Packaging of Electronic and Photonic Devices最新文献_第3页

Cooling of a PWB With Irregular Populated Chips 带不规则填充芯片的PWB的冷却

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2276

Yiwu Ding, D. Agonafer, Elliot Short

引用次数: 0

Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint 实验验证了球栅阵列焊点振动疲劳寿命预测模型

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2252

T. E. Wong, F. Palmieri, L. Kachatorian

{"title":"Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint","authors":"T. E. Wong, F. Palmieri, L. Kachatorian","doi":"10.1115/imece2000-2252","DOIUrl":"https://doi.org/10.1115/imece2000-2252","url":null,"abstract":"\u0000 A newly developed methodology is used to support test validation of ball grid array (BGA) solder joint vibration fatigue life prediction model. This model is evolved from an empirical formula of universal slopes, which is derived from high-cycle fatigue test data using a curve fitting technique over 29 different materials of metals.\u0000 To develop the BGA solder joint vibration fatigue life prediction model, a test vehicles (TV), on which various sizes of BGA daisy-chained packages are soldered, is first designed, fabricated and subjected to random vibration tests with continuously monitoring the solder joint integrity. Based on the measurement results, a destructive physical analysis is then conducted to further verify the failure locations and crack paths of the solder joints. Next, a method to determine the stresses/strains of BGA solder joints resulting from exposure of the TV to random vibration environments is developed. In this method, a 3-D modeling technique is used to simulate the vibration responses of the BGA packages. Linear static and dynamic finite element analyses with MSC/NASTRAN™ computer code, combined with a volume-weighted average technique, are conducted to calculate the effective strains of the solder joints. In the calculation process, several in-house developed Fortran programs, in conjunction with the outputs obtained from MSC/NASTRAN™ static and frequency response analyses, are used to perform the required computations. Finally, a vibration fatigue life model is established with two unknown parameters, which can be determined by correlating the derived solder effective strains to the test data. This test-calibrated model is then recommended to serve as an effective tool to determine the integrity of the BGA solder joints during vibration. Selecting more study cases with various package sizes, solder ball configurations, vibration profiles to further calibrate this model is also recommended. An example of a 313-pin plastic and 304-pin ceramic BGAs is illustrated in the present study.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129556054","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Analysis of the Interaction Between Thin-Film Fluid Hydrodynamics and Wire Vibration in Wafer Manufacturing Using Wiresaw 线锯制圆过程中薄膜流体力学与线材振动的相互作用分析

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2269

Liqun Zhu, M. Bhagavat, I. Kao

{"title":"Analysis of the Interaction Between Thin-Film Fluid Hydrodynamics and Wire Vibration in Wafer Manufacturing Using Wiresaw","authors":"Liqun Zhu, M. Bhagavat, I. Kao","doi":"10.1115/imece2000-2269","DOIUrl":"https://doi.org/10.1115/imece2000-2269","url":null,"abstract":"\u0000 In free abrasive wafer slicing process (FAM) using wiresaw, hydrodynamic pressure exerted by the thin slurry film is crucial to the process of cutting and material removal from substrate surface. It affects the process quality by introducing viscous damping effect to the transverse motion of the wire. The pressure distribution in the slurry film is subjected to the interaction of multi-physical phenomena induced in the wire-saw cutting process, including the axially moving wire transverse vibration under high tension (20N to 35N), as well as the hydrodynamic lubrication behavior of the thin slurry film. In this paper, the interaction between thin-film hydrodynamics and wire vibration is modeled using the coupling of basic Reynold’s equation for fluid lubrication and the dynamic equation describing the transverse vibration of the translating wire. The time-variant hydrodynamic pressure field is used to obtain the dynamic damping force exerted on the wire by the thin slurry film. A computational model is constructed and typical parametric studies are conducted based on the simulation results. Numerical scheme of semi-discretization is carried out to simulate the dynamic multi-disciplinary model. Galerkin method of weighted residual is used to carry out the spatial finite element discretization of the governing non-linear partial differential equations of the system with certain boundary conditions. In addition, Newmark method is applied to perform the time integration of the semi-discretized computational model from initial conditions. The direct numerical simulation dynamically yields the profile of the slurry hydrodynamic pressure distribution and the wire vibration response as functions of process parameters, such as the static film thickness of the slurry flow, wire translating speed and wire tension. From the simulation results, it is shown that the presence of the slurry film in the wiresaw process is important in eliminating the undesirable vibration modes and reducing the amplitude of wire vibration.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129831668","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermal Cycling Guidelines for Automotive, Computer, Portable, and Implantable Medical Device Applications 汽车，计算机，便携式和植入式医疗设备应用的热循环指南

