{"title":"热时效对Pd/Ag表面金属化陶瓷基体上无铅钎料球抗剪强度的影响","authors":"Xingjia Huang, S. Lee, Wan Sze Tse","doi":"10.1115/imece2000-2259","DOIUrl":null,"url":null,"abstract":"\n In the present study, solder balls of two Pb-free solder alloys, 95.5Sn-3.8Ag-0.7Cu and 91.8Sn-3.4Ag-4.8Bi, were reflowed on a ceramic substrate with the surface metallization of Pd/Ag. The specimens were subjected to thermal aging for 250 hours at the temperatures of 85°C, 125°C and 150°C, respectively. For comparison, specimens with 63Sn-37Pb solder were also fabricated and tested. Ball shear tests were performed to evaluate the effect of thermal aging on various solders. In general, the testing results indicated that the shear strength of solder balls decreased gradually with respect to the increase of thermal aging temperature. The shear strength of 95.5Sn-3.8Ag-0.7Cu solder balls was found to be least sensitive to the thermal aging. Besides, it was identified that the predominant failure mode in the ball shear tests was the fracture at the interface between the Pd/Ag metallization and the ceramic substrate.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"145 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal Aging Effect on the Ball Shear Strength of Pb-Free Solders on a Ceramic Substrate With Pd/Ag Surface Metallization\",\"authors\":\"Xingjia Huang, S. Lee, Wan Sze Tse\",\"doi\":\"10.1115/imece2000-2259\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n In the present study, solder balls of two Pb-free solder alloys, 95.5Sn-3.8Ag-0.7Cu and 91.8Sn-3.4Ag-4.8Bi, were reflowed on a ceramic substrate with the surface metallization of Pd/Ag. The specimens were subjected to thermal aging for 250 hours at the temperatures of 85°C, 125°C and 150°C, respectively. For comparison, specimens with 63Sn-37Pb solder were also fabricated and tested. Ball shear tests were performed to evaluate the effect of thermal aging on various solders. In general, the testing results indicated that the shear strength of solder balls decreased gradually with respect to the increase of thermal aging temperature. The shear strength of 95.5Sn-3.8Ag-0.7Cu solder balls was found to be least sensitive to the thermal aging. Besides, it was identified that the predominant failure mode in the ball shear tests was the fracture at the interface between the Pd/Ag metallization and the ceramic substrate.\",\"PeriodicalId\":179094,\"journal\":{\"name\":\"Packaging of Electronic and Photonic Devices\",\"volume\":\"145 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-11-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Packaging of Electronic and Photonic Devices\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/imece2000-2259\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Packaging of Electronic and Photonic Devices","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/imece2000-2259","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal Aging Effect on the Ball Shear Strength of Pb-Free Solders on a Ceramic Substrate With Pd/Ag Surface Metallization
In the present study, solder balls of two Pb-free solder alloys, 95.5Sn-3.8Ag-0.7Cu and 91.8Sn-3.4Ag-4.8Bi, were reflowed on a ceramic substrate with the surface metallization of Pd/Ag. The specimens were subjected to thermal aging for 250 hours at the temperatures of 85°C, 125°C and 150°C, respectively. For comparison, specimens with 63Sn-37Pb solder were also fabricated and tested. Ball shear tests were performed to evaluate the effect of thermal aging on various solders. In general, the testing results indicated that the shear strength of solder balls decreased gradually with respect to the increase of thermal aging temperature. The shear strength of 95.5Sn-3.8Ag-0.7Cu solder balls was found to be least sensitive to the thermal aging. Besides, it was identified that the predominant failure mode in the ball shear tests was the fracture at the interface between the Pd/Ag metallization and the ceramic substrate.
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