发布求助
文献互助 智能选刊 最新文献

Packaging of Electronic and Photonic Devices最新文献

筛选
英文 中文
Free Vibration Analysis for Thin Wire of Modern Wiresaw Between Sliced Wafers in Wafer Manufacturing Processes 圆片制造过程中现代线锯细线的自由振动分析
Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2266
S. Wei, I. Kao
{"title":"Free Vibration Analysis for Thin Wire of Modern Wiresaw Between Sliced Wafers in Wafer Manufacturing Processes","authors":"S. Wei, I. Kao","doi":"10.1115/imece2000-2266","DOIUrl":"https://doi.org/10.1115/imece2000-2266","url":null,"abstract":"\u0000 In wiresaw manufacturing process where thin wire moving at high speed is pushed onto ingot to produce slices of wafer, the wire is constrained by two wafer walls as it slices into the ingot. In this paper, we investigate the vibration of such wire under the constraints of wafer walls. To address this problem, the model for wire vibration with impact to wafer walls is developed. The equation of motion is discretized using the Galerkin’s method. The principle of impulse and momentum is utilized to solve the impact problem. The results of analysis and simulation indicate that the response under a pointwise sinusoidal excitation is neither periodical nor symmetric with respect to the horizontal axis, due to the excitation from the impact. The wire vibration behavior is affected dramatically by the wafer wall constraints.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115652700","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface 水分对下填充/阻焊界面附着力的影响
Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/1.1414133
T. P. Ferguson, J. Qu
{"title":"Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface","authors":"T. P. Ferguson, J. Qu","doi":"10.1115/1.1414133","DOIUrl":"https://doi.org/10.1115/1.1414133","url":null,"abstract":"\u0000 A primary concern in microelectronic packaging is the role of moisture induced failure mechanisms. Moisture is a multidimensional concern in packaging, having an adverse effect on package reliability by introducing corrosion, development of hygro-stresses, and deterioration of polymer interfaces within the package. In this paper the effect of moisture on the interfacial adhesion of two no flow underfill materials with a commercially available soldermask coated FR-4 board is experimentally determined. Bilayer specimens with prefabricated interface cracks are used in a four point bending test to quantify the interfacial fracture toughness. Two groups of test specimens of varying underfill thickness were constructed. The first group was fully dried while the other was moisture preconditioned at 85°C/85%RH for 725 hours. The results of this study show that the interfacial toughness is significantly affected by the presence of moisture.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"171 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115717991","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 39
Interfacial Versus Cohesive Failure on Underfill-Aluminum Interface: Effects of Interface Roughness 下填土-铝界面界面与内聚破坏:界面粗糙度的影响
Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2257
Q. Yao, J. Qu
{"title":"Interfacial Versus Cohesive Failure on Underfill-Aluminum Interface: Effects of Interface Roughness","authors":"Q. Yao, J. Qu","doi":"10.1115/imece2000-2257","DOIUrl":"https://doi.org/10.1115/imece2000-2257","url":null,"abstract":"\u0000 This paper is concerned with the interfacial adhesion and failure of underfill materials in flip-chip packages. Debonding of polymer-metal interfaces often involves both interfacial and cohesive failure. Since the cohesive strength of polymers is usually much greater than the polymer-metal interfacial strength, cohesive failure near the interface is usually desired to enhance the interfacial adhesion. Roughened surfaces generally produce more cohesive failure, therefore, are used commonly in practice to obtain better adhesion. In this paper a fracture mechanics model is developed that can be used to quantitatively predict the amount of cohesive failure once the surface roughness data are given. An epoxy/Al interface was investigated using this fracture mechanics model. The predicted amount of cohesive failure as a function of surface roughness compares very well with the experimentally measured values. It is believed that this model can be extended to other polymer – metal interfaces.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127127674","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Durability Properties Characterization of Sn62Pb36Ag2 Solder Alloy Sn62Pb36Ag2钎料合金的耐久性能表征
Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2261
P. Haswell, A. Dasgupta