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2246

R. Raghunathan, R. Pucha, S. Sitaraman

引用次数: 2

Stress Analysis of Wiresaw Slicing Piezoelectric Materials 线锯切片压电材料的应力分析

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2270

Fuqian Yang

引用次数: 0

Interfacial Delamination Propagation in Multi-Layered High-Density Wiring Electronic Packaging Structures 多层高密度布线电子封装结构中的界面分层传播

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2251

Hurang Hu, W. Xie, S. Sitaraman

{"title":"Interfacial Delamination Propagation in Multi-Layered High-Density Wiring Electronic Packaging Structures","authors":"Hurang Hu, W. Xie, S. Sitaraman","doi":"10.1115/imece2000-2251","DOIUrl":"https://doi.org/10.1115/imece2000-2251","url":null,"abstract":"\u0000 One of the most common failure modes in multi-layered electronic packaging structures is interfacial delamination. The objective of this research is to examine the possibilities of interfacial delamination in a next-generation electronic packaging structure under thermal loading. A sophisticated analytical model has been developed to determine energy release rate and stress intensity factor for delamination propagation. The model takes into consideration the temperature-dependent material properties as well as direction-dependent material properties. Although delamination between two adjacent layers is studied, the model takes into consideration the effect of all dielectric, metallization, and substrate layers in the multi-layered structure.\u0000 Assuming that an initial delamination exists between the base layer and the Copper metallization layer, the present work studies the propagation of delamination. In the analytical model, the base layer is modeled as an orthotropic thermo-elastic material. Copper and the polymer dielectric materials are modeled as isotropic thermo-elastic material. For the Copper/base layer interface, the variation of bimaterial constant (ε) with temperature is obtained through the analytical model. The effect of some key parameters, such as materials Young’s modulus, coefficient of thermal expansion, and the base layer thickness on energy release rate is presented. Design recommendations for improved thermo-mechanical reliability are proposed.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124409404","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Mathematical Model for Thermostatic Expansion Valve 恒温膨胀阀的数学模型

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2275

Yiwu Ding, D. Agonafer, R. Schmidt

引用次数: 1

Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling 热循环对铅锡焊料蠕变疲劳损伤的微观力学研究

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2260

P. Sharma, A. Dasgupta

引用次数: 0

Thermal Aging Effect on the Ball Shear Strength of Pb-Free Solders on a Ceramic Substrate With Pd/Ag Surface Metallization 热时效对Pd/Ag表面金属化陶瓷基体上无铅钎料球抗剪强度的影响

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2259

Xingjia Huang, S. Lee, Wan Sze Tse

引用次数: 0

Wafer Level Underfill Processing 晶圆级底填处理

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2247

L. Nguyen, C. Quentin, Phuong Nguyen

{"title":"Wafer Level Underfill Processing","authors":"L. Nguyen, C. Quentin, Phuong Nguyen","doi":"10.1115/imece2000-2247","DOIUrl":"https://doi.org/10.1115/imece2000-2247","url":null,"abstract":"\u0000 Underfill materials play a major role in the reliability of flip chip packages. These adhesives have been the subject of much research and development in the last few years, and much improvement in material performance has been obtained. However, the assembly method still remains unchanged, with the underfill being dispensed at the individual die level after flip chip reflow. Even with the arrival of “no-flow” underfills, assembly still requires depositing the underfill material onto the flip chip site prior to positioning the flip chip die. Processing underfill at the wafer level brings in a new paradigm shift to the area of flip chip packaging. Precoating the wafer with the underfill will create significant savings in both time and money. The application cycle time of the wafer level process becomes equivalent to a single dispensing operation for all the good dies on the wafer.\u0000 This paper will present results obtained with screen printing used as the application method for the wafer level process. An experimental underfill was printed onto un-bumped silicon wafers and cured, and the resultant films were analyzed. Process conditions affecting film thickness and surface roughness were evaluated. Preliminary results with bumped wafers are also discussed.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"7 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123722349","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0