2012 14th International Conference on Electronic Materials and Packaging (EMAP)最新文献

{"title":"Effects of molding compounds on warpage and damage of PBGA after post mold cure","authors":"T. M. Lam, S. Yi","doi":"10.1109/EMAP.2012.6507877","DOIUrl":"https://doi.org/10.1109/EMAP.2012.6507877","url":null,"abstract":"In the present study, governing damage mechanisms after post mold cure (PMC) for plastic ball grid array (PBGA) packages have been evaluated by a three-dimensional (3-D) thermo-viscoelastic finite element method. The parametric studies for the PBGA package with various molding compounds have been performed. A wide range of the modulus (1MPa∼15GPa) and the coefficient of thermal expansion (CTE) (10ppm∼300ppm) is evaluated to see feasibility of a new class of material set in the molding compound. Effects of thermo-mechanical properties of selected molding compound on the warpage and residual stress of the PBGA package are analyzed. Classification of modes of deformation in the BGA package with material sets will shed light on novel material development for better reliability. In addition, the optimum thermo-mechanical properties of molding compounds will be selected based on the parametric studies.","PeriodicalId":182576,"journal":{"name":"2012 14th International Conference on Electronic Materials and Packaging (EMAP)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117029977","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Localized heating and bond formation at solder/Cu interface induced by ultrasonic friction","authors":"Zhuolin Li, Mingyu Li, Jongmyung Kim, Hongbae Kim","doi":"10.1109/EMAP.2012.6507863","DOIUrl":"https://doi.org/10.1109/EMAP.2012.6507863","url":null,"abstract":"The intense generation of frictional heat in fast rubbing process can locally melt contacting solids and join materials. This letter decribes a localized heating and soldering at solder/Cu interface induced by ultrasonic friction. Through probing the mean surface temperature of sliding solder bump, the transient nature of frictional heat generation can be deduced, which is associated with the interfacial thermo-mechanical interaction during ultrasonic slip. A thin molten solder film forms at the frictional interface and reacts with the Cu top surface metallization (TSM) pad, producing nano-scale Cu6Sn5 intermetallic compounds (IMCs), with some tiny Ag3Sn particles attaching on them. The effects of ultrasonic sound on the interfacial reaction of IMCs were investigated, and the shear strengths of ultrasonic-soldered joints with different bonding times were also characterized.","PeriodicalId":182576,"journal":{"name":"2012 14th International Conference on Electronic Materials and Packaging (EMAP)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115149631","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Fabrication of one-dimensional CuO nanocrystals via pulsed wire explosion: structural, optical and electronic characterizations","authors":"S. Krishnan, A. Haseeb, M. Rafie","doi":"10.1109/EMAP.2012.6507925","DOIUrl":"https://doi.org/10.1109/EMAP.2012.6507925","url":null,"abstract":"One-dimensional nanocrystal is gaining popularity for its potential advantages in electronic, photonic, optoelectric and nanoelectronic devices. In this regard, metal oxide nanocrystals like CuO, ZnO, CdO and TiO2 are gaining research interest for their unique semiconducting characteristics. Specifically, narrow band-gap CuO nanomaterial is being studied extensively for its field emission, catalytic and photovoltaic properties. Recently shape controlled CuO nanocrystal gaining research interest for nanoscale field effect transistor (FET) device fabrication. This material is also being studied as essential element in several high-Tc superconductors and gas sensor. The surfaces of CuO are highly sensitive that when react with gases or solutions it becomes a catalyst or a gas sensor. The ability to control the shape and morphology strongly influences the overall electrochemical and physical properties of a nanostructure. We report the fabrication of shape controlled one-dimensional copper oxide (CuO) nanocrystals using a novel pulsed wire explosion method in liquid medium. This one-dimensional nanocrystal was made in an attempt to fabricate nanoscale FET device for electronic applications. Needle-like highly crystalline CuO nanocrystals were successfully produced in de-ionized (DI) water at 35°C, 65°C and 95°C. This method uses compressed pulsed power for the explosion hence reduces energy consumption and does not produce process by products. The chemical nature and physical structure of the nanocrystals were controlled by simply modulating the exploding medium temperature. The results showed that nanocrystals produced at 95°C are pure CuO with optical band-gap energy of 2.38eV as determined from the UV absorbance spectrum. X-ray photoelectron spectroscopy (XPS) characterization indicates the formation of high purity CuO nanocrystals and the electronic states of the nanocrystals were identified. This study also will provide a mean by which a most energy efficient and eco-friendly synthesis of one-dimensional CuO nanocrystals can be realized.","PeriodicalId":182576,"journal":{"name":"2012 14th International Conference on Electronic Materials and Packaging (EMAP)","volume":"15 7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133307124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}