Damage Mechanics Based Fatigue Life Prediction for 63Sn-37Pb Solder Material

Abstract

This paper presents a method of TMF analysis based on the theory of damage mechanics to examine the fatigue damage accumulation in 63Sn-37Pb solder. The method is developed by extending a viscoplastic damage model proposed earlier by the authors (Wei, et al 1999, 2000). A computer simulation is carried out to calculate hysteresis loops at three different strain ranges. The damage-coupled fatigue damage model is applied to predict the cyclic softening behavior of the material and the prediction is found to agree well with the experiment. With a proposed failure criterion based on the concept of damage accumulation, the TMF model is also found to predict successfully the fatigue life of 63Sn-37Pb solder.