Free Vibration Analysis for Thin Wire of Modern Wiresaw Between Sliced Wafers in Wafer Manufacturing Processes

In wiresaw manufacturing process where thin wire moving at high speed is pushed onto ingot to produce slices of wafer, the wire is constrained by two wafer walls as it slices into the ingot. In this paper, we investigate the vibration of such wire under the constraints of wafer walls. To address this problem, the model for wire vibration with impact to wafer walls is developed. The equation of motion is discretized using the Galerkin’s method. The principle of impulse and momentum is utilized to solve the impact problem. The results of analysis and simulation indicate that the response under a pointwise sinusoidal excitation is neither periodical nor symmetric with respect to the horizontal axis, due to the excitation from the impact. The wire vibration behavior is affected dramatically by the wafer wall constraints.