount connector with a newly designed nozzle that can evenly distributing the hot air on both sides. The fixtures for removing and replacing the connectors during rework process will be discussed as well.. The rework process will be optimized and compared with the traditional singleside method in this work. The test configuration and the experimental data will be reported in details. The results indicate that the straddle mount connectors can be removed and placed successfully and conveniently by using the newly designed nozzle and fixtures. In addition, the reliability performance of this new method on the solder joint after rework will be also discussed, including thermal shock and accelerated temperature cycling, etc.","PeriodicalId":182576,"journal":{"name":"2012 14th International Conference on Electronic Materials and Packaging (EMAP)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122167269","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"High-speed, low-power device trend and low-k layer delamination","authors":"H. Nakajima","doi":"10.1109/EMAP.2012.6507856","DOIUrl":"https://doi.org/10.1109/EMAP.2012.6507856","url":null,"abstract":"Flipchip is one of the key technologies that offer lower parasitic impedance and better power delivery to compensate reducing margins between power and threshold voltages with. The roadmap of core voltage is shown in Fig. 1 cited from the Japan Jisso Technology Roadmap (JJTR 2011, [1]). Requirements and trends of electronic systems are surveyed every other year in Japan and broken down to the parameters by JJTR Committee of Japan Electronics and Information Technology Industries Association (JEITA). The introduction of fragile low-k layers and lead-free solder bumps with higher Young's modulus into a die has made chip-package interaction critical. Delamination of low-k layer on a flipchip die can be seen as white spots (white bumps) in the image of scanning acoustic tomography (SAT). This paper introduces the countermeasures against white bumps during flipchip bonding and reflowing process.","PeriodicalId":182576,"journal":{"name":"2012 14th International Conference on Electronic Materials and Packaging (EMAP)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126378184","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Carbon nanotubes based composites with high dielectric constant and low loss","authors":"I. Madni, Shuhui Yu, Rong Sun","doi":"10.1109/EMAP.2012.6507868","DOIUrl":"https://doi.org/10.1109/EMAP.2012.6507868","url":null,"abstract":"Recently, an extraordinary increase has been found in dielectric constant of the composites containing electrical conducting granules. Multiwalled carbon nanotubes (MWNTs) are selected as the conducting filler due to their large aspect ratio and unique physical properties, in particular electrical and mechanical. In this research, the dielectric properties of the functionalized multiwalled carbon nanotubes/BaTiO3/Polymer composites are studied. Ball-milling equipment was used to fabricate mechanically treated composite fillers which were composed of BaTiO3 nanoparticles and MWNTs. The hybrid films fabricated by incorporating these composite fillers in a Bismaleimidetriazine matrix had a high dielectric constant (Dk) above 50 and a significantly low loss, less than 0.02 at 10 Wt. % filler loading. However, the ratio of CNT to BaTiO3 was very low, i.e. 1∶10 MWNTs to BaTiO3 content. We studied the effect of various loading ratios of MWNTs to BaTiO3, which led to find out the percolation threshold in the hybrid film. Characteristics including material components, dielectric constant and loss, and topography at dielectric interfaces are compared. The effects of ball milling were investigated. The experimental results suggest that the dielectric properties of the hybrid films containing MWNT/BaTiO3 as fillers can be improved significantly by tailoring the ratio of CNT to BaTiO3 and refining the ball-milling process. This novel hybrid film composed of the composite filler and Bismaleimide-triazine (BT resin) matrix can be used as embedded capacitor material.","PeriodicalId":182576,"journal":{"name":"2012 14th International Conference on Electronic Materials and Packaging (EMAP)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130013420","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}