{"title":"Durability Properties Characterization of Sn62Pb36Ag2 Solder Alloy","authors":"P. Haswell, A. Dasgupta","doi":"10.1115/imece2000-2261","DOIUrl":"https://doi.org/10.1115/imece2000-2261","url":null,"abstract":"\u0000 The cyclic durability properties of a near-eutectic Sn62Pb36Ag2 solder alloy are explored using a piezoelectric-actuated Thermo-Mechanical-Microstructural (TMM) test apparatus. The miniature test specimens are an Iosipescu-type shear configuration with a typical joint thickness of 180μm, so that significant length-scale effects are captured. Cyclic, total displacement-controlled tests are executed at room temperature and at various strain rates and amplitudes. A variety of failure models are employed to quantify the durability of this alloy, compared to the baseline Sn-Pb eutectic solder.\u0000 Power-law relationships between the number of cycles to failure and three damage metrics (total strain, inelastic strain and hysteresis energy) are established for the Sn62Pb36Ag2 solder alloy. There is good agreement between the results presented here and other data in the literature for the inelastic strain and hysteresis energy models. The parameters of the total strain-based damage model do not agree well with other published data. A discussion of these results is included, along with details of recent developments in the test method used here, as well as other future work.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127215942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects 水分对板上倒装芯片(FCOB)互连耐久性的影响
Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2256
J. Okura, A. Dasgupta, J. Caers
{"title":"Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects","authors":"J. Okura, A. Dasgupta, J. Caers","doi":"10.1115/imece2000-2256","DOIUrl":"https://doi.org/10.1115/imece2000-2256","url":null,"abstract":"The effect of constant temperature and humidity environments on the durability of interconnects in underfilled Flip-Chip-on-Board (FCOB) assemblies is investigated in this study. Polymeric underfills, used to enhance thermomechanical durability of the interconnects, are found to create new failure modes due to hygromechanical swelling. Based on experimental observations, the failure mechanism is hypothesized to be cracking of intermetallics, which have weakened due to thermal aging. Pseudo 3-D finite element analyses are conducted to quantify the moisture absorption and diffusion through the polymeric underfill, and the resulting hygromechanical viscoplastic stress history. The simulations are combined with accelerated aging tests to assess in-service durability in hot, humid environments. Model predictions are compared with results of accelerated life tests available in the literature.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125421921","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate 一种新型倒装芯片焊点检测系统在FR-4基板芯片上的应用
Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2262
D. Erdahl, Sheng Liu, I. C. Ume
{"title":"Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate","authors":"D. Erdahl, Sheng Liu, I. C. Ume","doi":"10.1115/imece2000-2262","DOIUrl":"https://doi.org/10.1115/imece2000-2262","url":null,"abstract":"\u0000 Because the trend in electronic interconnection technology is toward the development of solder bump technologies, that include flip chips, chip scale packages, multi-chip modules (MCMs), and ball grid array (BGA) packages, solder bump inspection methods must be developed to allow rapid, accurate, and high resolution on-line inspection of joint quality. Although traditional methods can detect some manufacturing defects, they do not actually test the mechanical quality of the connection. A novel solder-joint inspection system has been developed based on laser ultrasound and interferometric techniques. A pulsed laser generates ultrasound on the chip’s surface and the whole chip is excited into vibration modes. An interferometer is used to measure the vibration displacement of the chip’s surface. Solder joints with different qualities cause different vibration responses, acting as constraints on the system. The system was used to inspect the quality of solder joints on a group of flip chips mounted on FR-4 substrates, and the results show the ability of the system to detect defects such as missing solder balls, cracked chips, and gross misalignment.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125663376","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints 晶圆级芯片封装(WLCSP)焊点热疲劳寿命预测新模型
Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/1.1462625
J. Lau, S. Pan, Chris Chang
