添加元素对SnBi钎料拉伸、蠕变和低周疲劳强度的影响

2012 14th International Conference on Electronic Materials and Packaging (EMAP) Pub Date : 2012-12-01 DOI:10.1109/EMAP.2012.6507858

S. Nakano, M. Sakane, H. Hokazono, M. Yamashita

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引用次数: 5

摘要

研究了三种SnBi无铅钎料的拉伸性能、蠕变性能和低周疲劳性能。利用三种焊料的微型试样进行了拉伸、蠕变和低周疲劳试验。讨论了添加元素对拉伸、蠕变和疲劳性能的影响。三种焊料的抗拉强度基本相同，均在55MPa左右，拉伸延展性均在70%左右。在313K、353K和373K下，Sn57.5Bi0.5AgCuNiGe钎料的蠕变断裂寿命是Sn58Bi和Sn57.5Bi0.5Ag钎料的1.5 ~ 2倍。三种焊料在313K时表现出几乎相同的低周疲劳强度。讨论了这些力学性能与微观组织的关系。

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Effect of additive elements on tensile, creep and low cycle fatigue strength for SnBi solders

This paper presents tensile, creep and low cycle fatigue properties of three kinds of SnBi lead-free solders. Tensile, creep and low cycle fatigue tests were performed using miniature specimens of the three solders. The effects of additive elements on tensile, creep and fatigue properties were discussed. Three kinds of solders showed almost the same tensile strength of around 55MPa and the same tensile ductility of about 70%. The creep rupture lifetimes of Sn57.5Bi0.5AgCuNiGe were about 1.5 – 2 times longer than those of Sn58Bi and Sn57.5Bi0.5Ag solders at 313K, 353K and 373K. The three kinds of solders showed almost the same low cycle fatigue strength at 313K. These mechanical properties were discussed in relation with the microstructure.

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2012 14th International Conference on Electronic Materials and Packaging (EMAP)

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