Packaging of Electronic and Photonic Devices最新文献_第4页

A Review of Electrically Conductive Adhesive Technology for Use in Surface-Mount Microelectronics 表面贴装微电子用导电胶粘剂技术综述

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2263

A. Rafanelli

{"title":"A Review of Electrically Conductive Adhesive Technology for Use in Surface-Mount Microelectronics","authors":"A. Rafanelli","doi":"10.1115/imece2000-2263","DOIUrl":"https://doi.org/10.1115/imece2000-2263","url":null,"abstract":"\u0000 Interest in alternatives to lead solders continues to increase due to several initiatives addressing the reduction of lead usage and subsequent exposure to the environment. Alternative materials can be categorized into two main groups: electrically conductive adhesives (polymers) and non-lead solders. Over the past ten years, many non-leaded solders have been developed and introduced to the electronics industry. Despite some success regarding processability, several issues still exist regarding use of these materials as “drop-in” replacements for traditional leaded solders, e.g. eutectic tin-lead. This paper provides an overview of the second alternate material group, i.e. electrically conductive adhesives. An attempt is made to compare characteristics of these materials to the tin-lead benchmark. A summary of key material properties is also included. Finally, a position is presented regarding the approaches taken in evaluating these materials as suitable substitutes for tin-lead eutectic solder. Focus is on applications in surface mount technology (SMT) interconnection since solder is the primary bonding medium for interconnection. In general, these materials are acceptable for most applications. Applications under harsh service and environmental conditions, however, would require evaluation on a case-by-case basis.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127150661","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Experimental Investigation of Pressure and Velocity on Chemical Mechanical Planarization 化学机械刨平压力和速度的实验研究

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2267

J. Tsai, M. Tsai

引用次数: 0

Thermomechanical Durability of High I/O BGA Packages 高I/O BGA封装的热机械耐久性

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/1.1477192

P. Davuluri, S. Shetty, A. Dasgupta, S. Young

{"title":"Thermomechanical Durability of High I/O BGA Packages","authors":"P. Davuluri, S. Shetty, A. Dasgupta, S. Young","doi":"10.1115/1.1477192","DOIUrl":"https://doi.org/10.1115/1.1477192","url":null,"abstract":"\u0000 Efficient modeling strategies are developed to study thermomechanical durability of high I/O Ball Grid Array (BGA) packages, in order to facilitate virtual qualification and accelerated testing of component designs. A viscoplastic stress analysis technique is developed where the critical solder joint(s) (joint(s) at which failure first occurs) are modeled in detail with a multi-domain Rayleigh-Ritz (MDRR) methodology (Ling and Dasgupta, 1996; Ling and Dasgupta 1997; Ling 1997; and Rassian and Lee, 1998) while the load-sharing offered by non-critical joints is modeled with a simplified compact model. This hybrid technique is used to study the behavior of solder interconnects in selected Ball Grid Array (BGA) package under thermal cycling environments. Parametric studies are conducted to determine the optimal scheme for allocating a critical number of solder joints to the MDRR model, and the remaining non-critical joints to the compact models. Damage calculations are made with the Energy Partitioning Solder Durability model (Dasgupta et al., 1992) and cycles-to-failure predictions are compared with both finite element model predictions as well as experimental failure data provided by CALCE EPSC sponsors. Parametric studies on change in solder joint durability with interconnect volume are also discussed in this paper.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"23 47","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120836125","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Cooling Technique for Outdoor Electronic Enclosures Using Phase Change Materials 采用相变材料的室外电子外壳冷却技术

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2271

H. Hadim, I. Mehmedagic

{"title":"Cooling Technique for Outdoor Electronic Enclosures Using Phase Change Materials","authors":"H. Hadim, I. Mehmedagic","doi":"10.1115/imece2000-2271","DOIUrl":"https://doi.org/10.1115/imece2000-2271","url":null,"abstract":"\u0000 A theoretical study is conducted to investigate a new cooling technique for thermal management of outdoor telecommunication equipment enclosures. The technique consists of using a phase change material (PCM) combined with a heat sink to dissipate the heat to the ambient. The main advantages of using the PCM include: fully passive technique with no maintenance, no power is required, and relatively low cost. The use of the PCM for more effective thermal management of electronic enclosures is investigated for both the high end cooling (i.e. when the enclosure is exposed to high ambient temperatures) and the low end cooling (i.e. when the enclosure is exposed to very low ambient temperatures). The results from this preliminary theoretical study showed that with the use of a moderate amount of a properly selected PCM combined with the heat sink, the temperature within the enclosure can be maintained within the specified operating range. Potential applications with the use of the PCM include: peak load usage (e.g. during high communications traffic periods), extreme ambient conditions, reduced temperature fluctuations (to improve reliability), and more efficient implementation in smaller size enclosures.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"132 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129233656","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Length Scale and Aging Effect on the Mechanical Properties of a 63Sn-37Pb Solder Alloy 长度尺度和时效对63Sn-37Pb钎料合金力学性能的影响

Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2264

Jesse T. Lim, T. Lu

引用次数: 3

Damage Mechanics Based Fatigue Life Prediction for 63Sn-37Pb Solder Material 基于损伤力学的63Sn-37Pb钎料疲劳寿命预测

Packaging of Electronic and Photonic Devices Pub Date : 2000-07-27 DOI: 10.1115/imece2000-2258

Y. Wei, M. Neilsen, H. E. Fang

引用次数: 5