{"title":"基于损伤力学的63Sn-37Pb钎料疲劳寿命预测","authors":"Y. Wei, M. Neilsen, H. E. Fang","doi":"10.1115/imece2000-2258","DOIUrl":null,"url":null,"abstract":"\n This paper presents a method of TMF analysis based on the theory of damage mechanics to examine the fatigue damage accumulation in 63Sn-37Pb solder. The method is developed by extending a viscoplastic damage model proposed earlier by the authors (Wei, et al 1999, 2000). A computer simulation is carried out to calculate hysteresis loops at three different strain ranges. The damage-coupled fatigue damage model is applied to predict the cyclic softening behavior of the material and the prediction is found to agree well with the experiment. With a proposed failure criterion based on the concept of damage accumulation, the TMF model is also found to predict successfully the fatigue life of 63Sn-37Pb solder.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"88 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Damage Mechanics Based Fatigue Life Prediction for 63Sn-37Pb Solder Material\",\"authors\":\"Y. Wei, M. Neilsen, H. E. Fang\",\"doi\":\"10.1115/imece2000-2258\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n This paper presents a method of TMF analysis based on the theory of damage mechanics to examine the fatigue damage accumulation in 63Sn-37Pb solder. The method is developed by extending a viscoplastic damage model proposed earlier by the authors (Wei, et al 1999, 2000). A computer simulation is carried out to calculate hysteresis loops at three different strain ranges. The damage-coupled fatigue damage model is applied to predict the cyclic softening behavior of the material and the prediction is found to agree well with the experiment. With a proposed failure criterion based on the concept of damage accumulation, the TMF model is also found to predict successfully the fatigue life of 63Sn-37Pb solder.\",\"PeriodicalId\":179094,\"journal\":{\"name\":\"Packaging of Electronic and Photonic Devices\",\"volume\":\"88 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-07-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Packaging of Electronic and Photonic Devices\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/imece2000-2258\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Packaging of Electronic and Photonic Devices","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/imece2000-2258","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
摘要
本文提出了一种基于损伤力学理论的TMF分析方法来研究63Sn-37Pb焊料的疲劳损伤积累。该方法是通过扩展作者早先提出的粘塑性损伤模型而发展起来的(Wei, et al . 1999,2000)。通过计算机模拟计算了三种不同应变范围下的磁滞回线。采用损伤耦合疲劳损伤模型对材料的循环软化行为进行了预测，与实验结果吻合较好。采用基于损伤累积概念的失效准则，TMF模型成功地预测了63Sn-37Pb焊料的疲劳寿命。
Damage Mechanics Based Fatigue Life Prediction for 63Sn-37Pb Solder Material
This paper presents a method of TMF analysis based on the theory of damage mechanics to examine the fatigue damage accumulation in 63Sn-37Pb solder. The method is developed by extending a viscoplastic damage model proposed earlier by the authors (Wei, et al 1999, 2000). A computer simulation is carried out to calculate hysteresis loops at three different strain ranges. The damage-coupled fatigue damage model is applied to predict the cyclic softening behavior of the material and the prediction is found to agree well with the experiment. With a proposed failure criterion based on the concept of damage accumulation, the TMF model is also found to predict successfully the fatigue life of 63Sn-37Pb solder.
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