成型化合物对PBGA模后固化翘曲和损伤的影响

2012 14th International Conference on Electronic Materials and Packaging (EMAP) Pub Date : 2012-12-01 DOI:10.1109/EMAP.2012.6507877

T. M. Lam, S. Yi

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引用次数: 0

摘要

在本研究中，采用三维热粘弹性有限元法对塑料球网格阵列(PBGA)封装模后固化(PMC)后的控制损伤机制进行了评估。对不同成型材料的PBGA封装进行了参数化研究。评估了大范围的模量(1MPa ~ 15GPa)和热膨胀系数(CTE) (10ppm ~ 300ppm)，以确定在成型化合物中设置新一类材料的可行性。分析了所选成型材料的热力学性能对PBGA封装翘曲和残余应力的影响。BGA封装中变形模式的分类与材料集将有助于新材料的开发，以提高可靠性。此外，在参数化研究的基础上，选择成型化合物的最佳热机械性能。

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Effects of molding compounds on warpage and damage of PBGA after post mold cure

In the present study, governing damage mechanisms after post mold cure (PMC) for plastic ball grid array (PBGA) packages have been evaluated by a three-dimensional (3-D) thermo-viscoelastic finite element method. The parametric studies for the PBGA package with various molding compounds have been performed. A wide range of the modulus (1MPa∼15GPa) and the coefficient of thermal expansion (CTE) (10ppm∼300ppm) is evaluated to see feasibility of a new class of material set in the molding compound. Effects of thermo-mechanical properties of selected molding compound on the warpage and residual stress of the PBGA package are analyzed. Classification of modes of deformation in the BGA package with material sets will shed light on novel material development for better reliability. In addition, the optimum thermo-mechanical properties of molding compounds will be selected based on the parametric studies.

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2012 14th International Conference on Electronic Materials and Packaging (EMAP)

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