{"title":"A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints","authors":"J. Lau, S. Pan, Chris Chang","doi":"10.1115/1.1462625","DOIUrl":"https://doi.org/10.1115/1.1462625","url":null,"abstract":"\u0000 A new empirical equation for predicting the thermal-fatigue life of wafer level chip scale package (WLCSP) solder joints on printed circuit board (PCB) is presented. The solder joints are subjected to thermal cycling and their crack lengths at different thermal cycles are measured. Also, the average strain energy density around the crack tip of different crack lengths in the corner solder joint is determined by a time-dependent nonlinear fracture mechanics with finite element method. The solder is assumed to be a temperature-dependent elastic-plastic and a time-dependent creep material.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121941149","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 45
Optimizing a Lithium Niobate Slicing Process Using ID Saw in Wafer Manufacturing 利用ID锯优化铌酸锂薄片加工工艺
Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2268
T. Fang, D. Jundt, J. Lambropoulos
{"title":"Optimizing a Lithium Niobate Slicing Process Using ID Saw in Wafer Manufacturing","authors":"T. Fang, D. Jundt, J. Lambropoulos","doi":"10.1115/imece2000-2268","DOIUrl":"https://doi.org/10.1115/imece2000-2268","url":null,"abstract":"\u0000 The paper summarizes a systematic study of the lithium niobate wafer slicing process using inner diameter (ID) diamond blade. The dynamometer is used for the measurement of cutting forces in ID slicing when changing various process parameters. Experimental observations regarding the radial and axial dressing effect, removal rate effect, and contact geometry effect are reported. The normal and tangential cutting forces under typical ID slicing conditions with fixed abrasive diamond blade correlate to the feed rate, geometrical contact length, and diamond sharpness. The axial cutting forces are related to blade deflections. An interpretation of slicing of lithium niobate in terms of a micromechanics model of material removal by inclined cracking along cleavage planes is presented.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132968051","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis of a Thermoelectric Cooler With Non-Uniform Heating 非均匀加热热电冷却器的分析
Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2273
M. Ellsworth, R. Simons
{"title":"Analysis of a Thermoelectric Cooler With Non-Uniform Heating","authors":"M. Ellsworth, R. Simons","doi":"10.1115/imece2000-2273","DOIUrl":"https://doi.org/10.1115/imece2000-2273","url":null,"abstract":"\u0000 This paper discusses a methodology for incorporating the behavior of a thermoelectric cooling module in a finite element model of an electronic chip module. A background discussion of thermoelectric cooling is provided followed by a discussion of algebraic solutions for either chip temperature or allowable power on a uniformly powered multi-chip module. The basis and method of implementing an integrated thermoelectric-conduction model in ANSYS is presented. Example calculations are presented and discussed for a thermoelectrically cooled non-uniformly powered MCM. A “quasi-superposition” approach combining results obtained by 1-D algebraic solutions with thermoelectric cooling, with ANSYS results without thermoelectric cooling is also discussed. This approach offers a means to estimate the chip temperatures on an MCM cooled by a thermoelectric module without the need to actually build a detailed and time consuming finite element model of the thermoelectric module.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114263476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Characterization of the Performance of Flat Heat Pipes for Electronics Cooling 电子冷却用平板热管的性能表征
Packaging of Electronic and Photonic Devices Pub Date : 2000-11-05 DOI: 10.1115/imece2000-2272
U. Vadakkan, S. Garimella, C. Sobhan
{"title":"Characterization of the Performance of Flat Heat Pipes for Electronics Cooling","authors":"U. Vadakkan, S. Garimella, C. Sobhan","doi":"10.1115/imece2000-2272","DOIUrl":"https://doi.org/10.1115/imece2000-2272","url":null,"abstract":"A computational model has been developed to analyze the transient and steady-state performance of flat heat pipes and assess their performance under different operating and geometric parameters, in order to arrive at optimal designs. The model assumes two-dimensional fields for flow and heat transfer and solves the governing differential equations using a finite-difference approach. The wick region of the heat pipe is analyzed using transport equations for a porous medium. The influence of axial heat conduction along the wall, as well as the energy transport in the wick, on the velocity and temperature distributions is examined. The overall performance of the heat pipe is quantified by calculating an effective thermal conductance from the heat input and the temperature drop along the heat pipe wall. Parametric studies are conducted using the model to investigate the dependence of the heat pipe performance on the heat input at the evaporator, the containing wall thickness, and the porosity of the wick.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132707126","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信