高随机振动应用PBGA封装的可行性

Yeong-Kook Kim, Do Soon Hwang, Jae Hyuk Lim
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引用次数: 2

摘要

研究了塑料球栅阵列在随机振动和热载荷作用下的焊点可靠性。将芯片组装在菊花链电路板上制备测试样品,并对部分样品进行下填充处理,研究下填充对焊点失效的影响。随机振动的两个后续步骤,称为合格和验收水平,由气动激振器应用。各台阶功率谱密度的总体控制均方根分别为22.7 Grms和32 Grms。然后对样品进行热循环试验。结果发现,在测试要求期间,样品没有任何焊料损坏,证明了潜在航空电子和空间应用的封装结构的稳健性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Feasibility of PBGA packaging for high random vibration applications
In this study, the solder joint reliability of plastic ball grid array under harsh random vibration and thermal loadings was investigated. The chips were assembled on the daisy chained circuit boards for the test samples preparation, and part of the samples was processed for underfill to investigate the underfill effects on the solder failures. Two consequential steps of the random vibrations, named as the qualification and acceptance levels, were applied by pneumatic shaker. Overall controlled RMS of the power spectrum densities of the steps were 22.7 Grms and 32 Grms, respectively. Then the samples were undergone to thermal cycling tests. It was found that the samples survived without any solder failure during the test requirements, demonstrating the robustness of the packaging structure for potential avionics and space applications.
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