超声摩擦诱导焊料/Cu界面局部加热及键合形成

2012 14th International Conference on Electronic Materials and Packaging (EMAP) Pub Date : 2012-12-01 DOI:10.1109/EMAP.2012.6507863

Zhuolin Li, Mingyu Li, Jongmyung Kim, Hongbae Kim

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引用次数: 0

摘要

快速摩擦过程中产生的强烈摩擦热可以使接触固体局部熔化，使材料结合。这封信描述了超声波摩擦引起的焊料/Cu界面局部加热和焊接。通过对滑动焊点平均表面温度的探测，可以推导出摩擦热产生的瞬态性质，这与超声滑移过程中界面热-力相互作用有关。在摩擦界面处形成一层薄薄的熔融焊料膜，并与Cu顶部表面金属化(TSM)衬垫反应，生成纳米级Cu6Sn5金属间化合物(IMCs)，并附着一些微小的Ag3Sn颗粒。研究了超声波对IMCs界面反应的影响，并对不同连接时间超声焊接接头的抗剪强度进行了表征。

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Localized heating and bond formation at solder/Cu interface induced by ultrasonic friction

The intense generation of frictional heat in fast rubbing process can locally melt contacting solids and join materials. This letter decribes a localized heating and soldering at solder/Cu interface induced by ultrasonic friction. Through probing the mean surface temperature of sliding solder bump, the transient nature of frictional heat generation can be deduced, which is associated with the interfacial thermo-mechanical interaction during ultrasonic slip. A thin molten solder film forms at the frictional interface and reacts with the Cu top surface metallization (TSM) pad, producing nano-scale Cu6Sn5 intermetallic compounds (IMCs), with some tiny Ag3Sn particles attaching on them. The effects of ultrasonic sound on the interfacial reaction of IMCs were investigated, and the shear strengths of ultrasonic-soldered joints with different bonding times were also characterized.

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2012 14th International Conference on Electronic Materials and Packaging (EMAP)

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