Optimizing a Lithium Niobate Slicing Process Using ID Saw in Wafer Manufacturing

Abstract

The paper summarizes a systematic study of the lithium niobate wafer slicing process using inner diameter (ID) diamond blade. The dynamometer is used for the measurement of cutting forces in ID slicing when changing various process parameters. Experimental observations regarding the radial and axial dressing effect, removal rate effect, and contact geometry effect are reported. The normal and tangential cutting forces under typical ID slicing conditions with fixed abrasive diamond blade correlate to the feed rate, geometrical contact length, and diamond sharpness. The axial cutting forces are related to blade deflections. An interpretation of slicing of lithium niobate in terms of a micromechanics model of material removal by inclined cracking along cleavage planes is presented.