显微组织对焊点热疲劳寿命预测的影响

2012 14th International Conference on Electronic Materials and Packaging (EMAP) Pub Date : 2012-12-01 DOI:10.1109/EMAP.2012.6507879

Hiue Tran, Yin Fun Chua, S. Yi, P. Geng

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引用次数: 0

摘要

在本研究中，采用有限元方法评估了热循环条件下焊点的显微组织对其疲劳寿命的影响。为了提高可靠性预测的准确性，采用了统一的塑料球栅阵列封装焊点粘塑性本构模型。然后将本构模型应用于商用有限元分析软件ABAQUS中，以预测PBGA封装中焊球在热循环下的热力学行为。从有限元分析结果中获得损伤参数，并用于估计焊球的热疲劳寿命。采用Coffin-Manson方程。对预测的热疲劳寿命进行了详细的讨论。

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Effects of microstructure on thermal fatigue life prediction of solder joints

In the present study, effects of microstructure on the fatigue life of solder joints under thermal cycling conditions are evaluated using the finite element method. A unified, viscoplastic constitutive model for solder joints of plastic ball grid array packages is employed to improve accuracy of reliability prediction. The constitutive model is then implemented into the commercial finite element analysis software, ABAQUS, to predict the thermo-mechanical behavior of solder balls in PBGA package subjected to thermal cycling. Damage parameters are obtained from the FEA results and are used to estimate the thermal fatigue life of solder balls. The Coffin-Manson equation is employed. The predicted thermal fatigue lives are discussed in detail.

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2012 14th International Conference on Electronic Materials and Packaging (EMAP)

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